Ghent University Academic Bibliography

Advanced

Broadband passive RLGC(f) modeling for on-chip interconnect design

Dries Vande Ginste UGent, Dirk Deschrijver UGent, Thomas Demeester UGent, Tom Dhaene UGent and Daniël De Zutter UGent (2011) Proceedings of the 2011 international conference on electromagnetics in advanced applications and IEEE-APS topical conference on antennas and propagation in wireless communications (ICEAA 2011). p.1372-1375
abstract
To design state-of-the-art on-chip interconnect structures, efficient modeling tools are needed that accurately incorporate all substrate loss mechanisms and the finite conductivity and shape of the metallic interconnects. In this contribution, accurate broadband macromodels are conceived for the per unit length resistance (R), inductance (L), conductance (G) and capacitance (C) parameters of such on-chip interconnects. By means of adaptive frequency sampling (AFS) the simulation cost to obtain these models is small. Additionally, passivity can be assessed and enforced. The technique is applied to the analysis of an inverted embedded microstrip (IEM) line. Compared to commercial simulation software, both in frequency and time domain, excellent agreement and superior efficiency is observed, illustrating the method's applicability for on-chip design purposes.
Please use this url to cite or link to this publication:
author
organization
year
type
conference
publication status
published
subject
keyword
IBCN, frequency-domain analysis, integrated circuit design, integrated circuit interconnections, integrated circuit modelling, microstrip lines, time-domain analysis
in
Proceedings of the 2011 international conference on electromagnetics in advanced applications and IEEE-APS topical conference on antennas and propagation in wireless communications (ICEAA 2011)
pages
1372 - 1375
publisher
IEEE
place of publication
Piscataway, NJ, USA
conference name
2011 International conference on Electromagnetics in Advanced Applications (ICEAA 2011) ; IEEE-APS Topical conference on Antennas and Propagation in Wireless Communications
conference location
Torino, Italy
conference start
2011-09-12
conference end
2011-09-16
Web of Science type
Conference Paper
Web of Science id
12315316
ISBN
9781612849782
9781612849768
DOI
10.1109/ICEAA.2011.6046277
language
English
UGent publication?
yes
classification
C1
id
1965541
handle
http://hdl.handle.net/1854/LU-1965541
date created
2011-12-13 08:48:09
date last changed
2012-07-03 09:52:46
@inproceedings{1965541,
  abstract     = {To design state-of-the-art on-chip interconnect structures, efficient modeling tools are needed that accurately incorporate all substrate loss mechanisms and the finite conductivity and shape of the metallic interconnects. In this contribution, accurate broadband macromodels are conceived for the per unit length resistance (R), inductance (L), conductance (G) and capacitance (C) parameters of such on-chip interconnects. By means of adaptive frequency sampling (AFS) the simulation cost to obtain these models is small. Additionally, passivity can be assessed and enforced. The technique is applied to the analysis of an inverted embedded microstrip (IEM) line. Compared to commercial simulation software, both in frequency and time domain, excellent agreement and superior efficiency is observed, illustrating the method's applicability for on-chip design purposes.},
  author       = {Vande Ginste, Dries and Deschrijver, Dirk and Demeester, Thomas and Dhaene, Tom and De Zutter, Dani{\"e}l},
  booktitle    = {Proceedings of the 2011 international conference on electromagnetics in advanced applications and IEEE-APS topical conference on antennas and propagation in wireless communications (ICEAA 2011)},
  isbn         = {9781612849782},
  keyword      = {IBCN,frequency-domain analysis,integrated circuit design,integrated circuit interconnections,integrated circuit modelling,microstrip lines,time-domain analysis},
  language     = {eng},
  location     = {Torino, Italy},
  pages        = {1372--1375},
  publisher    = {IEEE},
  title        = {Broadband passive RLGC(f) modeling for on-chip interconnect design},
  url          = {http://dx.doi.org/10.1109/ICEAA.2011.6046277},
  year         = {2011},
}

Chicago
Vande Ginste, Dries, Dirk Deschrijver, Thomas Demeester, Tom Dhaene, and Daniël De Zutter. 2011. “Broadband Passive RLGC(f) Modeling for On-chip Interconnect Design.” In Proceedings of the 2011 International Conference on Electromagnetics in Advanced Applications and IEEE-APS Topical Conference on Antennas and Propagation in Wireless Communications (ICEAA 2011), 1372–1375. Piscataway, NJ, USA: IEEE.
APA
Vande Ginste, D., Deschrijver, D., Demeester, T., Dhaene, T., & De Zutter, D. (2011). Broadband passive RLGC(f) modeling for on-chip interconnect design. Proceedings of the 2011 international conference on electromagnetics in advanced applications and IEEE-APS topical conference on antennas and propagation in wireless communications (ICEAA 2011) (pp. 1372–1375). Presented at the 2011 International conference on Electromagnetics in Advanced Applications (ICEAA 2011) ; IEEE-APS Topical conference on Antennas and Propagation in Wireless Communications, Piscataway, NJ, USA: IEEE.
Vancouver
1.
Vande Ginste D, Deschrijver D, Demeester T, Dhaene T, De Zutter D. Broadband passive RLGC(f) modeling for on-chip interconnect design. Proceedings of the 2011 international conference on electromagnetics in advanced applications and IEEE-APS topical conference on antennas and propagation in wireless communications (ICEAA 2011). Piscataway, NJ, USA: IEEE; 2011. p. 1372–5.
MLA
Vande Ginste, Dries, Dirk Deschrijver, Thomas Demeester, et al. “Broadband Passive RLGC(f) Modeling for On-chip Interconnect Design.” Proceedings of the 2011 International Conference on Electromagnetics in Advanced Applications and IEEE-APS Topical Conference on Antennas and Propagation in Wireless Communications (ICEAA 2011). Piscataway, NJ, USA: IEEE, 2011. 1372–1375. Print.