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Numerical solution for the radiative heat distribution in a cylindrical enclosure

Cosmin Dan, Gilbert De Mey UGent and Erik Dick UGent (2003) Proceedings of the Tenth International Conference on Mixed Design of Integrated Circuits and Systems. p.352-355
Please use this url to cite or link to this publication:
author
organization
year
type
conference
publication status
published
subject
in
Proceedings of the Tenth International Conference on Mixed Design of Integrated Circuits and Systems
pages
352-355 pages
ISBN
83-7283-095-9
UGent publication?
yes
classification
C1
id
214430
handle
http://hdl.handle.net/1854/LU-214430
date created
2004-05-05 08:42:00
date last changed
2016-12-19 15:35:37
@inproceedings{214430,
  author       = {Dan, Cosmin and De Mey, Gilbert and Dick, Erik},
  booktitle    = {Proceedings of the Tenth International Conference on Mixed Design of Integrated Circuits and Systems},
  isbn         = {83-7283-095-9},
  pages        = {352--355},
  title        = {Numerical solution for the radiative heat distribution in a cylindrical enclosure},
  year         = {2003},
}

Chicago
Dan, Cosmin, Gilbert De Mey, and Erik Dick. 2003. “Numerical Solution for the Radiative Heat Distribution in a Cylindrical Enclosure.” In Proceedings of the Tenth International Conference on Mixed Design of Integrated Circuits and Systems, 352–355.
APA
Dan, Cosmin, De Mey, G., & Dick, E. (2003). Numerical solution for the radiative heat distribution in a cylindrical enclosure. Proceedings of the Tenth International Conference on Mixed Design of Integrated Circuits and Systems (pp. 352–355).
Vancouver
1.
Dan C, De Mey G, Dick E. Numerical solution for the radiative heat distribution in a cylindrical enclosure. Proceedings of the Tenth International Conference on Mixed Design of Integrated Circuits and Systems. 2003. p. 352–5.
MLA
Dan, Cosmin, Gilbert De Mey, and Erik Dick. “Numerical Solution for the Radiative Heat Distribution in a Cylindrical Enclosure.” Proceedings of the Tenth International Conference on Mixed Design of Integrated Circuits and Systems. 2003. 352–355. Print.