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UTCP: a novel polyimide-based ultra-thin chip packaging technology

Wim Christiaens (UGent) , Erwin Bosman (UGent) and Jan Vanfleteren (UGent)
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Abstract
Flexible materials, today, are being used already as base substrates for electronic assembly. A lot of mounted components could be integrated in flexible polyimide (PI) substrates. Very interesting advantages of integrating components into the flex are compactness and enhanced flexibility; not only the interconnection but also the components themselves can be mechanically flexible. This paper describes a PI-based embedding technology for integrating very thin silicon chips in between two spin-on PI layers, the ultra-thin chip package (UTCP). This paper discusses the different process steps in the UTCP production and also presents the interconnection test results realized with this technology.
Keywords
flexible, thin chip, chip package, 3-D embedding

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Citation

Please use this url to cite or link to this publication:

Chicago
Christiaens, Wim, Erwin Bosman, and Jan Vanfleteren. 2010. “UTCP: a Novel Polyimide-based Ultra-thin Chip Packaging Technology.” Ieee Transactions on Components and Packaging Technologies 33 (4): 754–760.
APA
Christiaens, Wim, Bosman, E., & Vanfleteren, J. (2010). UTCP: a novel polyimide-based ultra-thin chip packaging technology. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 33(4), 754–760.
Vancouver
1.
Christiaens W, Bosman E, Vanfleteren J. UTCP: a novel polyimide-based ultra-thin chip packaging technology. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES. 2010;33(4):754–60.
MLA
Christiaens, Wim, Erwin Bosman, and Jan Vanfleteren. “UTCP: a Novel Polyimide-based Ultra-thin Chip Packaging Technology.” IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 33.4 (2010): 754–760. Print.
@article{1845267,
  abstract     = {Flexible materials, today, are being used already as base substrates for electronic assembly. A lot of mounted components could be integrated in flexible polyimide (PI) substrates. Very interesting advantages of integrating components into the flex are compactness and enhanced flexibility; not only the interconnection but also the components themselves can be mechanically flexible. This paper describes a PI-based embedding technology for integrating very thin silicon chips in between two spin-on PI layers, the ultra-thin chip package (UTCP). This paper discusses the different process steps in the UTCP production and also presents the interconnection test results realized with this technology.},
  author       = {Christiaens, Wim and Bosman, Erwin and Vanfleteren, Jan},
  issn         = {1521-3331},
  journal      = {IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES},
  language     = {eng},
  number       = {4},
  pages        = {754--760},
  title        = {UTCP: a novel polyimide-based ultra-thin chip packaging technology},
  url          = {http://dx.doi.org/10.1109/TCAPT.2010.2060198},
  volume       = {33},
  year         = {2010},
}

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