Advanced search
1 file | 2.31 MB
Author
Organization

Downloads

  • (...).pdf
    • full text
    • |
    • UGent only
    • |
    • PDF
    • |
    • 2.31 MB

Citation

Please use this url to cite or link to this publication:

Chicago
Carlson, Trevor, and Marco Facchini. 2011. “3D Stacking of DRAM on Logic.” In Three Dimensional System Integration : IC Stacking Process and Design, ed. Antonis Papanikolaou, Dimitrios Soudris, and Riko Radojcic, 187–210. New York, NY, USA: Springer.
APA
Carlson, T., & Facchini, M. (2011). 3D stacking of DRAM on Logic. In Antonis Papanikolaou, D. Soudris, & R. Radojcic (Eds.), Three dimensional system integration : IC stacking process and design (pp. 187–210). New York, NY, USA: Springer.
Vancouver
1.
Carlson T, Facchini M. 3D stacking of DRAM on Logic. In: Papanikolaou A, Soudris D, Radojcic R, editors. Three dimensional system integration : IC stacking process and design. New York, NY, USA: Springer; 2011. p. 187–210.
MLA
Carlson, Trevor, and Marco Facchini. “3D Stacking of DRAM on Logic.” Three Dimensional System Integration : IC Stacking Process and Design. Ed. Antonis Papanikolaou, Dimitrios Soudris, & Riko Radojcic. New York, NY, USA: Springer, 2011. 187–210. Print.
@incollection{1999461,
  author       = {Carlson, Trevor and Facchini, Marco},
  booktitle    = {Three dimensional system integration : IC stacking process and design},
  editor       = {Papanikolaou, Antonis and Soudris, Dimitrios and Radojcic, Riko},
  isbn         = {9781441909626},
  language     = {eng},
  pages        = {187--210},
  publisher    = {Springer},
  title        = {3D stacking of DRAM on Logic},
  url          = {http://dx.doi.org/10.1007/978-1-4419-0962-6\_8},
  year         = {2011},
}

Altmetric
View in Altmetric