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Ultra-low copper baths for sub-35 nm copper interconnects

Author
Organization
Keywords
copper plating, filling

Citation

Please use this url to cite or link to this publication:

Chicago
Atanasova, Tanya, Katrien Strubbe, Laureen Carbonell, Rudy Caluwaerts, Zsolt Tokei, and Philippe Vereecken. 2011. “Ultra-low Copper Baths for Sub-35 Nm Copper Interconnects.” In ECS Meeting Abstracts. Vol. 41. Penington, NY, USA: ECS, The Electrochemical Society.
APA
Atanasova, T., Strubbe, K., Carbonell, L., Caluwaerts, R., Tokei, Z., & Vereecken, P. (2011). Ultra-low copper baths for sub-35 nm copper interconnects. ECS Meeting Abstracts (Vol. 41). Presented at the 220th ECS Meeting, Penington, NY, USA: ECS, The Electrochemical Society.
Vancouver
1.
Atanasova T, Strubbe K, Carbonell L, Caluwaerts R, Tokei Z, Vereecken P. Ultra-low copper baths for sub-35 nm copper interconnects. ECS Meeting Abstracts. Penington, NY, USA: ECS, The Electrochemical Society; 2011.
MLA
Atanasova, Tanya, Katrien Strubbe, Laureen Carbonell, et al. “Ultra-low Copper Baths for Sub-35 Nm Copper Interconnects.” ECS Meeting Abstracts. Vol. 41. Penington, NY, USA: ECS, The Electrochemical Society, 2011. Print.
@inproceedings{2078506,
  articleno    = {abstract F4-2330},
  author       = {Atanasova, Tanya and Strubbe, Katrien and Carbonell, Laureen and Caluwaerts, Rudy and Tokei, Zsolt and Vereecken, Philippe},
  booktitle    = {ECS Meeting Abstracts},
  keyword      = {copper plating,filling},
  language     = {eng},
  location     = {Boston, MA, USA},
  publisher    = {ECS, The Electrochemical Society},
  title        = {Ultra-low copper baths for sub-35 nm copper interconnects},
  volume       = {41},
  year         = {2011},
}