
An approach to produce a stack of photo definable polyimide based flat UTCPs
- Author
- Swarnakamal Priyabadini (UGent) , Tom Sterken (UGent) , Liang Wang (UGent) , Kristof Dhaenens (UGent) , Bjorn Vandecasteele (UGent) , Steven Van Put (UGent) , Andreas Erik Petersen and Jan Vanfleteren (UGent)
- Organization
- Abstract
- Getting output of multiple chips within the volume of a single chip is the driving force behind development of this novel 3D integration technology which has a broad range of industrial and medical electronic applications. This can be achieved by laminating multiple layers of spin-on polyimide based ultrathin chip packages (UTCPs) with fine pitch through hole interconnects.
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Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-2970812
- MLA
- Priyabadini, Swarnakamal, et al. “An Approach to Produce a Stack of Photo Definable Polyimide Based Flat UTCPs.” 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), IEEE-CPTM, 2012.
- APA
- Priyabadini, S., Sterken, T., Wang, L., Dhaenens, K., Vandecasteele, B., Van Put, S., … Vanfleteren, J. (2012). An approach to produce a stack of photo definable polyimide based flat UTCPs. 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC). Presented at the 4th Electronics System Integration Technologies conference (ESTC 2012), Amsterdam, The Netherlands.
- Chicago author-date
- Priyabadini, Swarnakamal, Tom Sterken, Liang Wang, Kristof Dhaenens, Bjorn Vandecasteele, Steven Van Put, Andreas Erik Petersen, and Jan Vanfleteren. 2012. “An Approach to Produce a Stack of Photo Definable Polyimide Based Flat UTCPs.” In 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC). IEEE-CPTM.
- Chicago author-date (all authors)
- Priyabadini, Swarnakamal, Tom Sterken, Liang Wang, Kristof Dhaenens, Bjorn Vandecasteele, Steven Van Put, Andreas Erik Petersen, and Jan Vanfleteren. 2012. “An Approach to Produce a Stack of Photo Definable Polyimide Based Flat UTCPs.” In 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC). IEEE-CPTM.
- Vancouver
- 1.Priyabadini S, Sterken T, Wang L, Dhaenens K, Vandecasteele B, Van Put S, et al. An approach to produce a stack of photo definable polyimide based flat UTCPs. In: 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC). IEEE-CPTM; 2012.
- IEEE
- [1]S. Priyabadini et al., “An approach to produce a stack of photo definable polyimide based flat UTCPs,” in 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), Amsterdam, The Netherlands, 2012.
@inproceedings{2970812, abstract = {{Getting output of multiple chips within the volume of a single chip is the driving force behind development of this novel 3D integration technology which has a broad range of industrial and medical electronic applications. This can be achieved by laminating multiple layers of spin-on polyimide based ultrathin chip packages (UTCPs) with fine pitch through hole interconnects.}}, articleno = {{PA6.2}}, author = {{Priyabadini, Swarnakamal and Sterken, Tom and Wang, Liang and Dhaenens, Kristof and Vandecasteele, Bjorn and Van Put, Steven and Erik Petersen, Andreas and Vanfleteren, Jan}}, booktitle = {{2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC)}}, language = {{eng}}, location = {{Amsterdam, The Netherlands}}, pages = {{4}}, publisher = {{IEEE-CPTM}}, title = {{An approach to produce a stack of photo definable polyimide based flat UTCPs}}, year = {{2012}}, }