Advanced search
1 file | 634.88 KB

Combining BCB with KOH: wet bulk micromachining versus wafer bonding

Author
Organization
Abstract
Bonding wafers prior to a wet etching step is a desirable yet complex process step. The use of the polymer BCB offers a low temperature alternative to direct or indirect bonding techniques. The tests presented in this paper show that bonded regions maintain their strength even for etched depths of 500 μm (8 hours in 35% KOH at 80°C), independently of the coating of the wafer. The tests also stress the importance of matching the thermal coefficients of the bonded wafers. This technique aims at the realization of a variable capacitor optimized for energy harvesting.
Keywords
wafer bonding, BCB, KOH

Downloads

  • (...).pdf
    • full text
    • |
    • UGent only
    • |
    • PDF
    • |
    • 634.88 KB

Citation

Please use this url to cite or link to this publication:

Chicago
Sterken, Tom, Paolo Fiorini, and Robert Puers. 2005. “Combining BCB with KOH: Wet Bulk Micromachining Versus Wafer Bonding.” In Micromachining, Micromechanics and Microsystems, 16th Workshop, Proceedings, 80–83.
APA
Sterken, T., Fiorini, P., & Puers, R. (2005). Combining BCB with KOH: wet bulk micromachining versus wafer bonding. Micromachining, Micromechanics and Microsystems, 16th Workshop, Proceedings (pp. 80–83). Presented at the 16th Workshop on Micromachining, Micromechanics and Microsystems (MME 2005).
Vancouver
1.
Sterken T, Fiorini P, Puers R. Combining BCB with KOH: wet bulk micromachining versus wafer bonding. Micromachining, Micromechanics and Microsystems, 16th Workshop, Proceedings. 2005. p. 80–3.
MLA
Sterken, Tom, Paolo Fiorini, and Robert Puers. “Combining BCB with KOH: Wet Bulk Micromachining Versus Wafer Bonding.” Micromachining, Micromechanics and Microsystems, 16th Workshop, Proceedings. 2005. 80–83. Print.
@inproceedings{3141099,
  abstract     = {Bonding wafers prior to a wet etching step is a desirable yet complex process step. The use of the polymer BCB offers a low temperature alternative to direct or indirect bonding techniques. The tests presented in this paper show that bonded regions maintain their strength even for etched depths of 500 \ensuremath{\mu}m (8 hours in 35\% KOH at 80{\textdegree}C), independently of the coating of the wafer. The tests also stress the importance of matching the thermal coefficients of the bonded wafers. This technique aims at the realization of a variable capacitor optimized for energy harvesting.},
  articleno    = {P-13},
  author       = {Sterken, Tom and Fiorini, Paolo and Puers, Robert},
  booktitle    = {Micromachining, Micromechanics and Microsystems, 16th Workshop, Proceedings},
  keyword      = {wafer bonding,BCB,KOH},
  language     = {eng},
  location     = {G{\"o}teborg, Sweden},
  pages        = {P-13:80--P-13:83},
  title        = {Combining BCB with KOH: wet bulk micromachining versus wafer bonding},
  year         = {2005},
}