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Novel methodology to integrate ultra-thin chips on flexible foils

Ashok Sridhar, Maarten Cauwe UGent, Roel Kusters, Henri Fledderus and Jeroen van den Brand (2012) 2012 4th Electronic system-integration technology conference (ESTC).
abstract
The placement and integration of ultra-thin chips (UTCs) on low-cost polymer foils is a key challenge in the realization of large-area flexible electronic products. Such products, are for cost reasons, preferably fabricated on low cost polyester foils like PET/PEN. A disadvantage of these materials is that they have a low thermal stability. As a consequence of this, the majority of existing chip integration technologies cannot be used. A novel approach for placement and interconnection of UTCs is presented in this paper. This approach, which involves face-up bonding of UTC and its subsequent interconnection, is compatible with low-cost polymer foils. The key process steps involved in UTC integration using the proposed methodology are discussed in detail. The fabrication of a technology demonstrator to validate the proposed concept is also detailed.
Please use this url to cite or link to this publication:
author
organization
year
type
conference
publication status
published
subject
in
2012 4th Electronic system-integration technology conference (ESTC)
pages
5 pages
publisher
IEEE
place of publication
New York, NY, USA
conference name
4th Electronic System-Integration Technology Conference (ESTC)
conference location
Amsterdam, The Netherlands
conference start
2012-09-17
conference end
2012-09-20
Web of Science type
Proceedings Paper
Web of Science id
000324550400018
ISBN
9781467346443
DOI
10.1109/ESTC.2012.6542068
language
English
UGent publication?
no
classification
P1
copyright statement
I have transferred the copyright for this publication to the publisher
id
3065619
handle
http://hdl.handle.net/1854/LU-3065619
date created
2012-12-05 11:38:26
date last changed
2014-08-12 15:26:04
@inproceedings{3065619,
  abstract     = {The placement and integration of ultra-thin chips (UTCs) on low-cost polymer foils is a key challenge in the realization of large-area flexible electronic products. Such products, are for cost reasons, preferably fabricated on low cost polyester foils like PET/PEN. A disadvantage of these materials is that they have a low thermal stability. As a consequence of this, the majority of existing chip integration technologies cannot be used. A novel approach for placement and interconnection of UTCs is presented in this paper. This approach, which involves face-up bonding of UTC and its subsequent interconnection, is compatible with low-cost polymer foils. The key process steps involved in UTC integration using the proposed methodology are discussed in detail. The fabrication of a technology demonstrator to validate the proposed concept is also detailed.},
  author       = {Sridhar, Ashok and Cauwe, Maarten and Kusters, Roel and Fledderus, Henri and van den Brand, Jeroen},
  booktitle    = {2012 4th Electronic system-integration technology conference (ESTC)},
  isbn         = {9781467346443},
  language     = {eng},
  location     = {Amsterdam, The Netherlands},
  pages        = {5},
  publisher    = {IEEE},
  title        = {Novel methodology to integrate ultra-thin chips on flexible foils},
  url          = {http://dx.doi.org/10.1109/ESTC.2012.6542068},
  year         = {2012},
}

Chicago
Sridhar, Ashok, Maarten Cauwe, Roel Kusters, Henri Fledderus, and Jeroen van den Brand. 2012. “Novel Methodology to Integrate Ultra-thin Chips on Flexible Foils.” In 2012 4th Electronic System-integration Technology Conference (ESTC). New York, NY, USA: IEEE.
APA
Sridhar, Ashok, Cauwe, M., Kusters, R., Fledderus, H., & van den Brand, J. (2012). Novel methodology to integrate ultra-thin chips on flexible foils. 2012 4th Electronic system-integration technology conference (ESTC). Presented at the 4th Electronic System-Integration Technology Conference (ESTC), New York, NY, USA: IEEE.
Vancouver
1.
Sridhar A, Cauwe M, Kusters R, Fledderus H, van den Brand J. Novel methodology to integrate ultra-thin chips on flexible foils. 2012 4th Electronic system-integration technology conference (ESTC). New York, NY, USA: IEEE; 2012.
MLA
Sridhar, Ashok, Maarten Cauwe, Roel Kusters, et al. “Novel Methodology to Integrate Ultra-thin Chips on Flexible Foils.” 2012 4th Electronic System-integration Technology Conference (ESTC). New York, NY, USA: IEEE, 2012. Print.