Academic Bibliography

 Search 200 years of publications by Ghent University researchers.
Advanced search
Add to list
  1. Search results
  2. Accurate characterization of a high-s...

Accurate characterization of a high-speed and high-density multichip module connector. IEEE Topical Meeting on Electrical Performance of Electronic Packaging, Tucson, USA, 22-24 Apr. 1992, pp. 131-133.

Luc Martens (UGent) , Peter Degraeuwe, Daniël De Zutter (UGent) , R Bargain and D Mor-Lion
(1992)
Author
Organization

Citation

Please use this url to cite or link to this publication:

MLA
Martens, Luc, et al. Accurate Characterization of a High-Speed and High-Density Multichip Module Connector. IEEE Topical Meeting on Electrical Performance of Electronic Packaging, Tucson, USA, 22-24 Apr. 1992, Pp. 131-133. 1992.
APA
Martens, L., Degraeuwe, P., De Zutter, D., Bargain, R., & Mor-Lion, D. (1992). Accurate characterization of a high-speed and high-density multichip module connector. IEEE Topical Meeting on Electrical Performance of Electronic Packaging, Tucson, USA, 22-24 Apr. 1992, pp. 131-133.
Chicago author-date
Martens, Luc, Peter Degraeuwe, Daniël De Zutter, R Bargain, and D Mor-Lion. 1992. “Accurate Characterization of a High-Speed and High-Density Multichip Module Connector. IEEE Topical Meeting on Electrical Performance of Electronic Packaging, Tucson, USA, 22-24 Apr. 1992, Pp. 131-133.”
Chicago author-date (all authors)
Martens, Luc, Peter Degraeuwe, Daniël De Zutter, R Bargain, and D Mor-Lion. 1992. “Accurate Characterization of a High-Speed and High-Density Multichip Module Connector. IEEE Topical Meeting on Electrical Performance of Electronic Packaging, Tucson, USA, 22-24 Apr. 1992, Pp. 131-133.”
Vancouver
1.
Martens L, Degraeuwe P, De Zutter D, Bargain R, Mor-Lion D. Accurate characterization of a high-speed and high-density multichip module connector. IEEE Topical Meeting on Electrical Performance of Electronic Packaging, Tucson, USA, 22-24 Apr. 1992, pp. 131-133. 1992.
IEEE
[1]
L. Martens, P. Degraeuwe, D. De Zutter, R. Bargain, and D. Mor-Lion, “Accurate characterization of a high-speed and high-density multichip module connector. IEEE Topical Meeting on Electrical Performance of Electronic Packaging, Tucson, USA, 22-24 Apr. 1992, pp. 131-133.” 1992.
@misc{225927,
  author       = {{Martens, Luc and Degraeuwe, Peter and De Zutter, Daniël and Bargain, R and Mor-Lion, D}},
  language     = {{eng}},
  title        = {{Accurate characterization of a high-speed and high-density multichip module connector. IEEE Topical Meeting on Electrical Performance of Electronic Packaging, Tucson, USA, 22-24 Apr. 1992, pp. 131-133.}},
  year         = {{1992}},
}