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Short, stretchable molded interconnect reliability under 10% cyclic elongation

Michal Jablonski (UGent) , Jan Vanfleteren (UGent) , Thomas Vervust (UGent) and Frederick Bossuyt (UGent)
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Project
EC-FP7-Place-It
Abstract
SMI (Stretchable Molded Interconnect) technology allows for realization of PCB-like manufactured electronic systems with intrinsic ability to be bent and locally stretched multiple times. The elasticity is obtained by introduction of meandered, electrical tracks that have the ability to follow the deformation of its PDMS encapsulation without electrical failure. This work investigates the endurance of 4 different meander-based interconnect types in a cyclic stretching test until 10% elongation. By modeling the failures of the unsupported copper interconnect (e.g. no polyimide support) with Weibull distribution we show that it can sustain up to 5000, 10% elongation cycles below 1% failure probability. Parameters of the distributions are compared between different interconnect geometries. SMI processing parameters critical to reliability are indicated based on failure analysis of poorly performing interconnects.
Keywords
Reliability, biomimetic electronics, SMI, Stretchable Interconnect

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Please use this url to cite or link to this publication:

Chicago
Jablonski, Michal, Jan Vanfleteren, Thomas Vervust, and Frederick Bossuyt. 2012. “Short, Stretchable Molded Interconnect Reliability Under 10% Cyclic Elongation.” In 2012 4th Electronic System-integration Technology Conference (ESTC). New York, NY, USA: IEEE.
APA
Jablonski, M., Vanfleteren, J., Vervust, T., & Bossuyt, F. (2012). Short, stretchable molded interconnect reliability under 10% cyclic elongation. 2012 4th Electronic system-integration technology conference (ESTC). Presented at the 4th Electronic System-Integration Technology Conference (ESTC 2012), New York, NY, USA: IEEE.
Vancouver
1.
Jablonski M, Vanfleteren J, Vervust T, Bossuyt F. Short, stretchable molded interconnect reliability under 10% cyclic elongation. 2012 4th Electronic system-integration technology conference (ESTC). New York, NY, USA: IEEE; 2012.
MLA
Jablonski, Michal, Jan Vanfleteren, Thomas Vervust, et al. “Short, Stretchable Molded Interconnect Reliability Under 10% Cyclic Elongation.” 2012 4th Electronic System-integration Technology Conference (ESTC). New York, NY, USA: IEEE, 2012. Print.
@inproceedings{3060275,
  abstract     = {SMI (Stretchable Molded Interconnect) technology allows for realization of PCB-like manufactured electronic systems with intrinsic ability to be bent and locally stretched multiple times. The elasticity is obtained by introduction of meandered, electrical tracks that have the ability to follow the deformation of its PDMS encapsulation without electrical failure. This work investigates the endurance of 4 different meander-based interconnect types in a cyclic stretching test until 10\% elongation. By modeling the failures of the unsupported copper interconnect (e.g. no polyimide support) with Weibull distribution we show that it can sustain up to 5000, 10\% elongation cycles below 1\% failure probability. Parameters of the distributions are compared between different interconnect geometries. SMI processing parameters critical to reliability are indicated based on failure analysis of poorly performing interconnects.},
  author       = {Jablonski, Michal and Vanfleteren, Jan and Vervust, Thomas and Bossuyt, Frederick},
  booktitle    = {2012 4th Electronic system-integration technology conference (ESTC)},
  isbn         = {9781467346443},
  keyword      = {Reliability,biomimetic electronics,SMI,Stretchable Interconnect},
  language     = {eng},
  location     = {Amsterdam, The Netherlands},
  pages        = {4},
  publisher    = {IEEE},
  title        = {Short, stretchable molded interconnect reliability under 10\% cyclic elongation},
  url          = {http://dx.doi.org/10.1109/ESTC.2012.6542084},
  year         = {2012},
}

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