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Electrochemical study of copper deposition on silicon surfaces in HF solution

(1999) Electrochem. SOc. Proceedings. 99-9. p.156-159
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Chicago
TEERLINCK, I, W GOMES, Katrien Strubbe, P MERTENS, and M HEYNS. 1999. “Electrochemical Study of Copper Deposition on Silicon Surfaces in HF Solution.” In Electrochem. SOc. Proceedings, 99-9:156–159.
APA
TEERLINCK, I., GOMES, W., Strubbe, K., MERTENS, P., & HEYNS, M. (1999). Electrochemical study of copper deposition on silicon surfaces in HF solution. Electrochem. SOc. Proceedings (Vol. 99–9, pp. 156–159).
Vancouver
1.
TEERLINCK I, GOMES W, Strubbe K, MERTENS P, HEYNS M. Electrochemical study of copper deposition on silicon surfaces in HF solution. Electrochem. SOc. Proceedings. 1999. p. 156–9.
MLA
TEERLINCK, I, W GOMES, Katrien Strubbe, et al. “Electrochemical Study of Copper Deposition on Silicon Surfaces in HF Solution.” Electrochem. SOc. Proceedings. Vol. 99–9. 1999. 156–159. Print.
@inproceedings{314449,
  author       = {TEERLINCK, I and GOMES, W and Strubbe, Katrien and MERTENS, P and HEYNS, M},
  booktitle    = {Electrochem. SOc. Proceedings},
  pages        = {156--159},
  title        = {Electrochemical study of copper deposition on silicon surfaces in HF solution},
  volume       = {99-9},
  year         = {1999},
}