Advanced search

Anisotropie Conductive Adhesives for High Density Interconnections. Proc. of the lste Eur. Conf. on Electron. Packaging Techn., DVS, pp. 66-68, 1994.

Author
Organization

Citation

Please use this url to cite or link to this publication:

Chicago
Van Calster, André, Johan De Baets, Jan Vanfleteren, A DRAVET, Koenraad Allaert, E CORTES, K DECKELMAN, and G SCHOLS. “Anisotropie Conductive Adhesives for High Density Interconnections. Proc. of the Lste Eur. Conf. on Electron. Packaging Techn., DVS, Pp. 66-68, 1994.” In .
APA
Van Calster, A., De Baets, J., Vanfleteren, J., DRAVET, A., Allaert, K., CORTES, E., DECKELMAN, K., et al. (n.d.). Anisotropie Conductive Adhesives for High Density Interconnections. Proc. of the lste Eur. Conf. on Electron. Packaging Techn., DVS, pp. 66-68, 1994.
Vancouver
1.
Van Calster A, De Baets J, Vanfleteren J, DRAVET A, Allaert K, CORTES E, et al. Anisotropie Conductive Adhesives for High Density Interconnections. Proc. of the lste Eur. Conf. on Electron. Packaging Techn., DVS, pp. 66-68, 1994.
MLA
Van Calster, André, Johan De Baets, Jan Vanfleteren, et al. “Anisotropie Conductive Adhesives for High Density Interconnections. Proc. of the Lste Eur. Conf. on Electron. Packaging Techn., DVS, Pp. 66-68, 1994.” Print.
@inproceedings{246137,
  author       = {Van Calster, Andr{\'e} and De Baets, Johan and Vanfleteren, Jan and DRAVET, A and Allaert, Koenraad and CORTES, E and DECKELMAN, K and SCHOLS, G},
  language     = {eng},
  title        = {Anisotropie Conductive Adhesives for High Density Interconnections. Proc. of the lste Eur. Conf. on Electron. Packaging Techn., DVS, pp. 66-68, 1994.},
}