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Unobtrusive packaging of optoelectronic devices for optical tactile and shear sensors

Erwin Bosman (UGent) , Bram Van Hoe (UGent) , Jeroen Missinne (UGent) , Geert Van Steenberge (UGent) , Sandeep Kalathimekkad (UGent) and Peter Van Daele (UGent)
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Abstract
This paper presents the development of two new types of optical sensors that can measure both pressure and shear stresses in an unobtrusive way. Standard packaging technologies for optoelectronic components result in very bulky and rigid sensors. We present an optoelectronic package which is flexible, only 40 µm thick and which can be bent down to a bending radius of 2 mm. This advanced packaging technique enables the flexibility and compactness of the sensors, which are needed to be unobtrusive. The resulting pressure and shear sensors are discussed, characterized and demonstrated.
Keywords
sensor, shear, packaging, flexible, VCSEL

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Chicago
Bosman, Erwin, Bram Van Hoe, Jeroen Missinne, Geert Van Steenberge, Sandeep Kalathimekkad, and Peter Van Daele. 2011. “Unobtrusive Packaging of Optoelectronic Devices for Optical Tactile and Shear Sensors.” In PROCEEDINGS OF THE 5TH INTERNATIONAL CONFERENCE ON SENSING TECHNOLOGY, 504–509. New York, NY, USA: IEEE.
APA
Bosman, E., Van Hoe, B., Missinne, J., Van Steenberge, G., Kalathimekkad, S., & Van Daele, P. (2011). Unobtrusive packaging of optoelectronic devices for optical tactile and shear sensors. PROCEEDINGS OF THE 5TH INTERNATIONAL CONFERENCE ON SENSING TECHNOLOGY (pp. 504–509). Presented at the 5th International Conference on Sensing Technology (ICST - 2011), New York, NY, USA: IEEE.
Vancouver
1.
Bosman E, Van Hoe B, Missinne J, Van Steenberge G, Kalathimekkad S, Van Daele P. Unobtrusive packaging of optoelectronic devices for optical tactile and shear sensors. PROCEEDINGS OF THE 5TH INTERNATIONAL CONFERENCE ON SENSING TECHNOLOGY. New York, NY, USA: IEEE; 2011. p. 504–9.
MLA
Bosman, Erwin, Bram Van Hoe, Jeroen Missinne, et al. “Unobtrusive Packaging of Optoelectronic Devices for Optical Tactile and Shear Sensors.” PROCEEDINGS OF THE 5TH INTERNATIONAL CONFERENCE ON SENSING TECHNOLOGY. New York, NY, USA: IEEE, 2011. 504–509. Print.
@inproceedings{1920027,
  abstract     = {This paper presents the development of two new types of optical sensors that can measure both pressure and shear stresses in an unobtrusive way. Standard packaging technologies for optoelectronic components result in very bulky and rigid sensors. We present an optoelectronic package which is flexible, only 40 {\textmu}m thick and which can be bent down to a bending radius of 2 mm. This advanced packaging technique enables the flexibility and compactness of the sensors, which are needed to be unobtrusive. The resulting pressure and shear sensors are discussed, characterized and demonstrated.},
  author       = {Bosman, Erwin and Van Hoe, Bram and Missinne, Jeroen and Van Steenberge, Geert and Kalathimekkad, Sandeep and Van Daele, Peter},
  booktitle    = {PROCEEDINGS OF THE 5TH INTERNATIONAL CONFERENCE ON SENSING TECHNOLOGY},
  isbn         = {9781457701689},
  issn         = {2156-8065},
  language     = {eng},
  location     = {Palmerston North, New Zealand},
  pages        = {504--509},
  publisher    = {IEEE},
  title        = {Unobtrusive packaging of optoelectronic devices for optical tactile and shear sensors},
  url          = {http://dx.doi.org/10.1109/ICSensT.2011.6137031},
  year         = {2011},
}

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