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In situ observations on deformation behavior and stretching-induced failure of fine pitch stretchable interconnect

Yung-Yu Hsu, Mario Gonzalez, Frederick Bossuyt UGent, Fabrice Axisa UGent, Jan Vanfleteren UGent and Ingrid De Wolf (2009) JOURNAL OF MATERIALS RESEARCH. 24(12). p.3573-3582
abstract
Electronic devices capable of performing in extreme mechanical conditions such as stretching, bending, or twisting will improve biomedical and wearable systems. The required capabilities cannot be achieved with conventional building geometries, because of structural rigidity and lack of mechanical stretchability. In this article, a zigzag-patterned structure representing a stretchable interconnect is presented as a promising type of building block. In situ experimental observations on the deformed interconnect are correlated with numerical analysis, providing an understanding of the deformation and failure mechanisms. The experimental results demonstrate that the zigzag-patterned interconnect enables stretchability up to 60% without rupture. This stretchability is accommodated by in-plane rotation of arms and out-of-plane deformation of crests. Numerical analysis shows that the dominating failure cause is interfacial in-plane shear stress. The plastic strain concentration at the arms close to the crests, obtained by numerical simulation, agrees well with the failure location observed in the experiment.
Please use this url to cite or link to this publication:
author
organization
year
type
journalArticle (original)
publication status
published
subject
keyword
FILMS, DESIGN, ELECTRONIC-CIRCUITS
journal title
JOURNAL OF MATERIALS RESEARCH
J. Mater. Res.
volume
24
issue
12
pages
3573 - 3582
Web of Science type
Article
Web of Science id
000272412500012
JCR category
MATERIALS SCIENCE, MULTIDISCIPLINARY
JCR impact factor
1.667 (2009)
JCR rank
72/210 (2009)
JCR quartile
2 (2009)
ISSN
0884-2914
DOI
10.1557/JMR.2009.0447
language
English
UGent publication?
yes
classification
A1
copyright statement
I have transferred the copyright for this publication to the publisher
id
1865832
handle
http://hdl.handle.net/1854/LU-1865832
date created
2011-08-03 13:36:57
date last changed
2016-12-19 15:41:56
@article{1865832,
  abstract     = {Electronic devices capable of performing in extreme mechanical conditions such as stretching, bending, or twisting will improve biomedical and wearable systems. The required capabilities cannot be achieved with conventional building geometries, because of structural rigidity and lack of mechanical stretchability. In this article, a zigzag-patterned structure representing a stretchable interconnect is presented as a promising type of building block. In situ experimental observations on the deformed interconnect are correlated with numerical analysis, providing an understanding of the deformation and failure mechanisms. The experimental results demonstrate that the zigzag-patterned interconnect enables stretchability up to 60\% without rupture. This stretchability is accommodated by in-plane rotation of arms and out-of-plane deformation of crests. Numerical analysis shows that the dominating failure cause is interfacial in-plane shear stress. The plastic strain concentration at the arms close to the crests, obtained by numerical simulation, agrees well with the failure location observed in the experiment.},
  author       = {Hsu, Yung-Yu and Gonzalez, Mario and Bossuyt, Frederick and Axisa, Fabrice and Vanfleteren, Jan and De Wolf, Ingrid},
  issn         = {0884-2914},
  journal      = {JOURNAL OF MATERIALS RESEARCH},
  keyword      = {FILMS,DESIGN,ELECTRONIC-CIRCUITS},
  language     = {eng},
  number       = {12},
  pages        = {3573--3582},
  title        = {In situ observations on deformation behavior and stretching-induced failure of fine pitch stretchable interconnect},
  url          = {http://dx.doi.org/10.1557/JMR.2009.0447},
  volume       = {24},
  year         = {2009},
}

Chicago
Hsu, Yung-Yu, Mario Gonzalez, Frederick Bossuyt, Fabrice Axisa, Jan Vanfleteren, and Ingrid De Wolf. 2009. “In Situ Observations on Deformation Behavior and Stretching-induced Failure of Fine Pitch Stretchable Interconnect.” Journal of Materials Research 24 (12): 3573–3582.
APA
Hsu, Y.-Y., Gonzalez, M., Bossuyt, F., Axisa, F., Vanfleteren, J., & De Wolf, I. (2009). In situ observations on deformation behavior and stretching-induced failure of fine pitch stretchable interconnect. JOURNAL OF MATERIALS RESEARCH, 24(12), 3573–3582.
Vancouver
1.
Hsu Y-Y, Gonzalez M, Bossuyt F, Axisa F, Vanfleteren J, De Wolf I. In situ observations on deformation behavior and stretching-induced failure of fine pitch stretchable interconnect. JOURNAL OF MATERIALS RESEARCH. 2009;24(12):3573–82.
MLA
Hsu, Yung-Yu, Mario Gonzalez, Frederick Bossuyt, et al. “In Situ Observations on Deformation Behavior and Stretching-induced Failure of Fine Pitch Stretchable Interconnect.” JOURNAL OF MATERIALS RESEARCH 24.12 (2009): 3573–3582. Print.