Adhesive bonding by SU-8 transfer for assembling microfluidic devices
- Author
- Pietro Salvo (UGent) , Rik Verplancke (UGent) , Frederick Bossuyt (UGent) , Daniel Latta, Bjorn Vandecasteele (UGent) , Chengxun Liu and Jan Vanfleteren (UGent)
- Organization
- Abstract
- SU-8 is largely used to make microfluidic molds or components, but mainly for producing high-precision and thermally stable structures. We present a versatile method that employs SU-8 as glue to perform an adhesive bonding between micro-patterned structures. More in general, this technique enables an easy assembly of microfluidic devices, which can also be made by different materials, where selective bonding is required. The adhesive bonding is achieved by transferring a thin layer of SU-8 5 (thickness <= 15 mu m) on a substrate by means of a polyimide foil. The method is described in detail and an example of its application is given. Finally, a shear test is carried out to prove sufficient adhesion strength for microfluidic applications.
- Keywords
- SU-8, Selective bonding, Patterned substrates, FABRICATION, Microfluidics
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Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-3059641
- MLA
- Salvo, Pietro, et al. “Adhesive Bonding by SU-8 Transfer for Assembling Microfluidic Devices.” MICROFLUIDICS AND NANOFLUIDICS, vol. 13, no. 6, 2012, pp. 987–91, doi:10.1007/s10404-012-1011-x.
- APA
- Salvo, P., Verplancke, R., Bossuyt, F., Latta, D., Vandecasteele, B., Liu, C., & Vanfleteren, J. (2012). Adhesive bonding by SU-8 transfer for assembling microfluidic devices. MICROFLUIDICS AND NANOFLUIDICS, 13(6), 987–991. https://doi.org/10.1007/s10404-012-1011-x
- Chicago author-date
- Salvo, Pietro, Rik Verplancke, Frederick Bossuyt, Daniel Latta, Bjorn Vandecasteele, Chengxun Liu, and Jan Vanfleteren. 2012. “Adhesive Bonding by SU-8 Transfer for Assembling Microfluidic Devices.” MICROFLUIDICS AND NANOFLUIDICS 13 (6): 987–91. https://doi.org/10.1007/s10404-012-1011-x.
- Chicago author-date (all authors)
- Salvo, Pietro, Rik Verplancke, Frederick Bossuyt, Daniel Latta, Bjorn Vandecasteele, Chengxun Liu, and Jan Vanfleteren. 2012. “Adhesive Bonding by SU-8 Transfer for Assembling Microfluidic Devices.” MICROFLUIDICS AND NANOFLUIDICS 13 (6): 987–991. doi:10.1007/s10404-012-1011-x.
- Vancouver
- 1.Salvo P, Verplancke R, Bossuyt F, Latta D, Vandecasteele B, Liu C, et al. Adhesive bonding by SU-8 transfer for assembling microfluidic devices. MICROFLUIDICS AND NANOFLUIDICS. 2012;13(6):987–91.
- IEEE
- [1]P. Salvo et al., “Adhesive bonding by SU-8 transfer for assembling microfluidic devices,” MICROFLUIDICS AND NANOFLUIDICS, vol. 13, no. 6, pp. 987–991, 2012.
@article{3059641,
abstract = {{SU-8 is largely used to make microfluidic molds or components, but mainly for producing high-precision and thermally stable structures. We present a versatile method that employs SU-8 as glue to perform an adhesive bonding between micro-patterned structures. More in general, this technique enables an easy assembly of microfluidic devices, which can also be made by different materials, where selective bonding is required. The adhesive bonding is achieved by transferring a thin layer of SU-8 5 (thickness <= 15 mu m) on a substrate by means of a polyimide foil. The method is described in detail and an example of its application is given. Finally, a shear test is carried out to prove sufficient adhesion strength for microfluidic applications.}},
author = {{Salvo, Pietro and Verplancke, Rik and Bossuyt, Frederick and Latta, Daniel and Vandecasteele, Bjorn and Liu, Chengxun and Vanfleteren, Jan}},
issn = {{1613-4982}},
journal = {{MICROFLUIDICS AND NANOFLUIDICS}},
keywords = {{SU-8,Selective bonding,Patterned substrates,FABRICATION,Microfluidics}},
language = {{eng}},
number = {{6}},
pages = {{987--991}},
title = {{Adhesive bonding by SU-8 transfer for assembling microfluidic devices}},
url = {{http://doi.org/10.1007/s10404-012-1011-x}},
volume = {{13}},
year = {{2012}},
}
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