Ghent University Academic Bibliography

Advanced

Bonding bare die LEDs on PET foils for lighting applications: thermal design modeling and bonding experiments

Daan van den Ende, Roel Kusters, Maarten Cauwe UGent, A van der Waal and Jeroen van den Brand (2012) 2012 4th Electronic system-integration technology conference (ESTC).
abstract
Integration of LEDs on flexible foil substrates is of interest for flexible lighting applications and flexible photonic devices. A matrix of LEDs on a foil combined with a diffuser can be a potential alternative for flexible OLED lighting devices. Preferably, these LEDs are integrated in an unpackaged, bare die form as it reduces cost, footprint and thickness. As a substrate, preferably low cost materials like polyesters (PET) are being used, especially for large area devices. However, the use of these materials imposes some limitations. Most notably, the low temperature stability (<100 degrees C continuous use temperature) of these materials limits the maximum temperatures during the manufacturing process and poses constraints on the thermal design of the device. The current paper describes the results of research on possibilities for integrating bare die LEDs with low cost flexible PET foils. Finite element (FE) thermal modeling has been performed of possible designs of adhesively bonded LED-on-foil and laminated LED-in-foil configurations. The role of the different materials and the effect of their geometries on the temperature distribution in the simulated devices are discussed. The results give insight in measures that can be taken to keep the temperature of all the components of the device within operational limits. For LEDs bonded on Cu-PET foil the modeled temperature distributions are compared to experimentally observed temperature distributions in LED on PET foil reference devices using infrared thermal imaging. Besides this, initial studies on directly bonding LEDs on etched Cu on PET substrates using anisotropic conducting adhesives and isotropic conducting adhesives were performed. An experimental comparison is made between the different techniques based on temperature/humidity reliability and flexural stability of the bonded LEDs, based on these preliminary results.
Please use this url to cite or link to this publication:
author
organization
year
type
conference
publication status
published
subject
in
2012 4th Electronic system-integration technology conference (ESTC)
pages
6 pages
publisher
IEEE
place of publication
New York, NY, USA
conference name
4th Electronic System-Integration Technology Conference (ESTC)
conference location
Amsterdam, The Netherlands
conference start
2012-09-17
conference end
2012-09-20
Web of Science type
Proceedings Paper
Web of Science id
000324550400069
ISBN
9781467346443
9781467346450
DOI
10.1109/ESTC.2012.6542119
language
English
UGent publication?
no
classification
P1
copyright statement
I have transferred the copyright for this publication to the publisher
id
3065511
handle
http://hdl.handle.net/1854/LU-3065511
date created
2012-12-05 11:06:13
date last changed
2014-08-12 15:19:45
@inproceedings{3065511,
  abstract     = {Integration of LEDs on flexible foil substrates is of interest for flexible lighting applications and flexible photonic devices. A matrix of LEDs on a foil combined with a diffuser can be a potential alternative for flexible OLED lighting devices. Preferably, these LEDs are integrated in an unpackaged, bare die form as it reduces cost, footprint and thickness. As a substrate, preferably low cost materials like polyesters (PET) are being used, especially for large area devices. However, the use of these materials imposes some limitations. Most notably, the low temperature stability ({\textlangle}100 degrees C continuous use temperature) of these materials limits the maximum temperatures during the manufacturing process and poses constraints on the thermal design of the device. The current paper describes the results of research on possibilities for integrating bare die LEDs with low cost flexible PET foils. Finite element (FE) thermal modeling has been performed of possible designs of adhesively bonded LED-on-foil and laminated LED-in-foil configurations. The role of the different materials and the effect of their geometries on the temperature distribution in the simulated devices are discussed. The results give insight in measures that can be taken to keep the temperature of all the components of the device within operational limits. For LEDs bonded on Cu-PET foil the modeled temperature distributions are compared to experimentally observed temperature distributions in LED on PET foil reference devices using infrared thermal imaging. Besides this, initial studies on directly bonding LEDs on etched Cu on PET substrates using anisotropic conducting adhesives and isotropic conducting adhesives were performed. An experimental comparison is made between the different techniques based on temperature/humidity reliability and flexural stability of the bonded LEDs, based on these preliminary results.},
  author       = {van den Ende, Daan and Kusters, Roel and Cauwe, Maarten and van der Waal, A and van den Brand, Jeroen},
  booktitle    = {2012 4th Electronic system-integration technology conference (ESTC)},
  isbn         = {9781467346443},
  language     = {eng},
  location     = {Amsterdam, The Netherlands},
  pages        = {6},
  publisher    = {IEEE},
  title        = {Bonding bare die LEDs on PET foils for lighting applications: thermal design modeling and bonding experiments},
  url          = {http://dx.doi.org/10.1109/ESTC.2012.6542119},
  year         = {2012},
}

Chicago
van den Ende, Daan, Roel Kusters, Maarten Cauwe, A van der Waal, and Jeroen van den Brand. 2012. “Bonding Bare Die LEDs on PET Foils for Lighting Applications: Thermal Design Modeling and Bonding Experiments.” In 2012 4th Electronic System-integration Technology Conference (ESTC). New York, NY, USA: IEEE.
APA
van den Ende, D., Kusters, R., Cauwe, M., van der Waal, A., & van den Brand, J. (2012). Bonding bare die LEDs on PET foils for lighting applications: thermal design modeling and bonding experiments. 2012 4th Electronic system-integration technology conference (ESTC). Presented at the 4th Electronic System-Integration Technology Conference (ESTC), New York, NY, USA: IEEE.
Vancouver
1.
van den Ende D, Kusters R, Cauwe M, van der Waal A, van den Brand J. Bonding bare die LEDs on PET foils for lighting applications: thermal design modeling and bonding experiments. 2012 4th Electronic system-integration technology conference (ESTC). New York, NY, USA: IEEE; 2012.
MLA
van den Ende, Daan, Roel Kusters, Maarten Cauwe, et al. “Bonding Bare Die LEDs on PET Foils for Lighting Applications: Thermal Design Modeling and Bonding Experiments.” 2012 4th Electronic System-integration Technology Conference (ESTC). New York, NY, USA: IEEE, 2012. Print.