Ghent University Academic Bibliography

Advanced

Combining BCB with KOH: wet bulk micromachining versus wafer bonding

Tom Sterken UGent, Paolo Fiorini and Robert Puers (2005) Micromachining, Micromechanics and Microsystems, 16th Workshop, Proceedings. p.80-83
abstract
Bonding wafers prior to a wet etching step is a desirable yet complex process step. The use of the polymer BCB offers a low temperature alternative to direct or indirect bonding techniques. The tests presented in this paper show that bonded regions maintain their strength even for etched depths of 500 μm (8 hours in 35% KOH at 80°C), independently of the coating of the wafer. The tests also stress the importance of matching the thermal coefficients of the bonded wafers. This technique aims at the realization of a variable capacitor optimized for energy harvesting.
Please use this url to cite or link to this publication:
author
organization
year
type
conference
publication status
published
subject
keyword
wafer bonding, BCB, KOH
in
Micromachining, Micromechanics and Microsystems, 16th Workshop, Proceedings
article number
P-13
pages
80 - 83
conference name
16th Workshop on Micromachining, Micromechanics and Microsystems (MME 2005)
conference location
Göteborg, Sweden
conference start
2005-09-04
conference end
2005-09-06
language
English
UGent publication?
no
classification
C1
copyright statement
I have transferred the copyright for this publication to the publisher
id
3141099
handle
http://hdl.handle.net/1854/LU-3141099
date created
2013-02-24 22:25:10
date last changed
2016-12-21 15:41:00
@inproceedings{3141099,
  abstract     = {Bonding wafers prior to a wet etching step is a desirable yet complex process step. The use of the polymer BCB offers a low temperature alternative to direct or indirect bonding techniques. The tests presented in this paper show that bonded regions maintain their strength even for etched depths of 500 \ensuremath{\mu}m (8 hours in 35\% KOH at 80{\textdegree}C), independently of the coating of the wafer. The tests also stress the importance of matching the thermal coefficients of the bonded wafers. This technique aims at the realization of a variable capacitor optimized for energy harvesting.},
  articleno    = {P-13},
  author       = {Sterken, Tom and Fiorini, Paolo and Puers, Robert},
  booktitle    = {Micromachining, Micromechanics and Microsystems, 16th Workshop, Proceedings},
  keyword      = {wafer bonding,BCB,KOH},
  language     = {eng},
  location     = {G{\"o}teborg, Sweden},
  pages        = {P-13:80--P-13:83},
  title        = {Combining BCB with KOH: wet bulk micromachining versus wafer bonding},
  year         = {2005},
}

Chicago
Sterken, Tom, Paolo Fiorini, and Robert Puers. 2005. “Combining BCB with KOH: Wet Bulk Micromachining Versus Wafer Bonding.” In Micromachining, Micromechanics and Microsystems, 16th Workshop, Proceedings, 80–83.
APA
Sterken, T., Fiorini, P., & Puers, R. (2005). Combining BCB with KOH: wet bulk micromachining versus wafer bonding. Micromachining, Micromechanics and Microsystems, 16th Workshop, Proceedings (pp. 80–83). Presented at the 16th Workshop on Micromachining, Micromechanics and Microsystems (MME 2005).
Vancouver
1.
Sterken T, Fiorini P, Puers R. Combining BCB with KOH: wet bulk micromachining versus wafer bonding. Micromachining, Micromechanics and Microsystems, 16th Workshop, Proceedings. 2005. p. 80–3.
MLA
Sterken, Tom, Paolo Fiorini, and Robert Puers. “Combining BCB with KOH: Wet Bulk Micromachining Versus Wafer Bonding.” Micromachining, Micromechanics and Microsystems, 16th Workshop, Proceedings. 2005. 80–83. Print.