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Multiple die-to-wafer adhesive bonding for heterogeneous integration

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Chicago
Keyvaninia, Shahram, Muhammad Muneeb, Stevan Stanković, Günther Roelkens, Dries Van Thourhout, and JM Fedeli. 2012. “Multiple Die-to-wafer Adhesive Bonding for Heterogeneous Integration.” In 16th European Conference on Integrated Optics, Abstracts.
APA
Keyvaninia, S., Muneeb, M., Stanković, S., Roelkens, G., Van Thourhout, D., & Fedeli, J. (2012). Multiple die-to-wafer adhesive bonding for heterogeneous integration. 16th European Conference on Integrated Optics, Abstracts. Presented at the 16th European Conference on Integrated Optics (ECIO - 2012).
Vancouver
1.
Keyvaninia S, Muneeb M, Stanković S, Roelkens G, Van Thourhout D, Fedeli J. Multiple die-to-wafer adhesive bonding for heterogeneous integration. 16th European Conference on Integrated Optics, Abstracts. 2012.
MLA
Keyvaninia, Shahram, Muhammad Muneeb, Stevan Stanković, et al. “Multiple Die-to-wafer Adhesive Bonding for Heterogeneous Integration.” 16th European Conference on Integrated Optics, Abstracts. 2012. Print.
@inproceedings{2996326,
  author       = {Keyvaninia, Shahram and Muneeb, Muhammad and Stankovi\'{c}, Stevan and Roelkens, G{\"u}nther and Van Thourhout, Dries and Fedeli, JM},
  booktitle    = {16th European Conference on Integrated Optics, Abstracts},
  language     = {eng},
  location     = {Barcelona, Spain},
  title        = {Multiple die-to-wafer adhesive bonding for heterogeneous integration},
  year         = {2012},
}