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Die-to-die adhesive bonding procedure for evanescently-coupled photonic devices

Stevan Stanković UGent, R Jones, J Heck, M Sysak, Dries Van Thourhout UGent and Günther Roelkens UGent (2011) ELECTROCHEMICAL AND SOLID STATE LETTERS. 14(8). p.H326-H329
Please use this url to cite or link to this publication:
author
organization
year
type
journalArticle (original)
publication status
published
subject
keyword
elemental semiconductors, adhesive bonding, III-V semiconductors, optical waveguides, photonic crystals, silicon, WAVE-GUIDE CIRCUIT, LASER
journal title
ELECTROCHEMICAL AND SOLID STATE LETTERS
Electrochem. Solid State Lett.
volume
14
issue
8
pages
H326 - H329
Web of Science type
Article
Web of Science id
000291407500013
JCR category
MATERIALS SCIENCE, MULTIDISCIPLINARY
JCR impact factor
1.995 (2011)
JCR rank
62/229 (2011)
JCR quartile
2 (2011)
ISSN
1099-0062
DOI
10.1149/1.3592267
project
Center for nano- and biophotonics (NB-Photonics)
language
English
UGent publication?
yes
classification
A1
copyright statement
I have transferred the copyright for this publication to the publisher
id
1957944
handle
http://hdl.handle.net/1854/LU-1957944
date created
2011-12-02 09:26:46
date last changed
2016-12-19 15:42:20
@article{1957944,
  author       = {Stankovi\'{c}, Stevan and Jones, R and Heck, J and Sysak, M and Van Thourhout, Dries and Roelkens, G{\"u}nther},
  issn         = {1099-0062},
  journal      = {ELECTROCHEMICAL AND SOLID STATE LETTERS},
  keyword      = {elemental semiconductors,adhesive bonding,III-V semiconductors,optical waveguides,photonic crystals,silicon,WAVE-GUIDE CIRCUIT,LASER},
  language     = {eng},
  number       = {8},
  pages        = {H326--H329},
  title        = {Die-to-die adhesive bonding procedure for evanescently-coupled photonic devices},
  url          = {http://dx.doi.org/10.1149/1.3592267},
  volume       = {14},
  year         = {2011},
}

Chicago
Stanković, Stevan, R Jones, J Heck, M Sysak, Dries Van Thourhout, and Günther Roelkens. 2011. “Die-to-die Adhesive Bonding Procedure for Evanescently-coupled Photonic Devices.” Electrochemical and Solid State Letters 14 (8): H326–H329.
APA
Stanković, Stevan, Jones, R., Heck, J., Sysak, M., Van Thourhout, D., & Roelkens, G. (2011). Die-to-die adhesive bonding procedure for evanescently-coupled photonic devices. ELECTROCHEMICAL AND SOLID STATE LETTERS, 14(8), H326–H329.
Vancouver
1.
Stanković S, Jones R, Heck J, Sysak M, Van Thourhout D, Roelkens G. Die-to-die adhesive bonding procedure for evanescently-coupled photonic devices. ELECTROCHEMICAL AND SOLID STATE LETTERS. 2011;14(8):H326–H329.
MLA
Stanković, Stevan, R Jones, J Heck, et al. “Die-to-die Adhesive Bonding Procedure for Evanescently-coupled Photonic Devices.” ELECTROCHEMICAL AND SOLID STATE LETTERS 14.8 (2011): H326–H329. Print.