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ON THE INFLUENCE OF SPUTTER ETCH CLEANING ON THE SILICIDATION, THE THERMAL-STABILITY AND THE ELECTRICAL CHARACTERISTICS OF TI/P-SI CONTACTS.

(1993) SOLID-STATE ELECTRONICS. 36(5). p.753-759
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Chicago
VERCAEMST, AS, Roland Vanmeirhaeghe, Willy Laflere, Felix Cardon, W DEBOSSCHER, and RJ SCHREUTELKAMP. 1993. “On the Influence of Sputter Etch Cleaning on the Silicidation, the Thermal-stability and the Electrical Characteristics of Ti/p-si Contacts.” Solid-state Electronics 36 (5): 753–759.
APA
VERCAEMST, A., Vanmeirhaeghe, R., Laflere, W., Cardon, F., DEBOSSCHER, W., & SCHREUTELKAMP, R. (1993). ON THE INFLUENCE OF SPUTTER ETCH CLEANING ON THE SILICIDATION, THE THERMAL-STABILITY AND THE ELECTRICAL CHARACTERISTICS OF TI/P-SI CONTACTS. SOLID-STATE ELECTRONICS, 36(5), 753–759.
Vancouver
1.
VERCAEMST A, Vanmeirhaeghe R, Laflere W, Cardon F, DEBOSSCHER W, SCHREUTELKAMP R. ON THE INFLUENCE OF SPUTTER ETCH CLEANING ON THE SILICIDATION, THE THERMAL-STABILITY AND THE ELECTRICAL CHARACTERISTICS OF TI/P-SI CONTACTS. SOLID-STATE ELECTRONICS. 1993;36(5):753–9.
MLA
VERCAEMST, AS, Roland Vanmeirhaeghe, Willy Laflere, et al. “On the Influence of Sputter Etch Cleaning on the Silicidation, the Thermal-stability and the Electrical Characteristics of Ti/p-si Contacts.” SOLID-STATE ELECTRONICS 36.5 (1993): 753–759. Print.
@article{201342,
  author       = {VERCAEMST, AS and Vanmeirhaeghe, Roland and Laflere, Willy and Cardon, Felix and DEBOSSCHER, W and SCHREUTELKAMP, RJ},
  issn         = {0038-1101},
  journal      = {SOLID-STATE ELECTRONICS},
  language     = {eng},
  number       = {5},
  pages        = {753--759},
  title        = {ON THE INFLUENCE OF SPUTTER ETCH CLEANING ON THE SILICIDATION, THE THERMAL-STABILITY AND THE ELECTRICAL CHARACTERISTICS OF TI/P-SI CONTACTS.},
  volume       = {36},
  year         = {1993},
}