Ghent University Academic Bibliography

Advanced

Ultra-low copper baths for sub-35 nm copper interconnects

Tanya Atanasova UGent, Katrien Strubbe UGent, Laureen Carbonell, Rudy Caluwaerts, Zsolt Tokei and Philippe Vereecken (2011) ECS Meeting Abstracts. 41.
Please use this url to cite or link to this publication:
author
organization
year
type
conference
publication status
published
subject
keyword
copper plating, filling
in
ECS Meeting Abstracts
volume
41
article_number
abstract F4-2330
publisher
ECS, The Electrochemical Society
place of publication
Penington, NY, USA
conference name
220th ECS Meeting
conference location
Boston, MA, USA
conference start
2009-10-04
conference end
2009-10-09
language
English
UGent publication?
yes
classification
C3
id
2078506
handle
http://hdl.handle.net/1854/LU-2078506
date created
2012-03-30 16:28:30
date last changed
2012-04-12 14:31:12
@inproceedings{2078506,
  articleno    = {abstract F4-2330},
  author       = {Atanasova, Tanya and Strubbe, Katrien and Carbonell, Laureen and Caluwaerts, Rudy and Tokei, Zsolt and Vereecken, Philippe},
  booktitle    = {ECS Meeting Abstracts},
  keyword      = {copper plating,filling},
  language     = {eng},
  location     = {Boston, MA, USA},
  publisher    = {ECS, The Electrochemical Society},
  title        = {Ultra-low copper baths for sub-35 nm copper interconnects},
  volume       = {41},
  year         = {2011},
}

Chicago
Atanasova, Tanya, Katrien Strubbe, Laureen Carbonell, Rudy Caluwaerts, Zsolt Tokei, and Philippe Vereecken. 2011. “Ultra-low Copper Baths for Sub-35 Nm Copper Interconnects.” In ECS Meeting Abstracts. Vol. 41. Penington, NY, USA: ECS, The Electrochemical Society.
APA
Atanasova, T., Strubbe, K., Carbonell, L., Caluwaerts, R., Tokei, Z., & Vereecken, P. (2011). Ultra-low copper baths for sub-35 nm copper interconnects. ECS Meeting Abstracts (Vol. 41). Presented at the 220th ECS Meeting, Penington, NY, USA: ECS, The Electrochemical Society.
Vancouver
1.
Atanasova T, Strubbe K, Carbonell L, Caluwaerts R, Tokei Z, Vereecken P. Ultra-low copper baths for sub-35 nm copper interconnects. ECS Meeting Abstracts. Penington, NY, USA: ECS, The Electrochemical Society; 2011.
MLA
Atanasova, Tanya, Katrien Strubbe, Laureen Carbonell, et al. “Ultra-low Copper Baths for Sub-35 Nm Copper Interconnects.” ECS Meeting Abstracts. Vol. 41. Penington, NY, USA: ECS, The Electrochemical Society, 2011. Print.