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Exploration of process window for fill of sub 30 nm features by direct plating

(2012) ECS Meeting Abstracts. MA2012-02(34).
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Keywords
suppressor, Direct copper plating, featur filling

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Please use this url to cite or link to this publication:

MLA
Nagar, Magi Margalit, et al. “Exploration of Process Window for Fill of Sub 30 Nm Features by Direct Plating.” ECS Meeting Abstracts, vol. MA2012-02, no. 34, Electrochemical Society (ECS), 2012.
APA
Nagar, M. M., Radisic, A., Strubbe, K., & Vereecken, P. M. (2012). Exploration of process window for fill of sub 30 nm features by direct plating. In ECS Meeting Abstracts (Vol. MA2012-02). Honolulu, HI, USA: Electrochemical Society (ECS).
Chicago author-date
Nagar, Magi Margalit, Aleksandar Radisic, Katrien Strubbe, and Philippe M Vereecken. 2012. “Exploration of Process Window for Fill of Sub 30 Nm Features by Direct Plating.” In ECS Meeting Abstracts. Vol. MA2012-02. Electrochemical Society (ECS).
Chicago author-date (all authors)
Nagar, Magi Margalit, Aleksandar Radisic, Katrien Strubbe, and Philippe M Vereecken. 2012. “Exploration of Process Window for Fill of Sub 30 Nm Features by Direct Plating.” In ECS Meeting Abstracts. Vol. MA2012-02. Electrochemical Society (ECS).
Vancouver
1.
Nagar MM, Radisic A, Strubbe K, Vereecken PM. Exploration of process window for fill of sub 30 nm features by direct plating. In: ECS Meeting Abstracts. Electrochemical Society (ECS); 2012.
IEEE
[1]
M. M. Nagar, A. Radisic, K. Strubbe, and P. M. Vereecken, “Exploration of process window for fill of sub 30 nm features by direct plating,” in ECS Meeting Abstracts, Honolulu, HI, USA, 2012, vol. MA2012-02, no. 34.
@inproceedings{2915385,
  articleno    = {abstract 2733},
  author       = {Nagar, Magi Margalit and Radisic, Aleksandar and Strubbe, Katrien and Vereecken, Philippe M},
  booktitle    = {ECS Meeting Abstracts},
  keywords     = {suppressor,Direct copper plating,featur filling},
  language     = {eng},
  location     = {Honolulu, HI, USA},
  number       = {34},
  publisher    = {Electrochemical Society (ECS)},
  title        = {Exploration of process window for fill of sub 30 nm features by direct plating},
  url          = {http://ma.ecsdl.org/content/MA2012-02/34/2733.abstract},
  volume       = {MA2012-02},
  year         = {2012},
}