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Short, stretchable molded interconnect reliability under 10% cyclic elongation

Michal Jablonski, Jan Vanfleteren UGent, Thomas Vervust UGent and Frederick Bossuyt UGent (2012) 2012 4th Electronic system-integration technology conference (ESTC).
abstract
SMI (Stretchable Molded Interconnect) technology allows for realization of PCB-like manufactured electronic systems with intrinsic ability to be bent and locally stretched multiple times. The elasticity is obtained by introduction of meandered, electrical tracks that have the ability to follow the deformation of its PDMS encapsulation without electrical failure. This work investigates the endurance of 4 different meander-based interconnect types in a cyclic stretching test until 10% elongation. By modeling the failures of the unsupported copper interconnect (e.g. no polyimide support) with Weibull distribution we show that it can sustain up to 5000, 10% elongation cycles below 1% failure probability. Parameters of the distributions are compared between different interconnect geometries. SMI processing parameters critical to reliability are indicated based on failure analysis of poorly performing interconnects.
Please use this url to cite or link to this publication:
author
organization
year
type
conference (proceedingsPaper)
publication status
published
subject
keyword
Reliability, biomimetic electronics, SMI, Stretchable Interconnect
in
2012 4th Electronic system-integration technology conference (ESTC)
pages
4 pages
publisher
IEEE
place of publication
New York, NY, USA
conference name
4th Electronic System-Integration Technology Conference (ESTC 2012)
conference location
Amsterdam, The Netherlands
conference start
2012-09-17
conference end
2012-09-20
Web of Science type
Proceedings Paper
Web of Science id
000324550400034
ISBN
9781467346443
DOI
10.1109/ESTC.2012.6542084
project
EC-FP7-Place-It
language
English
UGent publication?
yes
classification
P1
copyright statement
I have transferred the copyright for this publication to the publisher
id
3060275
handle
http://hdl.handle.net/1854/LU-3060275
date created
2012-11-26 14:22:36
date last changed
2017-01-02 09:53:29
@inproceedings{3060275,
  abstract     = {SMI (Stretchable Molded Interconnect) technology allows for realization of PCB-like manufactured electronic systems with intrinsic ability to be bent and locally stretched multiple times. The elasticity is obtained by introduction of meandered, electrical tracks that have the ability to follow the deformation of its PDMS encapsulation without electrical failure. This work investigates the endurance of 4 different meander-based interconnect types in a cyclic stretching test until 10\% elongation. By modeling the failures of the unsupported copper interconnect (e.g. no polyimide support) with Weibull distribution we show that it can sustain up to 5000, 10\% elongation cycles below 1\% failure probability. Parameters of the distributions are compared between different interconnect geometries. SMI processing parameters critical to reliability are indicated based on failure analysis of poorly performing interconnects.},
  author       = {Jablonski, Michal and Vanfleteren, Jan and Vervust, Thomas and Bossuyt, Frederick},
  booktitle    = {2012 4th Electronic system-integration technology conference (ESTC)},
  isbn         = {9781467346443},
  keyword      = {Reliability,biomimetic electronics,SMI,Stretchable Interconnect},
  language     = {eng},
  location     = {Amsterdam, The Netherlands},
  pages        = {4},
  publisher    = {IEEE},
  title        = {Short, stretchable molded interconnect reliability under 10\% cyclic elongation},
  url          = {http://dx.doi.org/10.1109/ESTC.2012.6542084},
  year         = {2012},
}

Chicago
Jablonski, Michal, Jan Vanfleteren, Thomas Vervust, and Frederick Bossuyt. 2012. “Short, Stretchable Molded Interconnect Reliability Under 10% Cyclic Elongation.” In 2012 4th Electronic System-integration Technology Conference (ESTC). New York, NY, USA: IEEE.
APA
Jablonski, M., Vanfleteren, J., Vervust, T., & Bossuyt, F. (2012). Short, stretchable molded interconnect reliability under 10% cyclic elongation. 2012 4th Electronic system-integration technology conference (ESTC). Presented at the 4th Electronic System-Integration Technology Conference (ESTC 2012), New York, NY, USA: IEEE.
Vancouver
1.
Jablonski M, Vanfleteren J, Vervust T, Bossuyt F. Short, stretchable molded interconnect reliability under 10% cyclic elongation. 2012 4th Electronic system-integration technology conference (ESTC). New York, NY, USA: IEEE; 2012.
MLA
Jablonski, Michal, Jan Vanfleteren, Thomas Vervust, et al. “Short, Stretchable Molded Interconnect Reliability Under 10% Cyclic Elongation.” 2012 4th Electronic System-integration Technology Conference (ESTC). New York, NY, USA: IEEE, 2012. Print.