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Toward flexible optoelectronics packaging

Erwin Bosman (2011) SPIE NEWSROOM.
abstract
An ultrathin package enables highly flexible, compact, and reliable optoelectronic systems for sensor and data communications applications.
Please use this url to cite or link to this publication:
author
organization
year
type
journalArticle (original)
publication status
published
subject
keyword
opotelectronic, flexible, packaging
journal title
SPIE NEWSROOM
SPIE newsroom
pages
3 pages
ISSN
1818-2259
DOI
10.1117/2.1201110.003837
language
English
UGent publication?
yes
classification
A4
copyright statement
I have transferred the copyright for this publication to the publisher
id
1920009
handle
http://hdl.handle.net/1854/LU-1920009
date created
2011-10-03 16:51:10
date last changed
2016-12-19 15:42:00
@article{1920009,
  abstract     = {An ultrathin package enables highly flexible, compact, and reliable optoelectronic systems for sensor and data communications applications.},
  author       = {Bosman, Erwin},
  issn         = {1818-2259},
  journal      = {SPIE NEWSROOM},
  keyword      = {opotelectronic,flexible,packaging},
  language     = {eng},
  pages        = {3},
  title        = {Toward flexible optoelectronics packaging},
  url          = {http://dx.doi.org/10.1117/2.1201110.003837},
  year         = {2011},
}

Chicago
Bosman, Erwin. 2011. “Toward Flexible Optoelectronics Packaging.” Spie Newsroom.
APA
Bosman, E. (2011). Toward flexible optoelectronics packaging. SPIE NEWSROOM.
Vancouver
1.
Bosman E. Toward flexible optoelectronics packaging. SPIE NEWSROOM. 2011;
MLA
Bosman, Erwin. “Toward Flexible Optoelectronics Packaging.” SPIE NEWSROOM (2011): n. pag. Print.