Academic Bibliography

 Search 200 years of publications by Ghent University researchers.
Advanced search
1 file | 1.71 MB
Add to list
  1. Search results
  2. Ultrathin optoelectronic device packa...

Ultrathin optoelectronic device packaging in flexible carriers

Erwin Bosman (UGent) , Jeroen Missinne (UGent) , Bram Van Hoe (UGent) , Geert Van Steenberge (UGent) , Sandeep Kalathimekkad (UGent) , Jurgen Van Erps, Ivaylo Milenkov, Krassimir Panajotov, Tim Van Gijseghem (UGent) , Peter Dubruel (UGent) , et al.
(2011) IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS. 17(3). p.617-628
Author
Organization
Project
Abstract
This paper presents the development of an advanced packaging technique for commercially available optoelectronic devices. Vertical Cavity Surface Emitting Laser diodes and Photodiodes are thinned down to 20 µm thickness, and are embedded in flexible carriers, resulting in a 75 µm thin package, which can be bent down to a bending radius of 2 mm. Electrical, optical and mechanical characterization addresses the influence of thinning and embedding of bare optoelectronic chips on their main properties. Next to the embedded optoelectronics, also electrical Integrated Circuits like amplifiers and drivers can be housed in the same thin flexible package, using an identical technology and layer build-up. Finally, this new packaging approach is demonstrated in two different integrated sensor applications and in an integrated optical interconnection. For the latter application, also waveguides and optical out-of-plane coupling elements are integrated in the package and the complete system reliability is assessed by accelerated aging tests.
Keywords
photodiode, thinning, packaging, flexible, Embedding, SU-8, INTERCONNECTIONS, vertical cavity surface-emitting laser (VCSEL)

Downloads

  • Download
    (...).pdf
    • full text
    • |
    • UGent only
    • |
    • PDF
    • |
    • 1.71 MB

Citation

Please use this url to cite or link to this publication:

MLA
Bosman, Erwin, et al. “Ultrathin Optoelectronic Device Packaging in Flexible Carriers.” IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, vol. 17, no. 3, 2011, pp. 617–28, doi:10.1109/JSTQE.2010.2096407.
APA
Bosman, E., Missinne, J., Van Hoe, B., Van Steenberge, G., Kalathimekkad, S., Van Erps, J., … Van Daele, P. (2011). Ultrathin optoelectronic device packaging in flexible carriers. IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, 17(3), 617–628. https://doi.org/10.1109/JSTQE.2010.2096407
Chicago author-date
Bosman, Erwin, Jeroen Missinne, Bram Van Hoe, Geert Van Steenberge, Sandeep Kalathimekkad, Jurgen Van Erps, Ivaylo Milenkov, et al. 2011. “Ultrathin Optoelectronic Device Packaging in Flexible Carriers.” IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS 17 (3): 617–28. https://doi.org/10.1109/JSTQE.2010.2096407.
Chicago author-date (all authors)
Bosman, Erwin, Jeroen Missinne, Bram Van Hoe, Geert Van Steenberge, Sandeep Kalathimekkad, Jurgen Van Erps, Ivaylo Milenkov, Krassimir Panajotov, Tim Van Gijseghem, Peter Dubruel, Hugo Thienpont, and Peter Van Daele. 2011. “Ultrathin Optoelectronic Device Packaging in Flexible Carriers.” IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS 17 (3): 617–628. doi:10.1109/JSTQE.2010.2096407.
Vancouver
1.
Bosman E, Missinne J, Van Hoe B, Van Steenberge G, Kalathimekkad S, Van Erps J, et al. Ultrathin optoelectronic device packaging in flexible carriers. IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS. 2011;17(3):617–28.
IEEE
[1]
E. Bosman et al., “Ultrathin optoelectronic device packaging in flexible carriers,” IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, vol. 17, no. 3, pp. 617–628, 2011.
@article{1845237,
  abstract     = {{This paper presents the development of an advanced packaging technique for commercially available optoelectronic devices. Vertical Cavity Surface Emitting Laser diodes and Photodiodes are thinned down to 20 µm thickness, and are embedded in flexible carriers, resulting in a 75 µm thin package, which can be bent down to a bending radius of 2 mm. Electrical, optical and mechanical characterization addresses the influence of thinning and embedding of bare optoelectronic chips on their main properties. Next to the embedded optoelectronics, also electrical Integrated Circuits like amplifiers and drivers can be housed in the same thin flexible package, using an identical technology and layer build-up. Finally, this new packaging approach is demonstrated in two different integrated sensor applications and in an integrated optical interconnection. For the latter application, also waveguides and optical out-of-plane coupling elements are integrated in the package and the complete system reliability is assessed by accelerated aging tests.}},
  author       = {{Bosman, Erwin and Missinne, Jeroen and Van Hoe, Bram and Van Steenberge, Geert and Kalathimekkad, Sandeep and Van Erps, Jurgen and Milenkov, Ivaylo and Panajotov, Krassimir and Van Gijseghem, Tim and Dubruel, Peter and Thienpont, Hugo and Van Daele, Peter}},
  issn         = {{1077-260X}},
  journal      = {{IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS}},
  keywords     = {{photodiode,thinning,packaging,flexible,Embedding,SU-8,INTERCONNECTIONS,vertical cavity surface-emitting laser (VCSEL)}},
  language     = {{eng}},
  number       = {{3}},
  pages        = {{617--628}},
  title        = {{Ultrathin optoelectronic device packaging in flexible carriers}},
  url          = {{http://doi.org/10.1109/JSTQE.2010.2096407}},
  volume       = {{17}},
  year         = {{2011}},
}
Altmetric
View in Altmetric
Web of Science
Times cited: