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Comparison of different flex materials in high density flip chip on flex applications

(2003) MICROELECTRONICS RELIABILITY. 43(3). p.445-451
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Chicago
PALM, P, J MAATTANEN, Y DE MAQUILLE, A PICAULT, Jan Vanfleteren, and Bjorn Vandecasteele. 2003. “Comparison of Different Flex Materials in High Density Flip Chip on Flex Applications.” Microelectronics Reliability 43 (3): 445–451.
APA
PALM, P., MAATTANEN, J., DE MAQUILLE, Y., PICAULT, A., Vanfleteren, J., & Vandecasteele, B. (2003). Comparison of different flex materials in high density flip chip on flex applications. MICROELECTRONICS RELIABILITY, 43(3), 445–451.
Vancouver
1.
PALM P, MAATTANEN J, DE MAQUILLE Y, PICAULT A, Vanfleteren J, Vandecasteele B. Comparison of different flex materials in high density flip chip on flex applications. MICROELECTRONICS RELIABILITY. PERGAMON-ELSEVIER SCIENCE LTD; 2003;43(3):445–51.
MLA
PALM, P, J MAATTANEN, Y DE MAQUILLE, et al. “Comparison of Different Flex Materials in High Density Flip Chip on Flex Applications.” MICROELECTRONICS RELIABILITY 43.3 (2003): 445–451. Print.
@article{219484,
  author       = {PALM, P and MAATTANEN, J and DE MAQUILLE, Y and PICAULT, A and Vanfleteren, Jan and Vandecasteele, Bjorn},
  issn         = {0026-2714},
  journal      = {MICROELECTRONICS RELIABILITY},
  language     = {eng},
  number       = {3},
  pages        = {445--451},
  publisher    = {PERGAMON-ELSEVIER SCIENCE LTD},
  title        = {Comparison of different flex materials in high density flip chip on flex applications},
  volume       = {43},
  year         = {2003},
}

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