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Experimental evaluation and simulation of Al/Si diffusion in hot dipped Fe-Si steels

Ivone Infante Danzo UGent, Benny Malengier UGent, Sergio Miyar, Eva Gomez, Kim Verbeken UGent, Yvan Houbaert UGent, Roger Van Keer UGent and Iris De Graeve (2012) Defect and Diffusion Forum. 326-328. p.428-433
abstract
Hot dipping is coating technique used in industry for galvanizing machine elements and steel profiles for construction or automotive applications. However, an alternative use of this process might be to improve specific properties. For instance, in order to improve the magnetic properties of electrical steels, it may be desirable to increase the Si and/or Al content. A possible and alternative route to realize this is by the application of an Al-Si-rich coating on the steel substrate using a hot dipping process, followed by a diffusion annealing treatment in order to distribute the Al/Si more evenly in the steel. The obtained distribution depends on the annealing parameters and can be both beneficial and detrimental for the magnetic properties. In the present work, Fe-Si substrates were hot dipped in different Al-Si baths. Subsequently, the samples were annealed at 1100 °C during 20 minutes and concentration profiles were measured with scanning electron microscope – energy dispersive spectroscopy line scans. The experimental results were analyzed using a specifically designed simulation model in order to determine the Al and Si diffusion coefficients. This model uses an inverse algorithm to determine interdiffusion coefficients that arise in a macro ternary diffusion system.
Please use this url to cite or link to this publication:
author
organization
year
type
conference
publication status
published
subject
keyword
hot dipping, mathematical model, Interdiffusion coefficient, electrical steels
in
Defect and Diffusion Forum
Diffus. defect data solid state data, Pt. A Defect diffus. forum
editor
Andreas Öchsner, Graeme E Murch, Ali Shokuhfar and João MPQ Delgado
volume
326-328
pages
428 - 433
publisher
Trans Tech Publications
place of publication
Switzerland
conference name
7th International conference on diffusion in solids and liquids (DSL - 2011)
conference location
Algarve, Portugal
conference start
2011-06-26
conference end
2011-06-30
ISSN
1012-0386
DOI
10.4028/www.scientific.net/DDF.326-328.428
language
English
UGent publication?
yes
classification
C1
copyright statement
I have transferred the copyright for this publication to the publisher
id
1892727
handle
http://hdl.handle.net/1854/LU-1892727
date created
2011-08-25 17:26:30
date last changed
2012-04-17 11:17:24
@inproceedings{1892727,
  abstract     = {Hot dipping is coating technique used in industry for galvanizing machine elements and steel profiles for construction or automotive applications. However, an alternative use of this process might be to improve specific properties. For instance, in order to improve the magnetic properties of electrical steels, it may be desirable to increase the Si and/or Al content. A possible and alternative route to realize this is by the application of an Al-Si-rich coating on the steel substrate using a hot dipping process, followed by a diffusion annealing treatment in order to distribute the Al/Si more evenly in the steel. The obtained distribution depends on the annealing parameters and can be both beneficial and detrimental for the magnetic properties. In the present work, Fe-Si substrates were hot dipped in different Al-Si baths. Subsequently, the samples were annealed at 1100 {\textdegree}C during 20 minutes and concentration profiles were measured with scanning electron microscope -- energy dispersive spectroscopy line scans. The experimental results were analyzed using a specifically designed simulation model in order to determine the Al and Si diffusion coefficients. This model uses an inverse algorithm to determine interdiffusion coefficients that arise in a macro ternary diffusion system.},
  author       = {Infante Danzo, Ivone and Malengier, Benny and Miyar, Sergio and Gomez, Eva  and Verbeken, Kim and Houbaert, Yvan and Van Keer, Roger and De Graeve, Iris},
  booktitle    = {Defect and Diffusion Forum},
  editor       = {{\"O}chsner, Andreas  and E Murch, Graeme  and Shokuhfar, Ali  and Delgado, Jo{\~a}o MPQ },
  issn         = {1012-0386},
  keyword      = {hot dipping,mathematical model,Interdiffusion coefficient,electrical steels},
  language     = {eng},
  location     = {Algarve, Portugal},
  pages        = {428--433},
  publisher    = {Trans Tech Publications},
  title        = {Experimental evaluation and simulation of Al/Si diffusion in hot dipped Fe-Si steels},
  url          = {http://dx.doi.org/10.4028/www.scientific.net/DDF.326-328.428},
  volume       = {326-328},
  year         = {2012},
}

Chicago
Infante Danzo, Ivone, Benny Malengier, Sergio Miyar, Eva Gomez, Kim Verbeken, Yvan Houbaert, Roger Van Keer, and Iris De Graeve. 2012. “Experimental Evaluation and Simulation of Al/Si Diffusion in Hot Dipped Fe-Si Steels.” In Defect and Diffusion Forum, ed. Andreas Öchsner, Graeme E Murch, Ali Shokuhfar, and João MPQ Delgado, 326-328:428–433. Switzerland: Trans Tech Publications.
APA
Infante Danzo, I., Malengier, B., Miyar, S., Gomez, E., Verbeken, K., Houbaert, Y., Van Keer, R., et al. (2012). Experimental evaluation and simulation of Al/Si diffusion in hot dipped Fe-Si steels. In Andreas Öchsner, G. E Murch, A. Shokuhfar, & J. M. Delgado (Eds.), Defect and Diffusion Forum (Vol. 326–328, pp. 428–433). Presented at the 7th International conference on diffusion in solids and liquids (DSL - 2011), Switzerland: Trans Tech Publications.
Vancouver
1.
Infante Danzo I, Malengier B, Miyar S, Gomez E, Verbeken K, Houbaert Y, et al. Experimental evaluation and simulation of Al/Si diffusion in hot dipped Fe-Si steels. In: Öchsner A, E Murch G, Shokuhfar A, Delgado JM, editors. Defect and Diffusion Forum. Switzerland: Trans Tech Publications; 2012. p. 428–33.
MLA
Infante Danzo, Ivone, Benny Malengier, Sergio Miyar, et al. “Experimental Evaluation and Simulation of Al/Si Diffusion in Hot Dipped Fe-Si Steels.” Defect and Diffusion Forum. Ed. Andreas Öchsner et al. Vol. 326–328. Switzerland: Trans Tech Publications, 2012. 428–433. Print.