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Towards reel-to-reel integration of ultra thin chips to polymer foils

Marcel Tichem, Maarten Cauwe UGent, Zlatko Hajdarevic, Eda Kuran, Benny Naveh, Ashok Sridhar and Philipp Weissel (2012) 2012 4th Electronic system-integration technology conference (ESTC).
abstract
The EU FP7 funded project Chip2Foil aims to realise a technology platform allowing a radically different implementation of the assembly process for ultra-thin chips (UTCs) to polymer foils. The process is based on redistribution of the tolerance budget, and consists of two major steps: self-assembly supported chip placement followed by an adaptive circuitry approach for realising the electrical interconnects. The concept accepts non-contact, low precision presentation of a UTC to the self-assembly force field, which brings the chip to a final position with moderate precision. Next, in an adaptive interconnection process the chip position is measured with respect to the circuitry on the foil and interconnects are created on an individual chip and IO basis. The main technology building blocks are described and the current performance is demonstrated, including chip thinning, fast UTC release from wafer tape, self-assembly supported chip placement using magnetic forces and adaptive electrical interconnection by laser scribing of a screen-printed silver patch.
Please use this url to cite or link to this publication:
author
organization
year
type
conference
publication status
published
subject
in
2012 4th Electronic system-integration technology conference (ESTC)
pages
6 pages
publisher
IEEE
place of publication
New York, NY, USA
conference name
4th Electronic System-Integration Technology Conference (ESTC)
conference location
Amsterdam, The Netherlands
conference start
2012-09-17
conference end
2012-09-20
Web of Science type
Proceedings Paper
Web of Science id
000324550400020
ISBN
9781467346443
DOI
10.1109/ESTC.2012.6542070
language
English
UGent publication?
no
classification
P1
copyright statement
I have transferred the copyright for this publication to the publisher
id
3065595
handle
http://hdl.handle.net/1854/LU-3065595
date created
2012-12-05 11:28:43
date last changed
2014-08-12 15:22:32
@inproceedings{3065595,
  abstract     = {The EU FP7 funded project Chip2Foil aims to realise a technology platform allowing a radically different implementation of the assembly process for ultra-thin chips (UTCs) to polymer foils. The process is based on redistribution of the tolerance budget, and consists of two major steps: self-assembly supported chip placement followed by an adaptive circuitry approach for realising the electrical interconnects. The concept accepts non-contact, low precision presentation of a UTC to the self-assembly force field, which brings the chip to a final position with moderate precision. Next, in an adaptive interconnection process the chip position is measured with respect to the circuitry on the foil and interconnects are created on an individual chip and IO basis. The main technology building blocks are described and the current performance is demonstrated, including chip thinning, fast UTC release from wafer tape, self-assembly supported chip placement using magnetic forces and adaptive electrical interconnection by laser scribing of a screen-printed silver patch.},
  author       = {Tichem, Marcel and Cauwe, Maarten and Hajdarevic, Zlatko and Kuran, Eda and Naveh, Benny and Sridhar, Ashok and Weissel, Philipp},
  booktitle    = {2012 4th Electronic system-integration technology conference (ESTC)},
  isbn         = {9781467346443},
  language     = {eng},
  location     = {Amsterdam, The Netherlands},
  pages        = {6},
  publisher    = {IEEE},
  title        = {Towards reel-to-reel integration of ultra thin chips to polymer foils},
  url          = {http://dx.doi.org/10.1109/ESTC.2012.6542070},
  year         = {2012},
}

Chicago
Tichem, Marcel, Maarten Cauwe, Zlatko Hajdarevic, Eda Kuran, Benny Naveh, Ashok Sridhar, and Philipp Weissel. 2012. “Towards Reel-to-reel Integration of Ultra Thin Chips to Polymer Foils.” In 2012 4th Electronic System-integration Technology Conference (ESTC). New York, NY, USA: IEEE.
APA
Tichem, M., Cauwe, M., Hajdarevic, Z., Kuran, E., Naveh, B., Sridhar, A., & Weissel, P. (2012). Towards reel-to-reel integration of ultra thin chips to polymer foils. 2012 4th Electronic system-integration technology conference (ESTC). Presented at the 4th Electronic System-Integration Technology Conference (ESTC), New York, NY, USA: IEEE.
Vancouver
1.
Tichem M, Cauwe M, Hajdarevic Z, Kuran E, Naveh B, Sridhar A, et al. Towards reel-to-reel integration of ultra thin chips to polymer foils. 2012 4th Electronic system-integration technology conference (ESTC). New York, NY, USA: IEEE; 2012.
MLA
Tichem, Marcel, Maarten Cauwe, Zlatko Hajdarevic, et al. “Towards Reel-to-reel Integration of Ultra Thin Chips to Polymer Foils.” 2012 4th Electronic System-integration Technology Conference (ESTC). New York, NY, USA: IEEE, 2012. Print.