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A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels

Maarten Cauwe UGent, Bjorn Vandecasteele UGent, Johan De Baets UGent, Jeroen van den Brand, Roel Kusters and Ashok Sridhar (2012) 2012 4th Electronic system-integration technology conference (ESTC).
abstract
Expanding the current smart packaging solutions to individual products requires improvement for several of the following properties: cost, thickness, weight, flexibility, conformability, transparency, and even stretchability. This paper focusses on an embedding technology that targets the first four properties, with an emphasis on cost reduction. The progress on the development work for this foil-based embedding is reported, along with a detailed failure analysis of the process flow. A functional demonstrator is realized in the form of a smart sensing label, including an embedded micro controller. Practical and technological shortcomings of the current technology are used as a starting point for proposing an improved embedding technology based on low-cost plastic materials. The first developments for lamination and via interconnection are described.
Please use this url to cite or link to this publication:
author
organization
year
type
conference
publication status
published
subject
in
2012 4th Electronic system-integration technology conference (ESTC)
pages
6 pages
publisher
IEEE
place of publication
New York, NY, USA
conference name
4th Electronic System-Integration Technology Conference (ESTC)
conference location
Amsterdam, The Netherlands
conference start
2012-09-17
conference end
2012-09-20
Web of Science type
Proceedings Paper
Web of Science id
000324550400105
ISBN
9781467346443
DOI
10.1109/ESTC.2012.6542155
language
English
UGent publication?
no
classification
P1
copyright statement
I have transferred the copyright for this publication to the publisher
id
3065633
handle
http://hdl.handle.net/1854/LU-3065633
date created
2012-12-05 11:43:35
date last changed
2014-08-12 15:35:11
@inproceedings{3065633,
  abstract     = {Expanding the current smart packaging solutions to individual products requires improvement for several of the following properties: cost, thickness, weight, flexibility, conformability, transparency, and even stretchability. This paper focusses on an embedding technology that targets the first four properties, with an emphasis on cost reduction. The progress on the development work for this foil-based embedding is reported, along with a detailed failure analysis of the process flow. A functional demonstrator is realized in the form of a smart sensing label, including an embedded micro controller. Practical and technological shortcomings of the current technology are used as a starting point for proposing an improved embedding technology based on low-cost plastic materials. The first developments for lamination and via interconnection are described.},
  author       = {Cauwe, Maarten and Vandecasteele, Bjorn and De Baets, Johan and van den Brand, Jeroen and Kusters, Roel and Sridhar, Ashok},
  booktitle    = {2012 4th Electronic system-integration technology conference (ESTC)},
  isbn         = {9781467346443},
  language     = {eng},
  location     = {Amsterdam, The Netherlands},
  pages        = {6},
  publisher    = {IEEE},
  title        = {A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels},
  url          = {http://dx.doi.org/10.1109/ESTC.2012.6542155},
  year         = {2012},
}

Chicago
Cauwe, Maarten, Bjorn Vandecasteele, Johan De Baets, Jeroen van den Brand, Roel Kusters, and Ashok Sridhar. 2012. “A Chip Embedding Solution Based on Low-cost Plastic Materials as Enabling Technology for Smart Labels.” In 2012 4th Electronic System-integration Technology Conference (ESTC). New York, NY, USA: IEEE.
APA
Cauwe, M., Vandecasteele, B., De Baets, J., van den Brand, J., Kusters, R., & Sridhar, A. (2012). A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels. 2012 4th Electronic system-integration technology conference (ESTC). Presented at the 4th Electronic System-Integration Technology Conference (ESTC), New York, NY, USA: IEEE.
Vancouver
1.
Cauwe M, Vandecasteele B, De Baets J, van den Brand J, Kusters R, Sridhar A. A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels. 2012 4th Electronic system-integration technology conference (ESTC). New York, NY, USA: IEEE; 2012.
MLA
Cauwe, Maarten, Bjorn Vandecasteele, Johan De Baets, et al. “A Chip Embedding Solution Based on Low-cost Plastic Materials as Enabling Technology for Smart Labels.” 2012 4th Electronic System-integration Technology Conference (ESTC). New York, NY, USA: IEEE, 2012. Print.