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A new procedure to seal the pores of mesoporous low-k films with precondensed organosilica oligomers

(2012) CHEMICAL COMMUNICATIONS. 48(22). p.2797-2799
Author
Organization
Abstract
A new strategy to seal mesoporous low-k thin films with a pore size of 3 nm has been developed. This is achieved by spin-coating of a self-assembled carbon-bridged organosilica layer followed by a grafting with hexamethyl disilazane.
Keywords
SILICA, DIELECTRIC-CONSTANT MATERIALS, HYBRID, LAYER

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Citation

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MLA
Goethals, Frederik, et al. “A New Procedure to Seal the Pores of Mesoporous Low-k Films with Precondensed Organosilica Oligomers.” CHEMICAL COMMUNICATIONS, vol. 48, no. 22, 2012, pp. 2797–99, doi:10.1039/c2cc18017k.
APA
Goethals, F., Baklanov, M. R., Ciofi, I., Detavernier, C., Van Der Voort, P., & Van Driessche, I. (2012). A new procedure to seal the pores of mesoporous low-k films with precondensed organosilica oligomers. CHEMICAL COMMUNICATIONS, 48(22), 2797–2799. https://doi.org/10.1039/c2cc18017k
Chicago author-date
Goethals, Frederik, Mikhail R Baklanov, Ivan Ciofi, Christophe Detavernier, Pascal Van Der Voort, and Isabel Van Driessche. 2012. “A New Procedure to Seal the Pores of Mesoporous Low-k Films with Precondensed Organosilica Oligomers.” CHEMICAL COMMUNICATIONS 48 (22): 2797–99. https://doi.org/10.1039/c2cc18017k.
Chicago author-date (all authors)
Goethals, Frederik, Mikhail R Baklanov, Ivan Ciofi, Christophe Detavernier, Pascal Van Der Voort, and Isabel Van Driessche. 2012. “A New Procedure to Seal the Pores of Mesoporous Low-k Films with Precondensed Organosilica Oligomers.” CHEMICAL COMMUNICATIONS 48 (22): 2797–2799. doi:10.1039/c2cc18017k.
Vancouver
1.
Goethals F, Baklanov MR, Ciofi I, Detavernier C, Van Der Voort P, Van Driessche I. A new procedure to seal the pores of mesoporous low-k films with precondensed organosilica oligomers. CHEMICAL COMMUNICATIONS. 2012;48(22):2797–9.
IEEE
[1]
F. Goethals, M. R. Baklanov, I. Ciofi, C. Detavernier, P. Van Der Voort, and I. Van Driessche, “A new procedure to seal the pores of mesoporous low-k films with precondensed organosilica oligomers,” CHEMICAL COMMUNICATIONS, vol. 48, no. 22, pp. 2797–2799, 2012.
@article{2010227,
  abstract     = {{A new strategy to seal mesoporous low-k thin films with a pore size of 3 nm has been developed. This is achieved by spin-coating of a self-assembled carbon-bridged organosilica layer followed by a grafting with hexamethyl disilazane.}},
  author       = {{Goethals, Frederik and Baklanov, Mikhail R and Ciofi, Ivan and Detavernier, Christophe and Van Der Voort, Pascal and Van Driessche, Isabel}},
  issn         = {{1359-7345}},
  journal      = {{CHEMICAL COMMUNICATIONS}},
  keywords     = {{SILICA,DIELECTRIC-CONSTANT MATERIALS,HYBRID,LAYER}},
  language     = {{eng}},
  number       = {{22}},
  pages        = {{2797--2799}},
  title        = {{A new procedure to seal the pores of mesoporous low-k films with precondensed organosilica oligomers}},
  url          = {{http://dx.doi.org/10.1039/c2cc18017k}},
  volume       = {{48}},
  year         = {{2012}},
}

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