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Electrochemical study of copper deposition on silicon surfaces in HF solution

I TEERLINCK, W GOMES, Katrien Strubbe UGent, P MERTENS and M HEYNS (1999) Electrochem. SOc. Proceedings. 99-9. p.156-159
Please use this url to cite or link to this publication:
author
organization
year
type
conference
publication status
published
subject
in
Electrochem. SOc. Proceedings
volume
99-9
pages
156-159 pages
UGent publication?
yes
classification
C1
id
314449
handle
http://hdl.handle.net/1854/LU-314449
date created
2005-06-14 08:24:00
date last changed
2018-01-29 12:12:34
@inproceedings{314449,
  author       = {TEERLINCK, I and GOMES, W and Strubbe, Katrien and MERTENS, P and HEYNS, M},
  booktitle    = {Electrochem. SOc. Proceedings},
  pages        = {156--159},
  title        = {Electrochemical study of copper deposition on silicon surfaces in HF solution},
  volume       = {99-9},
  year         = {1999},
}

Chicago
TEERLINCK, I, W GOMES, Katrien Strubbe, P MERTENS, and M HEYNS. 1999. “Electrochemical Study of Copper Deposition on Silicon Surfaces in HF Solution.” In Electrochem. SOc. Proceedings, 99-9:156–159.
APA
TEERLINCK, I., GOMES, W., Strubbe, K., MERTENS, P., & HEYNS, M. (1999). Electrochemical study of copper deposition on silicon surfaces in HF solution. Electrochem. SOc. Proceedings (Vol. 99–9, pp. 156–159).
Vancouver
1.
TEERLINCK I, GOMES W, Strubbe K, MERTENS P, HEYNS M. Electrochemical study of copper deposition on silicon surfaces in HF solution. Electrochem. SOc. Proceedings. 1999. p. 156–9.
MLA
TEERLINCK, I, W GOMES, Katrien Strubbe, et al. “Electrochemical Study of Copper Deposition on Silicon Surfaces in HF Solution.” Electrochem. SOc. Proceedings. Vol. 99–9. 1999. 156–159. Print.