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Staggered heat sinks, advantages and disadvantages

O LEON, Gilbert De Mey (UGent) , Erik Dick (UGent) and Jan Vierendeels (UGent)
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Chicago
LEON, O, Gilbert De Mey, Erik Dick, and Jan Vierendeels. 2003. “Staggered Heat Sinks, Advantages and Disadvantages.” In Proceedings of the Tenth International Conference on Mixed Design of Integrated Circuits and Systems, 367–372.
APA
LEON, O, De Mey, G., Dick, E., & Vierendeels, J. (2003). Staggered heat sinks, advantages and disadvantages. Proceedings of the Tenth International Conference on Mixed Design of Integrated Circuits and Systems (pp. 367–372).
Vancouver
1.
LEON O, De Mey G, Dick E, Vierendeels J. Staggered heat sinks, advantages and disadvantages. Proceedings of the Tenth International Conference on Mixed Design of Integrated Circuits and Systems. 2003. p. 367–72.
MLA
LEON, O, Gilbert De Mey, Erik Dick, et al. “Staggered Heat Sinks, Advantages and Disadvantages.” Proceedings of the Tenth International Conference on Mixed Design of Integrated Circuits and Systems. 2003. 367–372. Print.
@inproceedings{214453,
  author       = {LEON, O and De Mey, Gilbert and Dick, Erik and Vierendeels, Jan},
  booktitle    = {Proceedings of the Tenth International Conference on Mixed Design of Integrated Circuits and Systems},
  isbn         = {90-386-2954-0},
  pages        = {367--372},
  title        = {Staggered heat sinks, advantages and disadvantages},
  year         = {2003},
}