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Multichannel optical modules compatible with the fiber-in-board technology.

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Chicago
DEPESTEL, G, A AMBROSY, QS TAN, M VRANA, F MIGOM, H RICHTER, Jan Vandewege, and P VETTER. 1996. “Multichannel Optical Modules Compatible with the Fiber-in-board Technology.” Ieee Transactions on Components Packaging and Manufacturing Technology Part B-advanced Packaging 19 (1): 116–123.
APA
DEPESTEL, G., AMBROSY, A., TAN, Q., VRANA, M., MIGOM, F., RICHTER, H., Vandewege, J., et al. (1996). Multichannel optical modules compatible with the fiber-in-board technology. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 19(1), 116–123.
Vancouver
1.
DEPESTEL G, AMBROSY A, TAN Q, VRANA M, MIGOM F, RICHTER H, et al. Multichannel optical modules compatible with the fiber-in-board technology. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING. 1996;19(1):116–23.
MLA
DEPESTEL, G, A AMBROSY, QS TAN, et al. “Multichannel Optical Modules Compatible with the Fiber-in-board Technology.” IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING 19.1 (1996): 116–123. Print.
@article{187098,
  author       = {DEPESTEL, G and AMBROSY, A and TAN, QS and VRANA, M and MIGOM, F and RICHTER, H and Vandewege, Jan and VETTER, P},
  issn         = {1070-9894},
  journal      = {IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING},
  language     = {eng},
  number       = {1},
  pages        = {116--123},
  title        = {Multichannel optical modules compatible with the fiber-in-board technology.},
  volume       = {19},
  year         = {1996},
}