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Novel interconnect methodologies for ultra-thin chips on foils

A Sridhar, Maarten Cauwe UGent, H Fledderus, R Kusters and J van den Brand (2012) 2012 IEEE 62nd Electronic Components and Technology Conference. p.238-244
abstract
Reliable interconnection technology is key to the realization of reliable hybrid microelectronic systems that combine printed electronics and silicon technology. Flexible hybrid electronic systems-in-foil (SiF) that are typically suited for roll-to-roll (R2R) manufacturing place additional requirements and demands on interconnects. In this paper, three novel interconnection methodologies for SiF are compared for a novel face-up integration approach for ultra-thin chip on foil. Laser scribing, inkjet printing and laser-induced forward transfer (LIFT) are the technologies compared with each other, as well as with electroplating, a standard technology widely used in the electronics industry. The comparison is based on experimental investigation into via filling, interconnect deposition, electrical conductivity and interconnect reliability. The selection of an interconnection technology for practical implementation is the key outcome of this paper.
Please use this url to cite or link to this publication:
author
organization
year
type
conference
publication status
published
subject
in
2012 IEEE 62nd Electronic Components and Technology Conference
pages
238 - 244
publisher
IEEE
place of publication
Piscataway, NJ, USA
conference name
2012 IEEE 62nd Electronic Components and Technology Conference (ECTC - 2012)
conference location
San Diego, CA, USA
conference start
2012-05-29
conference end
2012-06-01
Web of Science type
Proceedings Paper
Web of Science id
000309162000038
ISBN
9781467319652
language
English
UGent publication?
yes
classification
P1
copyright statement
I have transferred the copyright for this publication to the publisher
id
2974740
handle
http://hdl.handle.net/1854/LU-2974740
date created
2012-08-24 11:00:53
date last changed
2013-07-09 09:32:16
@inproceedings{2974740,
  abstract     = {Reliable interconnection technology is key to the realization of reliable hybrid microelectronic systems that combine printed electronics and silicon technology. Flexible hybrid electronic systems-in-foil (SiF) that are typically suited for roll-to-roll (R2R) manufacturing place additional requirements and demands on interconnects. In this paper, three novel interconnection methodologies for SiF are compared for a novel face-up integration approach for ultra-thin chip on foil. Laser scribing, inkjet printing and laser-induced forward transfer (LIFT) are the technologies compared with each other, as well as with electroplating, a standard technology widely used in the electronics industry. The comparison is based on experimental investigation into via filling, interconnect deposition, electrical conductivity and interconnect reliability. The selection of an interconnection technology for practical implementation is the key outcome of this paper.},
  author       = {Sridhar, A and Cauwe, Maarten and Fledderus, H and Kusters, R and van den Brand, J},
  booktitle    = {2012 IEEE 62nd Electronic Components and Technology Conference},
  isbn         = {9781467319652},
  language     = {eng},
  location     = {San Diego, CA, USA},
  pages        = {238--244},
  publisher    = {IEEE},
  title        = {Novel interconnect methodologies for ultra-thin chips on foils},
  year         = {2012},
}

Chicago
Sridhar, A, Maarten Cauwe, H Fledderus, R Kusters, and J van den Brand. 2012. “Novel Interconnect Methodologies for Ultra-thin Chips on Foils.” In 2012 IEEE 62nd Electronic Components and Technology Conference, 238–244. Piscataway, NJ, USA: IEEE.
APA
Sridhar, A., Cauwe, M., Fledderus, H., Kusters, R., & van den Brand, J. (2012). Novel interconnect methodologies for ultra-thin chips on foils. 2012 IEEE 62nd Electronic Components and Technology Conference (pp. 238–244). Presented at the 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC - 2012), Piscataway, NJ, USA: IEEE.
Vancouver
1.
Sridhar A, Cauwe M, Fledderus H, Kusters R, van den Brand J. Novel interconnect methodologies for ultra-thin chips on foils. 2012 IEEE 62nd Electronic Components and Technology Conference. Piscataway, NJ, USA: IEEE; 2012. p. 238–44.
MLA
Sridhar, A, Maarten Cauwe, H Fledderus, et al. “Novel Interconnect Methodologies for Ultra-thin Chips on Foils.” 2012 IEEE 62nd Electronic Components and Technology Conference. Piscataway, NJ, USA: IEEE, 2012. 238–244. Print.