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Abstract
The EMC-signature of devices containing microcontrollers can differ due to thermal or mechanical stress. Research is presented to prove the feature selective validation method (FSV) to be sensitive enough to analyze differences in signatures.
Keywords
FSV, signature, validation, EMC

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MLA
Knockaert, Jos, et al. “EMC-Signatures of Microcontrollers under Thermal Stress Analyzed by FSV.” 8th International Workshop on Electromagnetic Compatibility of Integrated Circuits, Proceedings, Ghent University, Department of Electrical energy, systems and automation, 2011.
APA
Knockaert, J., Malki, M., Baudry, D., Ramdani, M., & Pissoort, D. (2011). EMC-signatures of microcontrollers under thermal stress analyzed by FSV. In 8th international workshop on electromagnetic compatibility of integrated circuits, Proceedings. Ghent, Belgium: Ghent University, Department of Electrical energy, systems and automation.
Chicago author-date
Knockaert, Jos, Mohamed Malki, David Baudry, Mohamed Ramdani, and Davy Pissoort. 2011. “EMC-Signatures of Microcontrollers under Thermal Stress Analyzed by FSV.” In 8th International Workshop on Electromagnetic Compatibility of Integrated Circuits, Proceedings. Ghent, Belgium: Ghent University, Department of Electrical energy, systems and automation.
Chicago author-date (all authors)
Knockaert, Jos, Mohamed Malki, David Baudry, Mohamed Ramdani, and Davy Pissoort. 2011. “EMC-Signatures of Microcontrollers under Thermal Stress Analyzed by FSV.” In 8th International Workshop on Electromagnetic Compatibility of Integrated Circuits, Proceedings. Ghent, Belgium: Ghent University, Department of Electrical energy, systems and automation.
Vancouver
1.
Knockaert J, Malki M, Baudry D, Ramdani M, Pissoort D. EMC-signatures of microcontrollers under thermal stress analyzed by FSV. In: 8th international workshop on electromagnetic compatibility of integrated circuits, Proceedings. Ghent, Belgium: Ghent University, Department of Electrical energy, systems and automation; 2011.
IEEE
[1]
J. Knockaert, M. Malki, D. Baudry, M. Ramdani, and D. Pissoort, “EMC-signatures of microcontrollers under thermal stress analyzed by FSV,” in 8th international workshop on electromagnetic compatibility of integrated circuits, Proceedings, Dubrovnik, Croatia, 2011.
@inproceedings{1905269,
  abstract     = {The EMC-signature of devices containing microcontrollers can differ due to thermal or mechanical stress. Research is presented to prove the feature selective validation method (FSV) to be sensitive enough to analyze differences in signatures.},
  author       = {Knockaert, Jos and Malki, Mohamed and Baudry, David and Ramdani, Mohamed and Pissoort, Davy},
  booktitle    = {8th international workshop on electromagnetic compatibility of integrated circuits, Proceedings},
  keywords     = {FSV,signature,validation,EMC},
  language     = {eng},
  location     = {Dubrovnik, Croatia},
  pages        = {5},
  publisher    = {Ghent University, Department of Electrical energy, systems and automation},
  title        = {EMC-signatures of microcontrollers under thermal stress analyzed by FSV},
  year         = {2011},
}