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Abstract
The opportunity for mutual benefit across Europe to develop low-cost MCM technologies arose from recognition of the scientific skills and design and prototyping capabilities in organic and inorganic circuits in countries of Central Europe. As a results, the leading research institutions and small/medium-size enterprises of Hungary, Romania and Slovenia together with relevant institutions of the United Kingdom and Belgium proposed and received approval for an European Union INCO-COPERNICUS project (IC15-CT96-0743) "Establishment of Fast Prototyping Low Cost Multichip Module Technology Facilities in Eastern Europe for the Benefit of European Industry" (Cheap MultiChip Modules) to establish fast prototyping low cost multichip module (MCM) technology facilities. The project commenced in May 1997. MCM Technologies include the design, manufacturing, assembling and testing phases. The tasks of the Project are divided among the participants in accordance with these technological phases and conforming to their interest and capability in the field. Design is the task of the Rumanian Partners. They have installed CAD systems and developed circuit designs and simulations to determine the design rules and preferences for MCMs. Manufacturing is the task of the Hungarian and Slovenian Partners. They are focusing their laminate and ceramics capabilities towards MCM-L and MCM-C manufacturing and upgrading test technologies up to a level to fulfill the low cost, fast prototyping requirements of the participating Central European Countries (and later Europe-wide). The Hungarian Partner is also establishing mounting and bonding facilities for assembling MCMs in collaboration with the UK and Belgian Partners, exploiting their high level experience in the fields of microjoining and test technologies. The final test of demonstration modules is also the task of the Belgian Partner. The evaluation of the results in accordance with the manufacturing, application and economic aspects will be the task of all Partners with the leadership of the Hungarian Partner. The Project is carried out in close cc-operation of all Partners. In order to disseminate information for and about the Project, the Partnership participates in conferences, organizes seminars and training courses for themselves and for small and medium size enterprises who show interest in the prototyping technology of MCMs. Considerable progress has been made in the design facilities by the Rumanian Partner, and in the refinement of the printed circuit board (PCB) technology at Budapest, including laser patterning of MCM-Ls. Diffusion patterning and ceramics technology skills in Slovenia are enabling MCM-C prototyping to be demonstrated and further developed.
Keywords
MultiChip Modules, MCM, MCM Technology, cheap modules, MCM-L, MultiChip modules laminates, MCM-C, MultiChip modules ceramics, cost reduction, RTD, research and technology development

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Chicago
Illyefalvi-Vitez, Z, Alfons Vervaet, André Van Calster, N Sinnadurai, M Hrovat, P Svasta, E Toth, D Belavic, R Ionescu, and W Dennehy. 1999. “Cheap Multichip Modules.” Informacije Midem-journal of Microelectronics Electronic Components and Materials 29 (2): 71–78.
APA
Illyefalvi-Vitez, Z, Vervaet, A., Van Calster, A., Sinnadurai, N., Hrovat, M., Svasta, P., Toth, E., et al. (1999). Cheap multichip modules. INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS, 29(2), 71–78.
Vancouver
1.
Illyefalvi-Vitez Z, Vervaet A, Van Calster A, Sinnadurai N, Hrovat M, Svasta P, et al. Cheap multichip modules. INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS. 1999;29(2):71–8.
MLA
Illyefalvi-Vitez, Z, Alfons Vervaet, André Van Calster, et al. “Cheap Multichip Modules.” INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS 29.2 (1999): 71–78. Print.
@article{294076,
  abstract     = {The opportunity for mutual benefit across Europe to develop low-cost MCM technologies arose from recognition of the scientific skills and design and prototyping capabilities in organic and inorganic circuits in countries of Central Europe. As a results, the leading research institutions and small/medium-size enterprises of Hungary, Romania and Slovenia together with relevant institutions of the United Kingdom and Belgium proposed and received approval for an European Union INCO-COPERNICUS project (IC15-CT96-0743) {\textacutedbl}Establishment of Fast Prototyping Low Cost Multichip Module Technology Facilities in Eastern Europe for the Benefit of European Industry{\textacutedbl} (Cheap MultiChip Modules) to establish fast prototyping low cost multichip module (MCM) technology facilities. The project commenced in May 1997. MCM Technologies include the design, manufacturing, assembling and testing phases. The tasks of the Project are divided among the participants in accordance with these technological phases and conforming to their interest and capability in the field. Design is the task of the Rumanian Partners. They have installed CAD systems and developed circuit designs and simulations to determine the design rules and preferences for MCMs. Manufacturing is the task of the Hungarian and Slovenian Partners. They are focusing their laminate and ceramics capabilities towards MCM-L and MCM-C manufacturing and upgrading test technologies up to a level to fulfill the low cost, fast prototyping requirements of the participating Central European Countries (and later Europe-wide). The Hungarian Partner is also establishing mounting and bonding facilities for assembling MCMs in collaboration with the UK and Belgian Partners, exploiting their high level experience in the fields of microjoining and test technologies. The final test of demonstration modules is also the task of the Belgian Partner. The evaluation of the results in accordance with the manufacturing, application and economic aspects will be the task of all Partners with the leadership of the Hungarian Partner. The Project is carried out in close cc-operation of all Partners. In order to disseminate information for and about the Project, the Partnership participates in conferences, organizes seminars and training courses for themselves and for small and medium size enterprises who show interest in the prototyping technology of MCMs. Considerable progress has been made in the design facilities by the Rumanian Partner, and in the refinement of the printed circuit board (PCB) technology at Budapest, including laser patterning of MCM-Ls. Diffusion patterning and ceramics technology skills in Slovenia are enabling MCM-C prototyping to be demonstrated and further developed.},
  author       = {Illyefalvi-Vitez, Z and Vervaet, Alfons and Van Calster, Andr{\'e} and Sinnadurai, N and Hrovat, M and Svasta, P and Toth, E and Belavic, D and Ionescu, R and Dennehy, W},
  issn         = {0352-9045},
  journal      = {INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS},
  keyword      = {MultiChip Modules,MCM,MCM Technology,cheap modules,MCM-L,MultiChip modules laminates,MCM-C,MultiChip modules ceramics,cost reduction,RTD,research and technology development},
  language     = {dut},
  number       = {2},
  pages        = {71--78},
  title        = {Cheap multichip modules},
  volume       = {29},
  year         = {1999},
}

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