- Author
- Erwin Bosman (UGent)
- Organization
- Abstract
- An ultrathin package enables highly flexible, compact, and reliable optoelectronic systems for sensor and data communications applications.
- Keywords
- opotelectronic, flexible, packaging
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Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-1920009
- MLA
- Bosman, Erwin. “Toward Flexible Optoelectronics Packaging.” SPIE NEWSROOM, 2011, doi:10.1117/2.1201110.003837.
- APA
- Bosman, E. (2011). Toward flexible optoelectronics packaging. SPIE NEWSROOM. https://doi.org/10.1117/2.1201110.003837
- Chicago author-date
- Bosman, Erwin. 2011. “Toward Flexible Optoelectronics Packaging.” SPIE NEWSROOM. https://doi.org/10.1117/2.1201110.003837.
- Chicago author-date (all authors)
- Bosman, Erwin. 2011. “Toward Flexible Optoelectronics Packaging.” SPIE NEWSROOM. doi:10.1117/2.1201110.003837.
- Vancouver
- 1.Bosman E. Toward flexible optoelectronics packaging. SPIE NEWSROOM. 2011;
- IEEE
- [1]E. Bosman, “Toward flexible optoelectronics packaging,” SPIE NEWSROOM, 2011.
@article{1920009,
abstract = {{An ultrathin package enables highly flexible, compact, and reliable optoelectronic systems for sensor and data communications applications.}},
author = {{Bosman, Erwin}},
issn = {{1818-2259}},
journal = {{SPIE NEWSROOM}},
keywords = {{opotelectronic,flexible,packaging}},
language = {{eng}},
pages = {{3}},
title = {{Toward flexible optoelectronics packaging}},
url = {{http://doi.org/10.1117/2.1201110.003837}},
year = {{2011}},
}
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