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Copper(I)-containing ionic liquids for high-rate electrodeposition

(2011) CHEMISTRY-A EUROPEAN JOURNAL. 17(18). p.5054-5059
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Abstract
New metal-containing ionic liquids [Cu(CH(3)CN)n][Tf(2)N] (n = 2, 4; Tf(2)N = bis(trifluoromethylsulfonyl)amide) have been synthesised and used as a non-aqueous electrolyte for the electrodeposition of copper at current densities greater than 25 Adm(-2). The tetrahedral copper(I)-containing cation in [Cu(CH(3)CN)(4)] [Tf(2)N] is structurally analogous to quaternary ammonium and phosphonium ionic liquids and overcomes problems of metal solubility and mass transport. Two CH(3)CN ligands are removed at elevated temperatures to give [Cu(CH(3)CN)(2)] [Tf(2)N], which can be used as a concentrated non-aqueous electrolyte. The structural and electrochemical characterisation of these compounds is described herein.
Keywords
electrodeposition, copper, ionic liquids, liquid metal salts, N ligands, TEMPERATURE MOLTEN-SALTS, COMPLEXES, METALS, ALUMINUM, DENSITY, SEMICONDUCTORS, CATALYSIS, VISCOSITY, MIXTURES, CRYSTALS

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Citation

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Chicago
Brooks, Neil R, Stijn Schaltin, Kristof Van Hecke, Luc Van Meervelt, Koen Binnemans, and Jan Fransaer. 2011. “Copper(I)-containing Ionic Liquids for High-rate Electrodeposition.” Chemistry-a European Journal 17 (18): 5054–5059.
APA
Brooks, N. R., Schaltin, S., Van Hecke, K., Van Meervelt, L., Binnemans, K., & Fransaer, J. (2011). Copper(I)-containing ionic liquids for high-rate electrodeposition. CHEMISTRY-A EUROPEAN JOURNAL, 17(18), 5054–5059.
Vancouver
1.
Brooks NR, Schaltin S, Van Hecke K, Van Meervelt L, Binnemans K, Fransaer J. Copper(I)-containing ionic liquids for high-rate electrodeposition. CHEMISTRY-A EUROPEAN JOURNAL. 2011;17(18):5054–9.
MLA
Brooks, Neil R, Stijn Schaltin, Kristof Van Hecke, et al. “Copper(I)-containing Ionic Liquids for High-rate Electrodeposition.” CHEMISTRY-A EUROPEAN JOURNAL 17.18 (2011): 5054–5059. Print.
@article{2045548,
  abstract     = {New metal-containing ionic liquids [Cu(CH(3)CN)n][Tf(2)N] (n = 2, 4; Tf(2)N = bis(trifluoromethylsulfonyl)amide) have been synthesised and used as a non-aqueous electrolyte for the electrodeposition of copper at current densities greater than 25 Adm(-2). The tetrahedral copper(I)-containing cation in [Cu(CH(3)CN)(4)] [Tf(2)N] is structurally analogous to quaternary ammonium and phosphonium ionic liquids and overcomes problems of metal solubility and mass transport. Two CH(3)CN ligands are removed at elevated temperatures to give [Cu(CH(3)CN)(2)] [Tf(2)N], which can be used as a concentrated non-aqueous electrolyte. The structural and electrochemical characterisation of these compounds is described herein.},
  author       = {Brooks, Neil R and Schaltin, Stijn and Van Hecke, Kristof and Van Meervelt, Luc and Binnemans, Koen and Fransaer, Jan},
  issn         = {0947-6539},
  journal      = {CHEMISTRY-A EUROPEAN JOURNAL},
  keyword      = {electrodeposition,copper,ionic liquids,liquid metal salts,N ligands,TEMPERATURE MOLTEN-SALTS,COMPLEXES,METALS,ALUMINUM,DENSITY,SEMICONDUCTORS,CATALYSIS,VISCOSITY,MIXTURES,CRYSTALS},
  language     = {eng},
  number       = {18},
  pages        = {5054--5059},
  title        = {Copper(I)-containing ionic liquids for high-rate electrodeposition},
  url          = {http://dx.doi.org/10.1002/chem.201003209},
  volume       = {17},
  year         = {2011},
}

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