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Center for nano- and biophotonics (NB-Photonics)
Abstract
Integrated components for optical networks-on-chip, including III-V microdisk lasers, photodetectors, and wavelength selective circuits, are all demonstrated using a complementary metal-oxide-semiconductor (CMOS) compatible III-V/silicon-on-insulator integration technology at 200mm wafer scale.
Keywords
optical communication, network-on-chip, silicon-on-insulator, III-V semiconductors, CMOS integrated circuits

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Citation

Please use this url to cite or link to this publication:

Chicago
Fedeli, J-M, L Liu, L Grenouillet, D Bordel, F Mandorlo, N Olivier, Thijs Spuesens, et al. 2011. “Towards Optical Networks-on-chip with 200mm Hybrid Technology.” In 2011 Conference on Optical Fiber Communication, Collocated National Fiber Optic Engineers Conference (OFC/NFOEC 2011). Piscataway, NJ, USA: IEEE.
APA
Fedeli, J-M, Liu, L., Grenouillet, L., Bordel, D., Mandorlo, F., Olivier, N., Spuesens, T., et al. (2011). Towards optical networks-on-chip with 200mm hybrid technology. 2011 Conference on optical fiber communication, collocated National Fiber Optic Engineers conference (OFC/NFOEC 2011). Presented at the 2011 Conference on Optical Fiber Communication (OFC 2011) ; National Fiber Optic Engineers Conference (OFC/NFOEC 2011), Piscataway, NJ, USA: IEEE.
Vancouver
1.
Fedeli J-M, Liu L, Grenouillet L, Bordel D, Mandorlo F, Olivier N, et al. Towards optical networks-on-chip with 200mm hybrid technology. 2011 Conference on optical fiber communication, collocated National Fiber Optic Engineers conference (OFC/NFOEC 2011). Piscataway, NJ, USA: IEEE; 2011.
MLA
Fedeli, J-M, L Liu, L Grenouillet, et al. “Towards Optical Networks-on-chip with 200mm Hybrid Technology.” 2011 Conference on Optical Fiber Communication, Collocated National Fiber Optic Engineers Conference (OFC/NFOEC 2011). Piscataway, NJ, USA: IEEE, 2011. Print.
@inproceedings{1937790,
  abstract     = {Integrated components for optical networks-on-chip, including III-V microdisk lasers, photodetectors, and wavelength selective circuits, are all demonstrated using a complementary metal-oxide-semiconductor (CMOS) compatible III-V/silicon-on-insulator integration technology at 200mm wafer scale.},
  articleno    = {OMM3},
  author       = {Fedeli, J-M and Liu, L and Grenouillet, L and Bordel, D and Mandorlo, F and Olivier, N and Spuesens, Thijs and R{\'e}greny, P and Grosse, P and Rojo-Romeo, P and Orobtchouk, R and Van Thourhout, Dries},
  booktitle    = {2011 Conference on optical fiber communication, collocated National Fiber Optic Engineers conference (OFC/NFOEC 2011)},
  isbn         = {9781557529060},
  keyword      = {optical communication,network-on-chip,silicon-on-insulator,III-V semiconductors,CMOS integrated circuits},
  language     = {eng},
  location     = {Los Angeles, CA, USA},
  pages        = {3},
  publisher    = {IEEE},
  title        = {Towards optical networks-on-chip with 200mm hybrid technology},
  year         = {2011},
}

Web of Science
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