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Multi-scale modeling of direct copper plating on resistive non-copper substrates

(2012) ECS Meeting Abstracts. MA2012-02(34).
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Chicago
Yang, Liu , Aleksandar Radisic, Magi Margalit Nagar, Johan Deconinck, Leonardus Leunissen, Philippe M. Vereecken, and Alan C. West. 2012. “Multi-scale Modeling of Direct Copper Plating on Resistive Non-copper Substrates.” In ECS Meeting Abstracts. Vol. MA2012–02. Electrochemical Society (ECS).
APA
Yang, L., Radisic, A., Nagar, M. M., Deconinck, J., Leunissen, L., Vereecken, P. M., & West, A. C. (2012). Multi-scale modeling of direct copper plating on resistive non-copper substrates. ECS Meeting Abstracts (Vol. MA2012–02). Presented at the 222nd ECS Meeting, Electrochemical Society (ECS).
Vancouver
1.
Yang L, Radisic A, Nagar MM, Deconinck J, Leunissen L, Vereecken PM, et al. Multi-scale modeling of direct copper plating on resistive non-copper substrates. ECS Meeting Abstracts. Electrochemical Society (ECS); 2012.
MLA
Yang, Liu , Aleksandar Radisic, Magi Margalit Nagar, et al. “Multi-scale Modeling of Direct Copper Plating on Resistive Non-copper Substrates.” ECS Meeting Abstracts. Vol. MA2012–02. Electrochemical Society (ECS), 2012. Print.
@inproceedings{2915397,
  articleno    = {abstract 2738},
  author       = {Yang, Liu  and Radisic, Aleksandar  and Nagar, Magi Margalit and Deconinck, Johan  and Leunissen, Leonardus  and Vereecken, Philippe M.  and West, Alan C. },
  booktitle    = {ECS Meeting Abstracts},
  language     = {eng},
  location     = {Honolulu, HI, USA},
  number       = {34},
  publisher    = {Electrochemical Society (ECS)},
  title        = {Multi-scale modeling of direct copper plating on resistive non-copper substrates},
  url          = {http://ma.ecsdl.org/content/MA2012-02/34/2738.abstract},
  volume       = {MA2012-02},
  year         = {2012},
}