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Macromodeling based variability analysis of an inverted embedded microstrip line

Dries Vande Ginste UGent, Daniël De Zutter UGent, Dirk Deschrijver UGent, Tom Dhaene UGent and Flavio Canavero (2011) IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS. p.153-156
abstract
A multivariate macromodel of the per unit length parameters of an inverted embedded microstrip line is built starting from a limited number of highly accurate but computationally expensive electromagnetic simulations. Besides the frequency dependency, the macromodel also encompasses the influence of a geometrical parameter that determines the shape of the cross-section of the metallic interconnect. This allows to assess the influence of the etching process through a variability analysis of the interconnect's behavior in both frequency and time domain. The analysis is carried out via a robust Monte Carlo approach, which has been made computationally feasible thanks to the macromodeling step.
Please use this url to cite or link to this publication:
author
organization
year
type
conference
publication status
published
subject
keyword
FREQUENCY-DOMAIN
in
IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS
issue title
2011 IEEE 20Th conference on electrical performance of electronic packaging and systems (EPEPS)
pages
153 - 156
publisher
IEEE
place of publication
Piscataway, NJ, USA
conference name
20th IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
conference location
San José, CA, USA
conference start
2011-10-23
conference end
2011-10-26
Web of Science type
Proceedings Paper
Web of Science id
000299429300034
ISSN
2165-4107
ISBN
9781424493999
DOI
10.1109/EPEPS.2011.6100213
language
English
UGent publication?
yes
classification
P1
copyright statement
I have transferred the copyright for this publication to the publisher
id
1965969
handle
http://hdl.handle.net/1854/LU-1965969
date created
2011-12-13 11:44:45
date last changed
2012-07-03 09:52:46
@inproceedings{1965969,
  abstract     = {A multivariate macromodel of the per unit length parameters of an inverted embedded microstrip line is built starting from a limited number of highly accurate but computationally expensive electromagnetic simulations. Besides the frequency dependency, the macromodel also encompasses the influence of a geometrical parameter that determines the shape of the cross-section of the metallic interconnect. This allows to assess the influence of the etching process through a variability analysis of the interconnect's behavior in both frequency and time domain. The analysis is carried out via a robust Monte Carlo approach, which has been made computationally feasible thanks to the macromodeling step.},
  author       = {Vande Ginste, Dries and De Zutter, Dani{\"e}l and Deschrijver, Dirk and Dhaene, Tom and Canavero, Flavio},
  booktitle    = {IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS},
  isbn         = {9781424493999},
  issn         = {2165-4107},
  keyword      = {FREQUENCY-DOMAIN},
  language     = {eng},
  location     = {San Jos{\'e}, CA, USA},
  pages        = {153--156},
  publisher    = {IEEE},
  title        = {Macromodeling based variability analysis of an inverted embedded microstrip line},
  url          = {http://dx.doi.org/10.1109/EPEPS.2011.6100213},
  year         = {2011},
}

Chicago
Vande Ginste, Dries, Daniël De Zutter, Dirk Deschrijver, Tom Dhaene, and Flavio Canavero. 2011. “Macromodeling Based Variability Analysis of an Inverted Embedded Microstrip Line.” In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS, 153–156. Piscataway, NJ, USA: IEEE.
APA
Vande Ginste, D., De Zutter, D., Deschrijver, D., Dhaene, T., & Canavero, F. (2011). Macromodeling based variability analysis of an inverted embedded microstrip line. IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS (pp. 153–156). Presented at the 20th IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Piscataway, NJ, USA: IEEE.
Vancouver
1.
Vande Ginste D, De Zutter D, Deschrijver D, Dhaene T, Canavero F. Macromodeling based variability analysis of an inverted embedded microstrip line. IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS. Piscataway, NJ, USA: IEEE; 2011. p. 153–6.
MLA
Vande Ginste, Dries, Daniël De Zutter, Dirk Deschrijver, et al. “Macromodeling Based Variability Analysis of an Inverted Embedded Microstrip Line.” IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS. Piscataway, NJ, USA: IEEE, 2011. 153–156. Print.