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A specific distribution and bonding mechanism of emulsified adhesives in granular and fibrous substrates.

Frank De Bisschop (1995) JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY. 9(7). p.873-888
Please use this url to cite or link to this publication:
author
organization
year
type
journalArticle (original)
publication status
published
subject
journal title
JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY
volume
9
issue
7
pages
873-888 pages
Web of Science type
Article
ISSN
0169-4243
language
English
UGent publication?
yes
classification
A1
id
194567
handle
http://hdl.handle.net/1854/LU-194567
date created
2004-01-14 13:42:00
date last changed
2016-12-19 15:38:12
@article{194567,
  author       = {De Bisschop, Frank},
  issn         = {0169-4243},
  journal      = {JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY},
  language     = {eng},
  number       = {7},
  pages        = {873--888},
  title        = {A specific distribution and bonding mechanism of emulsified adhesives in granular and fibrous substrates.},
  volume       = {9},
  year         = {1995},
}

Chicago
De Bisschop, Frank. 1995. “A Specific Distribution and Bonding Mechanism of Emulsified Adhesives in Granular and Fibrous Substrates.” Journal of Adhesion Science and Technology 9 (7): 873–888.
APA
De Bisschop, F. (1995). A specific distribution and bonding mechanism of emulsified adhesives in granular and fibrous substrates. JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 9(7), 873–888.
Vancouver
1.
De Bisschop F. A specific distribution and bonding mechanism of emulsified adhesives in granular and fibrous substrates. JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY. 1995;9(7):873–88.
MLA
De Bisschop, Frank. “A Specific Distribution and Bonding Mechanism of Emulsified Adhesives in Granular and Fibrous Substrates.” JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY 9.7 (1995): 873–888. Print.