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Polyimide-enhanced stretchable interconnects: design, fabrication, and characterization

Yung-Yu Hsu, Mario Gonzalez, Frederick Bossuyt UGent, Jan Vanfleteren UGent and Ingrid De Wolf (2011) IEEE TRANSACTIONS ON ELECTRON DEVICES. 58(8). p.2680-2688
abstract
This paper discusses the optimization of a stretchable electrical interconnection between integrated circuits in terms of stretchability and fatigue lifetime. The interconnection is based on Cu stripes embedded in a polyimide-enhanced (PI-enhanced) layer. Design-of-experiment (DOE) methods and finite-element modeling were used to obtain an optimal design and to define design guidelines, concerning both stripe and layer dimensions and material selection. Stretchable interconnects with a PI-enhanced layer were fabricated based on the optimized design parameters and tested. In situ experimental observations did validate the optimal design. Statistical analysis indicated that the PI width plays the most important role among the different design parameters. By increasing the PI width, the plastic strain in the Cu stripes is reduced, and thus, the stretchability and fatigue lifetime of the system is increased. The experimental results demonstrate that the PI-enhanced stretchable interconnect enables elongations up to 250% without Cu rupture. This maximum elongation is two times larger than the one in samples without PI enhancement [1]. Moreover, the fatigue life at 30% elongation is 470 times higher [2].
Please use this url to cite or link to this publication:
author
organization
year
type
journalArticle (original)
publication status
published
subject
keyword
stress, ELECTRONICS, strain, materials reliability, integrated circuit packaging, integrated circuit interconnections, flexible electronics, finite element methods, failure analysis, design optimization, Design for experiments
journal title
IEEE TRANSACTIONS ON ELECTRON DEVICES
IEEE Trans. Electron Devices
volume
58
issue
8
pages
2680 - 2688
Web of Science type
Article
Web of Science id
000293708500061
JCR category
ENGINEERING, ELECTRICAL & ELECTRONIC
JCR impact factor
2.318 (2011)
JCR rank
34/244 (2011)
JCR quartile
1 (2011)
ISSN
0018-9383
DOI
10.1109/TED.2011.2147789
language
English
UGent publication?
no
classification
A1
copyright statement
I have transferred the copyright for this publication to the publisher
id
1897366
handle
http://hdl.handle.net/1854/LU-1897366
date created
2011-09-05 14:35:58
date last changed
2016-12-19 15:41:59
@article{1897366,
  abstract     = {This paper discusses the optimization of a stretchable electrical interconnection between integrated circuits in terms of stretchability and fatigue lifetime. The interconnection is based on Cu stripes embedded in a polyimide-enhanced (PI-enhanced) layer. Design-of-experiment (DOE) methods and finite-element modeling were used to obtain an optimal design and to define design guidelines, concerning both stripe and layer dimensions and material selection. Stretchable interconnects with a PI-enhanced layer were fabricated based on the optimized design parameters and tested. In situ experimental observations did validate the optimal design. Statistical analysis indicated that the PI width plays the most important role among the different design parameters. By increasing the PI width, the plastic strain in the Cu stripes is reduced, and thus, the stretchability and fatigue lifetime of the system is increased. The experimental results demonstrate that the PI-enhanced stretchable interconnect enables elongations up to 250\% without Cu rupture. This maximum elongation is two times larger than the one in samples without PI enhancement [1]. Moreover, the fatigue life at 30\% elongation is 470 times higher [2].},
  author       = {Hsu, Yung-Yu and Gonzalez, Mario and Bossuyt, Frederick and Vanfleteren, Jan and De Wolf, Ingrid},
  issn         = {0018-9383},
  journal      = {IEEE TRANSACTIONS ON ELECTRON DEVICES},
  keyword      = {stress,ELECTRONICS,strain,materials reliability,integrated circuit packaging,integrated circuit interconnections,flexible electronics,finite element methods,failure analysis,design optimization,Design for experiments},
  language     = {eng},
  number       = {8},
  pages        = {2680--2688},
  title        = {Polyimide-enhanced stretchable interconnects: design, fabrication, and characterization},
  url          = {http://dx.doi.org/10.1109/TED.2011.2147789},
  volume       = {58},
  year         = {2011},
}

Chicago
Hsu, Yung-Yu, Mario Gonzalez, Frederick Bossuyt, Jan Vanfleteren, and Ingrid De Wolf. 2011. “Polyimide-enhanced Stretchable Interconnects: Design, Fabrication, and Characterization.” Ieee Transactions on Electron Devices 58 (8): 2680–2688.
APA
Hsu, Y.-Y., Gonzalez, M., Bossuyt, F., Vanfleteren, J., & De Wolf, I. (2011). Polyimide-enhanced stretchable interconnects: design, fabrication, and characterization. IEEE TRANSACTIONS ON ELECTRON DEVICES, 58(8), 2680–2688.
Vancouver
1.
Hsu Y-Y, Gonzalez M, Bossuyt F, Vanfleteren J, De Wolf I. Polyimide-enhanced stretchable interconnects: design, fabrication, and characterization. IEEE TRANSACTIONS ON ELECTRON DEVICES. 2011;58(8):2680–8.
MLA
Hsu, Yung-Yu, Mario Gonzalez, Frederick Bossuyt, et al. “Polyimide-enhanced Stretchable Interconnects: Design, Fabrication, and Characterization.” IEEE TRANSACTIONS ON ELECTRON DEVICES 58.8 (2011): 2680–2688. Print.