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An approach to produce a stack of photo definable polyimide based flat UTCPs

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Abstract
Getting output of multiple chips within the volume of a single chip is the driving force behind development of this novel 3D integration technology which has a broad range of industrial and medical electronic applications. This can be achieved by laminating multiple layers of spin-on polyimide based ultrathin chip packages (UTCPs) with fine pitch through hole interconnects.

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MLA
Priyabadini, Swarnakamal, et al. “An Approach to Produce a Stack of Photo Definable Polyimide Based Flat UTCPs.” 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), IEEE-CPTM, 2012.
APA
Priyabadini, S., Sterken, T., Wang, L., Dhaenens, K., Vandecasteele, B., Van Put, S., … Vanfleteren, J. (2012). An approach to produce a stack of photo definable polyimide based flat UTCPs. 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC). Presented at the 4th Electronics System Integration Technologies conference (ESTC 2012), Amsterdam, The Netherlands.
Chicago author-date
Priyabadini, Swarnakamal, Tom Sterken, Liang Wang, Kristof Dhaenens, Bjorn Vandecasteele, Steven Van Put, Andreas Erik Petersen, and Jan Vanfleteren. 2012. “An Approach to Produce a Stack of Photo Definable Polyimide Based Flat UTCPs.” In 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC). IEEE-CPTM.
Chicago author-date (all authors)
Priyabadini, Swarnakamal, Tom Sterken, Liang Wang, Kristof Dhaenens, Bjorn Vandecasteele, Steven Van Put, Andreas Erik Petersen, and Jan Vanfleteren. 2012. “An Approach to Produce a Stack of Photo Definable Polyimide Based Flat UTCPs.” In 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC). IEEE-CPTM.
Vancouver
1.
Priyabadini S, Sterken T, Wang L, Dhaenens K, Vandecasteele B, Van Put S, et al. An approach to produce a stack of photo definable polyimide based flat UTCPs. In: 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC). IEEE-CPTM; 2012.
IEEE
[1]
S. Priyabadini et al., “An approach to produce a stack of photo definable polyimide based flat UTCPs,” in 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), Amsterdam, The Netherlands, 2012.
@inproceedings{2970812,
  abstract     = {{Getting output of multiple chips within the volume of a single chip is the driving force behind development of this novel 3D integration technology which has a broad range of industrial and medical electronic applications. This can be achieved by laminating multiple layers of spin-on polyimide based ultrathin chip packages (UTCPs) with fine pitch through hole interconnects.}},
  articleno    = {{PA6.2}},
  author       = {{Priyabadini, Swarnakamal and Sterken, Tom and Wang, Liang and Dhaenens, Kristof and Vandecasteele, Bjorn and Van Put, Steven and Erik Petersen, Andreas and Vanfleteren, Jan}},
  booktitle    = {{2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC)}},
  language     = {{eng}},
  location     = {{Amsterdam, The Netherlands}},
  pages        = {{4}},
  publisher    = {{IEEE-CPTM}},
  title        = {{An approach to produce a stack of photo definable polyimide based flat UTCPs}},
  year         = {{2012}},
}

Web of Science
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