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Multilayer Optical Interconnections Integrated on a Printed Circuit Board

Nina Hendrickx (UGent) , Geert Van Steenberge (UGent) , Peter Geerinck (UGent) , Steven Van Put (UGent) , Erwin Bosman (UGent) and Peter Van Daele (UGent)
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MLA
Hendrickx, Nina, Geert Van Steenberge, Peter Geerinck, et al. “Multilayer Optical Interconnections Integrated on a Printed Circuit Board.” Proceedings 15th European Microelectronics and Packaging Conference. 2005. 329–333. Print.
APA
Hendrickx, Nina, Van Steenberge, G., Geerinck, P., Van Put, S., Bosman, E., & Van Daele, P. (2005). Multilayer Optical Interconnections Integrated on a Printed Circuit Board. Proceedings 15th European Microelectronics and Packaging Conference (pp. 329–333).
Chicago author-date
Hendrickx, Nina, Geert Van Steenberge, Peter Geerinck, Steven Van Put, Erwin Bosman, and Peter Van Daele. 2005. “Multilayer Optical Interconnections Integrated on a Printed Circuit Board.” In Proceedings 15th European Microelectronics and Packaging Conference, 329–333.
Chicago author-date (all authors)
Hendrickx, Nina, Geert Van Steenberge, Peter Geerinck, Steven Van Put, Erwin Bosman, and Peter Van Daele. 2005. “Multilayer Optical Interconnections Integrated on a Printed Circuit Board.” In Proceedings 15th European Microelectronics and Packaging Conference, 329–333.
Vancouver
1.
Hendrickx N, Van Steenberge G, Geerinck P, Van Put S, Bosman E, Van Daele P. Multilayer Optical Interconnections Integrated on a Printed Circuit Board. Proceedings 15th European Microelectronics and Packaging Conference. 2005. p. 329–33.
IEEE
[1]
N. Hendrickx, G. Van Steenberge, P. Geerinck, S. Van Put, E. Bosman, and P. Van Daele, “Multilayer Optical Interconnections Integrated on a Printed Circuit Board,” in Proceedings 15th European Microelectronics and Packaging Conference, 2005, pp. 329–333.
@inproceedings{315386,
  author       = {Hendrickx, Nina and Van Steenberge, Geert and Geerinck, Peter and Van Put, Steven and Bosman, Erwin and Van Daele, Peter},
  booktitle    = {Proceedings 15th European Microelectronics and Packaging Conference},
  pages        = {329--333},
  title        = {Multilayer Optical Interconnections Integrated on a Printed Circuit Board},
  year         = {2005},
}