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Novel coupling and packaging approaches for optical interconnects

Bram Van Hoe (UGent) , Erwin Bosman (UGent) , Jeroen Missinne (UGent) , Sandeep Kalathimekkad (UGent) , Geert Van Steenberge (UGent) and Peter Van Daele (UGent)
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Abstract
We present the design and fabrication of a complete optical interconnection scheme including the optoelectronic package, containing driving Vertical Cavity Surface Emitting Lasers (VCSELs) and read-out photodiode (PDs), the coupling scheme of the fiber or waveguide interconnect and the fabrication technology of the waveguide structures itself. Both the optoelectronic package and the waveguide part are fabricated using polymer materials resulting in a low-cost, flexible interconnection scheme. The optoelectronic package consists of an ultra-thin (20 mu m) chip embedded in a flexible polymer stack, connected through metalized microvias using thin film deposition steps. A 45 deflecting micromirror is used to couple this optoelectronic package to an optical fiber or an optical waveguide. The waveguiding structures can be integrated with the coupling plug leading to a 1 step alignment process which significantly reduces the coupling losses. Flexible and stretchable multimode polymer waveguides are also developed to end up with a fully flexible optical interconnect for short (waveguide) or long distance (fiber) communication or for application in sensing.
Keywords
flexible package, coupling, integration, micromirror, optical interconnect, polymer waveguide, stretchable waveguide

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MLA
Van Hoe, Bram, et al. “Novel Coupling and Packaging Approaches for Optical Interconnects.” PROCEEDINGS OF SPIE, THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, edited by AL Glebov and RT Chen, vol. 8267, SPIE-INT SOC OPTICAL ENGINEERING, 2012.
APA
Van Hoe, B., Bosman, E., Missinne, J., Kalathimekkad, S., Van Steenberge, G., & Van Daele, P. (2012). Novel coupling and packaging approaches for optical interconnects. In A. Glebov & R. Chen (Eds.), PROCEEDINGS OF SPIE, THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING (Vol. 8267). Bellingham, WA, USA: SPIE-INT SOC OPTICAL ENGINEERING.
Chicago author-date
Van Hoe, Bram, Erwin Bosman, Jeroen Missinne, Sandeep Kalathimekkad, Geert Van Steenberge, and Peter Van Daele. 2012. “Novel Coupling and Packaging Approaches for Optical Interconnects.” In PROCEEDINGS OF SPIE, THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, edited by AL Glebov and RT Chen. Vol. 8267. Bellingham, WA, USA: SPIE-INT SOC OPTICAL ENGINEERING.
Chicago author-date (all authors)
Van Hoe, Bram, Erwin Bosman, Jeroen Missinne, Sandeep Kalathimekkad, Geert Van Steenberge, and Peter Van Daele. 2012. “Novel Coupling and Packaging Approaches for Optical Interconnects.” In PROCEEDINGS OF SPIE, THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, ed by. AL Glebov and RT Chen. Vol. 8267. Bellingham, WA, USA: SPIE-INT SOC OPTICAL ENGINEERING.
Vancouver
1.
Van Hoe B, Bosman E, Missinne J, Kalathimekkad S, Van Steenberge G, Van Daele P. Novel coupling and packaging approaches for optical interconnects. In: Glebov A, Chen R, editors. PROCEEDINGS OF SPIE, THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING. Bellingham, WA, USA: SPIE-INT SOC OPTICAL ENGINEERING; 2012.
IEEE
[1]
B. Van Hoe, E. Bosman, J. Missinne, S. Kalathimekkad, G. Van Steenberge, and P. Van Daele, “Novel coupling and packaging approaches for optical interconnects,” in PROCEEDINGS OF SPIE, THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, San Francisco, CA, USA, 2012, vol. 8267.
@inproceedings{2121611,
  abstract     = {We present the design and fabrication of a complete optical interconnection scheme including the optoelectronic package, containing driving Vertical Cavity Surface Emitting Lasers (VCSELs) and read-out photodiode (PDs), the coupling scheme of the fiber or waveguide interconnect and the fabrication technology of the waveguide structures itself. Both the optoelectronic package and the waveguide part are fabricated using polymer materials resulting in a low-cost, flexible interconnection scheme. The optoelectronic package consists of an ultra-thin (20 mu m) chip embedded in a flexible polymer stack, connected through metalized microvias using thin film deposition steps. A 45 deflecting micromirror is used to couple this optoelectronic package to an optical fiber or an optical waveguide. The waveguiding structures can be integrated with the coupling plug leading to a 1 step alignment process which significantly reduces the coupling losses. Flexible and stretchable multimode polymer waveguides are also developed to end up with a fully flexible optical interconnect for short (waveguide) or long distance (fiber) communication or for application in sensing.},
  articleno    = {82670T},
  author       = {Van Hoe, Bram and Bosman, Erwin and Missinne, Jeroen and Kalathimekkad, Sandeep and Van Steenberge, Geert and Van Daele, Peter},
  booktitle    = {PROCEEDINGS OF SPIE, THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING},
  editor       = {Glebov, AL and Chen, RT},
  isbn         = {9780819489104},
  issn         = {0277-786X},
  keywords     = {flexible package,coupling,integration,micromirror,optical interconnect,polymer waveguide,stretchable waveguide},
  language     = {eng},
  location     = {San Francisco, CA, USA},
  pages        = {11},
  publisher    = {SPIE-INT SOC OPTICAL ENGINEERING},
  title        = {Novel coupling and packaging approaches for optical interconnects},
  url          = {http://dx.doi.org/10.1117/12.913760},
  volume       = {8267},
  year         = {2012},
}

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