ON THE INFLUENCE OF SPUTTER ETCH CLEANING ON THE SILICIDATION, THE THERMAL-STABILITY AND THE ELECTRICAL CHARACTERISTICS OF TI/P-SI CONTACTS.
- Author
- AS VERCAEMST, Roland Vanmeirhaeghe (UGent) , Willy Laflere, Felix Cardon, W DEBOSSCHER and RJ SCHREUTELKAMP
- Organization
Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-201342
- MLA
- VERCAEMST, AS, et al. “ON THE INFLUENCE OF SPUTTER ETCH CLEANING ON THE SILICIDATION, THE THERMAL-STABILITY AND THE ELECTRICAL CHARACTERISTICS OF TI/P-SI CONTACTS.” SOLID-STATE ELECTRONICS, vol. 36, no. 5, 1993, pp. 753–59.
- APA
- VERCAEMST, A., Vanmeirhaeghe, R., Laflere, W., Cardon, F., DEBOSSCHER, W., & SCHREUTELKAMP, R. (1993). ON THE INFLUENCE OF SPUTTER ETCH CLEANING ON THE SILICIDATION, THE THERMAL-STABILITY AND THE ELECTRICAL CHARACTERISTICS OF TI/P-SI CONTACTS. SOLID-STATE ELECTRONICS, 36(5), 753–759.
- Chicago author-date
- VERCAEMST, AS, Roland Vanmeirhaeghe, Willy Laflere, Felix Cardon, W DEBOSSCHER, and RJ SCHREUTELKAMP. 1993. “ON THE INFLUENCE OF SPUTTER ETCH CLEANING ON THE SILICIDATION, THE THERMAL-STABILITY AND THE ELECTRICAL CHARACTERISTICS OF TI/P-SI CONTACTS.” SOLID-STATE ELECTRONICS 36 (5): 753–59.
- Chicago author-date (all authors)
- VERCAEMST, AS, Roland Vanmeirhaeghe, Willy Laflere, Felix Cardon, W DEBOSSCHER, and RJ SCHREUTELKAMP. 1993. “ON THE INFLUENCE OF SPUTTER ETCH CLEANING ON THE SILICIDATION, THE THERMAL-STABILITY AND THE ELECTRICAL CHARACTERISTICS OF TI/P-SI CONTACTS.” SOLID-STATE ELECTRONICS 36 (5): 753–759.
- Vancouver
- 1.VERCAEMST A, Vanmeirhaeghe R, Laflere W, Cardon F, DEBOSSCHER W, SCHREUTELKAMP R. ON THE INFLUENCE OF SPUTTER ETCH CLEANING ON THE SILICIDATION, THE THERMAL-STABILITY AND THE ELECTRICAL CHARACTERISTICS OF TI/P-SI CONTACTS. SOLID-STATE ELECTRONICS. 1993;36(5):753–9.
- IEEE
- [1]A. VERCAEMST, R. Vanmeirhaeghe, W. Laflere, F. Cardon, W. DEBOSSCHER, and R. SCHREUTELKAMP, “ON THE INFLUENCE OF SPUTTER ETCH CLEANING ON THE SILICIDATION, THE THERMAL-STABILITY AND THE ELECTRICAL CHARACTERISTICS OF TI/P-SI CONTACTS.,” SOLID-STATE ELECTRONICS, vol. 36, no. 5, pp. 753–759, 1993.
@article{201342,
author = {{VERCAEMST, AS and Vanmeirhaeghe, Roland and Laflere, Willy and Cardon, Felix and DEBOSSCHER, W and SCHREUTELKAMP, RJ}},
issn = {{0038-1101}},
journal = {{SOLID-STATE ELECTRONICS}},
language = {{eng}},
number = {{5}},
pages = {{753--759}},
title = {{ON THE INFLUENCE OF SPUTTER ETCH CLEANING ON THE SILICIDATION, THE THERMAL-STABILITY AND THE ELECTRICAL CHARACTERISTICS OF TI/P-SI CONTACTS.}},
volume = {{36}},
year = {{1993}},
}