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Adhesive bonding by SU-8 transfer for assembling microfluidic devices

Pietro Salvo UGent, Rik Verplancke UGent, Frederick Bossuyt UGent, Daniel Latta, Bjorn Vandecasteele UGent, Chengxun Liu and Jan Vanfleteren UGent (2012) MICROFLUIDICS AND NANOFLUIDICS. 13(6). p.987-991
abstract
SU-8 is largely used to make microfluidic molds or components, but mainly for producing high-precision and thermally stable structures. We present a versatile method that employs SU-8 as glue to perform an adhesive bonding between micro-patterned structures. More in general, this technique enables an easy assembly of microfluidic devices, which can also be made by different materials, where selective bonding is required. The adhesive bonding is achieved by transferring a thin layer of SU-8 5 (thickness <= 15 mu m) on a substrate by means of a polyimide foil. The method is described in detail and an example of its application is given. Finally, a shear test is carried out to prove sufficient adhesion strength for microfluidic applications.
Please use this url to cite or link to this publication:
author
organization
year
type
journalArticle (original)
publication status
published
subject
keyword
SU-8, Selective bonding, Patterned substrates, FABRICATION, Microfluidics
journal title
MICROFLUIDICS AND NANOFLUIDICS
Microfluid. Nanofluid.
volume
13
issue
6
pages
987 - 991
Web of Science type
Article
Web of Science id
000313798000012
JCR category
INSTRUMENTS & INSTRUMENTATION
JCR impact factor
3.218 (2012)
JCR rank
4/57 (2012)
JCR quartile
1 (2012)
ISSN
1613-4982
DOI
10.1007/s10404-012-1011-x
language
English
UGent publication?
yes
classification
A1
copyright statement
I have transferred the copyright for this publication to the publisher
id
3059641
handle
http://hdl.handle.net/1854/LU-3059641
date created
2012-11-25 14:21:02
date last changed
2016-12-19 15:43:35
@article{3059641,
  abstract     = {SU-8 is largely used to make microfluidic molds or components, but mainly for producing high-precision and thermally stable structures. We present a versatile method that employs SU-8 as glue to perform an adhesive bonding between micro-patterned structures. More in general, this technique enables an easy assembly of microfluidic devices, which can also be made by different materials, where selective bonding is required. The adhesive bonding is achieved by transferring a thin layer of SU-8 5 (thickness {\textlangle}= 15 mu m) on a substrate by means of a polyimide foil. The method is described in detail and an example of its application is given. Finally, a shear test is carried out to prove sufficient adhesion strength for microfluidic applications.},
  author       = {Salvo, Pietro and Verplancke, Rik and Bossuyt, Frederick and Latta, Daniel and Vandecasteele, Bjorn and Liu, Chengxun and Vanfleteren, Jan},
  issn         = {1613-4982},
  journal      = {MICROFLUIDICS AND NANOFLUIDICS},
  keyword      = {SU-8,Selective bonding,Patterned substrates,FABRICATION,Microfluidics},
  language     = {eng},
  number       = {6},
  pages        = {987--991},
  title        = {Adhesive bonding by SU-8 transfer for assembling microfluidic devices},
  url          = {http://dx.doi.org/10.1007/s10404-012-1011-x},
  volume       = {13},
  year         = {2012},
}

Chicago
Salvo, Pietro, Rik Verplancke, Frederick Bossuyt, Daniel Latta, Bjorn Vandecasteele, Chengxun Liu, and Jan Vanfleteren. 2012. “Adhesive Bonding by SU-8 Transfer for Assembling Microfluidic Devices.” Microfluidics and Nanofluidics 13 (6): 987–991.
APA
Salvo, P., Verplancke, R., Bossuyt, F., Latta, D., Vandecasteele, B., Liu, C., & Vanfleteren, J. (2012). Adhesive bonding by SU-8 transfer for assembling microfluidic devices. MICROFLUIDICS AND NANOFLUIDICS, 13(6), 987–991.
Vancouver
1.
Salvo P, Verplancke R, Bossuyt F, Latta D, Vandecasteele B, Liu C, et al. Adhesive bonding by SU-8 transfer for assembling microfluidic devices. MICROFLUIDICS AND NANOFLUIDICS. 2012;13(6):987–91.
MLA
Salvo, Pietro, Rik Verplancke, Frederick Bossuyt, et al. “Adhesive Bonding by SU-8 Transfer for Assembling Microfluidic Devices.” MICROFLUIDICS AND NANOFLUIDICS 13.6 (2012): 987–991. Print.