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Copper: a model alloy to understand the role of microstructure in sustainability

Linsey Lapeire UGent, Kim Verbeken UGent, Esther Martinez Lombardia, Leo Kestens UGent, Iris De Graeve and Herman Terryn (2011) 8th international workshop on electromagnetic compatibility of integrated circuits, Proceedings. p.1631-1644
Please use this url to cite or link to this publication:
author
organization
year
type
conference
publication status
published
subject
in
8th international workshop on electromagnetic compatibility of integrated circuits, Proceedings
pages
1631 - 1644
publisher
Ghent University, Department of Materials Science and Engineering
place of publication
Ghent, Belgium
conference name
8th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC COMPO - 2011)
conference location
Dubrovnik, Croatia
conference start
2011-11-06
conference end
2011-11-09
ISBN
9783940276407
language
English
UGent publication?
yes
classification
C1
copyright statement
I have retained and own the full copyright for this publication
id
2941149
handle
http://hdl.handle.net/1854/LU-2941149
date created
2012-06-28 11:27:08
date last changed
2013-07-19 13:14:59
@inproceedings{2941149,
  author       = {Lapeire, Linsey and Verbeken, Kim and Martinez Lombardia, Esther and Kestens, Leo and De Graeve, Iris and Terryn, Herman},
  booktitle    = {8th international workshop on electromagnetic compatibility of integrated circuits, Proceedings},
  isbn         = {9783940276407},
  language     = {eng},
  location     = {Dubrovnik, Croatia},
  pages        = {1631--1644},
  publisher    = {Ghent University, Department of Materials Science and Engineering},
  title        = {Copper: a model alloy to understand the role of microstructure in sustainability},
  year         = {2011},
}

Chicago
Lapeire, Linsey, Kim Verbeken, Esther Martinez Lombardia, Leo Kestens, Iris De Graeve, and Herman Terryn. 2011. “Copper: a Model Alloy to Understand the Role of Microstructure in Sustainability.” In 8th International Workshop on Electromagnetic Compatibility of Integrated Circuits, Proceedings, 1631–1644. Ghent, Belgium: Ghent University, Department of Materials Science and Engineering.
APA
Lapeire, L., Verbeken, K., Martinez Lombardia, E., Kestens, L., De Graeve, I., & Terryn, H. (2011). Copper: a model alloy to understand the role of microstructure in sustainability. 8th international workshop on electromagnetic compatibility of integrated circuits, Proceedings (pp. 1631–1644). Presented at the 8th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC COMPO - 2011), Ghent, Belgium: Ghent University, Department of Materials Science and Engineering.
Vancouver
1.
Lapeire L, Verbeken K, Martinez Lombardia E, Kestens L, De Graeve I, Terryn H. Copper: a model alloy to understand the role of microstructure in sustainability. 8th international workshop on electromagnetic compatibility of integrated circuits, Proceedings. Ghent, Belgium: Ghent University, Department of Materials Science and Engineering; 2011. p. 1631–44.
MLA
Lapeire, Linsey, Kim Verbeken, Esther Martinez Lombardia, et al. “Copper: a Model Alloy to Understand the Role of Microstructure in Sustainability.” 8th International Workshop on Electromagnetic Compatibility of Integrated Circuits, Proceedings. Ghent, Belgium: Ghent University, Department of Materials Science and Engineering, 2011. 1631–1644. Print.