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Toward flexible optoelectronics packaging

Erwin Bosman (UGent)
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Abstract
An ultrathin package enables highly flexible, compact, and reliable optoelectronic systems for sensor and data communications applications.
Keywords
opotelectronic, flexible, packaging

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Citation

Please use this url to cite or link to this publication:

Chicago
Bosman, Erwin. 2011. “Toward Flexible Optoelectronics Packaging.” Spie Newsroom.
APA
Bosman, E. (2011). Toward flexible optoelectronics packaging. SPIE NEWSROOM.
Vancouver
1.
Bosman E. Toward flexible optoelectronics packaging. SPIE NEWSROOM. 2011;
MLA
Bosman, Erwin. “Toward Flexible Optoelectronics Packaging.” SPIE NEWSROOM (2011): n. pag. Print.
@article{1920009,
  abstract     = {An ultrathin package enables highly flexible, compact, and reliable optoelectronic systems for sensor and data communications applications.},
  author       = {Bosman, Erwin},
  issn         = {1818-2259},
  journal      = {SPIE NEWSROOM},
  keyword      = {opotelectronic,flexible,packaging},
  language     = {eng},
  pages        = {3},
  title        = {Toward flexible optoelectronics packaging},
  url          = {http://dx.doi.org/10.1117/2.1201110.003837},
  year         = {2011},
}

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