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Polyimide-enhanced stretchable interconnects: design, fabrication, and characterization

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Abstract
This paper discusses the optimization of a stretchable electrical interconnection between integrated circuits in terms of stretchability and fatigue lifetime. The interconnection is based on Cu stripes embedded in a polyimide-enhanced (PI-enhanced) layer. Design-of-experiment (DOE) methods and finite-element modeling were used to obtain an optimal design and to define design guidelines, concerning both stripe and layer dimensions and material selection. Stretchable interconnects with a PI-enhanced layer were fabricated based on the optimized design parameters and tested. In situ experimental observations did validate the optimal design. Statistical analysis indicated that the PI width plays the most important role among the different design parameters. By increasing the PI width, the plastic strain in the Cu stripes is reduced, and thus, the stretchability and fatigue lifetime of the system is increased. The experimental results demonstrate that the PI-enhanced stretchable interconnect enables elongations up to 250% without Cu rupture. This maximum elongation is two times larger than the one in samples without PI enhancement [1]. Moreover, the fatigue life at 30% elongation is 470 times higher [2].
Keywords
stress, ELECTRONICS, strain, materials reliability, integrated circuit packaging, integrated circuit interconnections, flexible electronics, finite element methods, failure analysis, design optimization, Design for experiments

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Chicago
Hsu, Yung-Yu, Mario Gonzalez, Frederick Bossuyt, Jan Vanfleteren, and Ingrid De Wolf. 2011. “Polyimide-enhanced Stretchable Interconnects: Design, Fabrication, and Characterization.” Ieee Transactions on Electron Devices 58 (8): 2680–2688.
APA
Hsu, Y.-Y., Gonzalez, M., Bossuyt, F., Vanfleteren, J., & De Wolf, I. (2011). Polyimide-enhanced stretchable interconnects: design, fabrication, and characterization. IEEE TRANSACTIONS ON ELECTRON DEVICES, 58(8), 2680–2688.
Vancouver
1.
Hsu Y-Y, Gonzalez M, Bossuyt F, Vanfleteren J, De Wolf I. Polyimide-enhanced stretchable interconnects: design, fabrication, and characterization. IEEE TRANSACTIONS ON ELECTRON DEVICES. 2011;58(8):2680–8.
MLA
Hsu, Yung-Yu, Mario Gonzalez, Frederick Bossuyt, et al. “Polyimide-enhanced Stretchable Interconnects: Design, Fabrication, and Characterization.” IEEE TRANSACTIONS ON ELECTRON DEVICES 58.8 (2011): 2680–2688. Print.
@article{1897366,
  abstract     = {This paper discusses the optimization of a stretchable electrical interconnection between integrated circuits in terms of stretchability and fatigue lifetime. The interconnection is based on Cu stripes embedded in a polyimide-enhanced (PI-enhanced) layer. Design-of-experiment (DOE) methods and finite-element modeling were used to obtain an optimal design and to define design guidelines, concerning both stripe and layer dimensions and material selection. Stretchable interconnects with a PI-enhanced layer were fabricated based on the optimized design parameters and tested. In situ experimental observations did validate the optimal design. Statistical analysis indicated that the PI width plays the most important role among the different design parameters. By increasing the PI width, the plastic strain in the Cu stripes is reduced, and thus, the stretchability and fatigue lifetime of the system is increased. The experimental results demonstrate that the PI-enhanced stretchable interconnect enables elongations up to 250\% without Cu rupture. This maximum elongation is two times larger than the one in samples without PI enhancement [1]. Moreover, the fatigue life at 30\% elongation is 470 times higher [2].},
  author       = {Hsu, Yung-Yu and Gonzalez, Mario and Bossuyt, Frederick and Vanfleteren, Jan and De Wolf, Ingrid},
  issn         = {0018-9383},
  journal      = {IEEE TRANSACTIONS ON ELECTRON DEVICES},
  keyword      = {stress,ELECTRONICS,strain,materials reliability,integrated circuit packaging,integrated circuit interconnections,flexible electronics,finite element methods,failure analysis,design optimization,Design for experiments},
  language     = {eng},
  number       = {8},
  pages        = {2680--2688},
  title        = {Polyimide-enhanced stretchable interconnects: design, fabrication, and characterization},
  url          = {http://dx.doi.org/10.1109/TED.2011.2147789},
  volume       = {58},
  year         = {2011},
}

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