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Exploration of process window for fill of sub 30 nm features by direct plating

(2012) ECS Meeting Abstracts. MA2012-02(34).
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Keywords
suppressor, Direct copper plating, featur filling

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Please use this url to cite or link to this publication:

Chicago
Nagar, Magi Margalit, Aleksandar Radisic, Katrien Strubbe, and Philippe M Vereecken. 2012. “Exploration of Process Window for Fill of Sub 30 Nm Features by Direct Plating.” In ECS Meeting Abstracts. Vol. MA2012–02. Electrochemical Society (ECS).
APA
Nagar, M. M., Radisic, A., Strubbe, K., & Vereecken, P. M. (2012). Exploration of process window for fill of sub 30 nm features by direct plating. ECS Meeting Abstracts (Vol. MA2012–02). Presented at the 222nd ECS Meeting, Electrochemical Society (ECS).
Vancouver
1.
Nagar MM, Radisic A, Strubbe K, Vereecken PM. Exploration of process window for fill of sub 30 nm features by direct plating. ECS Meeting Abstracts. Electrochemical Society (ECS); 2012.
MLA
Nagar, Magi Margalit, Aleksandar Radisic, Katrien Strubbe, et al. “Exploration of Process Window for Fill of Sub 30 Nm Features by Direct Plating.” ECS Meeting Abstracts. Vol. MA2012–02. Electrochemical Society (ECS), 2012. Print.
@inproceedings{2915385,
  articleno    = {abstract 2733},
  author       = {Nagar, Magi Margalit and Radisic, Aleksandar  and Strubbe, Katrien and Vereecken, Philippe M},
  booktitle    = {ECS Meeting Abstracts},
  keywords     = {suppressor,Direct copper plating,featur filling},
  language     = {eng},
  location     = {Honolulu, HI, USA},
  number       = {34},
  publisher    = {Electrochemical Society (ECS)},
  title        = {Exploration of process window for fill of sub 30 nm features by direct plating},
  url          = {http://ma.ecsdl.org/content/MA2012-02/34/2733.abstract},
  volume       = {MA2012-02},
  year         = {2012},
}