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Unobtrusive packaging of optoelectronic devices for optical tactile and shear sensors

Erwin Bosman UGent, Bram Van Hoe UGent, Jeroen Missinne UGent, Geert Van Steenberge UGent, Sandeep Kalathimekkad UGent and Peter Van Daele UGent (2011) PROCEEDINGS OF THE 5TH INTERNATIONAL CONFERENCE ON SENSING TECHNOLOGY. p.504-509
abstract
This paper presents the development of two new types of optical sensors that can measure both pressure and shear stresses in an unobtrusive way. Standard packaging technologies for optoelectronic components result in very bulky and rigid sensors. We present an optoelectronic package which is flexible, only 40 µm thick and which can be bent down to a bending radius of 2 mm. This advanced packaging technique enables the flexibility and compactness of the sensors, which are needed to be unobtrusive. The resulting pressure and shear sensors are discussed, characterized and demonstrated.
Please use this url to cite or link to this publication:
author
organization
year
type
conference
publication status
published
subject
keyword
sensor, shear, packaging, flexible, VCSEL
in
PROCEEDINGS OF THE 5TH INTERNATIONAL CONFERENCE ON SENSING TECHNOLOGY
Proc. Int. Conf. Sens. Technol.
pages
504 - 509
publisher
IEEE
place of publication
New York, NY, USA
conference name
5th International Conference on Sensing Technology (ICST - 2011)
conference location
Palmerston North, New Zealand
conference start
2011-11-28
conference end
2011-12-01
Web of Science type
Conference Paper
Web of Science id
12494788
ISSN
2156-8065
ISBN
9781457701689
DOI
10.1109/ICSensT.2011.6137031
language
English
UGent publication?
yes
classification
C1
copyright statement
I have transferred the copyright for this publication to the publisher
id
1920027
handle
http://hdl.handle.net/1854/LU-1920027
date created
2011-10-03 16:59:29
date last changed
2015-01-30 13:22:45
@inproceedings{1920027,
  abstract     = {This paper presents the development of two new types of optical sensors that can measure both pressure and shear stresses in an unobtrusive way. Standard packaging technologies for optoelectronic components result in very bulky and rigid sensors. We present an optoelectronic package which is flexible, only 40 {\textmu}m thick and which can be bent down to a bending radius of 2 mm. This advanced packaging technique enables the flexibility and compactness of the sensors, which are needed to be unobtrusive. The resulting pressure and shear sensors are discussed, characterized and demonstrated.},
  author       = {Bosman, Erwin and Van Hoe, Bram and Missinne, Jeroen and Van Steenberge, Geert and Kalathimekkad, Sandeep and Van Daele, Peter},
  booktitle    = {PROCEEDINGS OF THE 5TH INTERNATIONAL CONFERENCE ON SENSING TECHNOLOGY},
  isbn         = {9781457701689},
  issn         = {2156-8065},
  keyword      = {sensor,shear,packaging,flexible,VCSEL},
  language     = {eng},
  location     = {Palmerston North, New Zealand},
  pages        = {504--509},
  publisher    = {IEEE},
  title        = {Unobtrusive packaging of optoelectronic devices for optical tactile and shear sensors},
  url          = {http://dx.doi.org/10.1109/ICSensT.2011.6137031},
  year         = {2011},
}

Chicago
Bosman, Erwin, Bram Van Hoe, Jeroen Missinne, Geert Van Steenberge, Sandeep Kalathimekkad, and Peter Van Daele. 2011. “Unobtrusive Packaging of Optoelectronic Devices for Optical Tactile and Shear Sensors.” In PROCEEDINGS OF THE 5TH INTERNATIONAL CONFERENCE ON SENSING TECHNOLOGY, 504–509. New York, NY, USA: IEEE.
APA
Bosman, E., Van Hoe, B., Missinne, J., Van Steenberge, G., Kalathimekkad, S., & Van Daele, P. (2011). Unobtrusive packaging of optoelectronic devices for optical tactile and shear sensors. PROCEEDINGS OF THE 5TH INTERNATIONAL CONFERENCE ON SENSING TECHNOLOGY (pp. 504–509). Presented at the 5th International Conference on Sensing Technology (ICST - 2011), New York, NY, USA: IEEE.
Vancouver
1.
Bosman E, Van Hoe B, Missinne J, Van Steenberge G, Kalathimekkad S, Van Daele P. Unobtrusive packaging of optoelectronic devices for optical tactile and shear sensors. PROCEEDINGS OF THE 5TH INTERNATIONAL CONFERENCE ON SENSING TECHNOLOGY. New York, NY, USA: IEEE; 2011. p. 504–9.
MLA
Bosman, Erwin, Bram Van Hoe, Jeroen Missinne, et al. “Unobtrusive Packaging of Optoelectronic Devices for Optical Tactile and Shear Sensors.” PROCEEDINGS OF THE 5TH INTERNATIONAL CONFERENCE ON SENSING TECHNOLOGY. New York, NY, USA: IEEE, 2011. 504–509. Print.