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An approach to produce a stack of photo definable polyimide based flat UTCPs

Swarnakamal Priyabadini UGent, Tom Sterken UGent, Liang Wang UGent, Kristof Dhaenens UGent, Bjorn Vandecasteele UGent, Steven Van Put UGent, Andreas Erik Petersen and Jan Vanfleteren UGent (2012) 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC).
abstract
Getting output of multiple chips within the volume of a single chip is the driving force behind development of this novel 3D integration technology which has a broad range of industrial and medical electronic applications. This can be achieved by laminating multiple layers of spin-on polyimide based ultrathin chip packages (UTCPs) with fine pitch through hole interconnects.
Please use this url to cite or link to this publication:
author
organization
year
type
conference
publication status
published
subject
in
2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC)
article_number
PA6.2
pages
4 pages
publisher
IEEE-CPTM
conference name
4th Electronics System Integration Technologies conference (ESTC 2012)
conference location
Amsterdam, The Netherlands
conference start
2012-09-17
conference end
2012-09-20
Web of Science type
Proceedings Paper
Web of Science id
000324550400019
project
TIPS (contract No. FP7-224535)
language
English
UGent publication?
yes
classification
P1
copyright statement
I have transferred the copyright for this publication to the publisher
id
2970812
handle
http://hdl.handle.net/1854/LU-2970812
date created
2012-08-10 11:54:56
date last changed
2014-02-24 09:16:28
@inproceedings{2970812,
  abstract     = {Getting output of multiple chips within the volume of a single chip is the driving force behind development of this novel 3D integration technology which has a broad range of industrial and medical electronic applications. This can be achieved by laminating multiple layers of spin-on polyimide based ultrathin chip packages (UTCPs) with fine pitch through hole interconnects.},
  articleno    = {PA6.2},
  author       = {Priyabadini, Swarnakamal and Sterken, Tom and Wang, Liang and Dhaenens, Kristof and Vandecasteele, Bjorn and Van Put, Steven and Erik Petersen, Andreas and Vanfleteren, Jan},
  booktitle    = {2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC)},
  language     = {eng},
  location     = {Amsterdam, The Netherlands},
  pages        = {4},
  publisher    = {IEEE-CPTM},
  title        = {An approach to produce a stack of photo definable polyimide based flat UTCPs},
  year         = {2012},
}

Chicago
Priyabadini, Swarnakamal, Tom Sterken, Liang Wang, Kristof Dhaenens, Bjorn Vandecasteele, Steven Van Put, Andreas Erik Petersen, and Jan Vanfleteren. 2012. “An Approach to Produce a Stack of Photo Definable Polyimide Based Flat UTCPs.” In 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC). IEEE-CPTM.
APA
Priyabadini, S., Sterken, T., Wang, L., Dhaenens, K., Vandecasteele, B., Van Put, S., Erik Petersen, A., et al. (2012). An approach to produce a stack of photo definable polyimide based flat UTCPs. 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC). Presented at the 4th Electronics System Integration Technologies conference (ESTC 2012), IEEE-CPTM.
Vancouver
1.
Priyabadini S, Sterken T, Wang L, Dhaenens K, Vandecasteele B, Van Put S, et al. An approach to produce a stack of photo definable polyimide based flat UTCPs. 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC). IEEE-CPTM; 2012.
MLA
Priyabadini, Swarnakamal, Tom Sterken, Liang Wang, et al. “An Approach to Produce a Stack of Photo Definable Polyimide Based Flat UTCPs.” 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC). IEEE-CPTM, 2012. Print.