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Thermal expansion of the isostructural PtSi and NiSi: Negative expansion coefficient in NiSi and stress effects in thin films

(2003) JOURNAL OF APPLIED PHYSICS. 93(5). p.2510-2515
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Chicago
Detavernier, Christophe, C LAVOIE, and FM D’HEURLE. 2003. “Thermal Expansion of the Isostructural PtSi and NiSi: Negative Expansion Coefficient in NiSi and Stress Effects in Thin Films.” Journal of Applied Physics 93 (5): 2510–2515.
APA
Detavernier, C., LAVOIE, C., & D’HEURLE, F. (2003). Thermal expansion of the isostructural PtSi and NiSi: Negative expansion coefficient in NiSi and stress effects in thin films. JOURNAL OF APPLIED PHYSICS, 93(5), 2510–2515.
Vancouver
1.
Detavernier C, LAVOIE C, D’HEURLE F. Thermal expansion of the isostructural PtSi and NiSi: Negative expansion coefficient in NiSi and stress effects in thin films. JOURNAL OF APPLIED PHYSICS. AMER INST PHYSICS; 2003;93(5):2510–5.
MLA
Detavernier, Christophe, C LAVOIE, and FM D’HEURLE. “Thermal Expansion of the Isostructural PtSi and NiSi: Negative Expansion Coefficient in NiSi and Stress Effects in Thin Films.” JOURNAL OF APPLIED PHYSICS 93.5 (2003): 2510–2515. Print.
@article{216638,
  author       = {Detavernier, Christophe and LAVOIE, C and D'HEURLE, FM},
  issn         = {0021-8979},
  journal      = {JOURNAL OF APPLIED PHYSICS},
  language     = {eng},
  number       = {5},
  pages        = {2510--2515},
  publisher    = {AMER INST PHYSICS},
  title        = {Thermal expansion of the isostructural PtSi and NiSi: Negative expansion coefficient in NiSi and stress effects in thin films},
  volume       = {93},
  year         = {2003},
}

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