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Vacancies and vacancy-oxygen complexes in silicon: Positron annihilation with core electrons.

J KURIPLACH, AL MORALES, Charles Dauwe, Danny Segers and M SOB (1998) PHYSICAL REVIEW B-CONDENSED MATTER. 58(16). p.10475-10483
Please use this url to cite or link to this publication:
author
organization
year
type
journalArticle (original)
publication status
published
subject
journal title
PHYSICAL REVIEW B-CONDENSED MATTER
volume
58
issue
16
pages
10475-10483 pages
Web of Science type
Article
Web of Science id
000076716500065
ISSN
0163-1829
language
English
UGent publication?
yes
classification
A1
id
180554
handle
http://hdl.handle.net/1854/LU-180554
date created
2004-01-14 13:41:00
date last changed
2016-12-19 15:38:48
@article{180554,
  author       = {KURIPLACH, J and MORALES, AL and Dauwe, Charles and Segers, Danny and SOB, M},
  issn         = {0163-1829},
  journal      = {PHYSICAL REVIEW B-CONDENSED MATTER},
  language     = {eng},
  number       = {16},
  pages        = {10475--10483},
  title        = {Vacancies and vacancy-oxygen complexes in silicon: Positron annihilation with core electrons.},
  volume       = {58},
  year         = {1998},
}

Chicago
KURIPLACH, J, AL MORALES, Charles Dauwe, Danny Segers, and M SOB. 1998. “Vacancies and Vacancy-oxygen Complexes in Silicon: Positron Annihilation with Core Electrons.” Physical Review B-condensed Matter 58 (16): 10475–10483.
APA
KURIPLACH, J., MORALES, A., Dauwe, C., Segers, D., & SOB, M. (1998). Vacancies and vacancy-oxygen complexes in silicon: Positron annihilation with core electrons. PHYSICAL REVIEW B-CONDENSED MATTER, 58(16), 10475–10483.
Vancouver
1.
KURIPLACH J, MORALES A, Dauwe C, Segers D, SOB M. Vacancies and vacancy-oxygen complexes in silicon: Positron annihilation with core electrons. PHYSICAL REVIEW B-CONDENSED MATTER. 1998;58(16):10475–83.
MLA
KURIPLACH, J, AL MORALES, Charles Dauwe, et al. “Vacancies and Vacancy-oxygen Complexes in Silicon: Positron Annihilation with Core Electrons.” PHYSICAL REVIEW B-CONDENSED MATTER 58.16 (1998): 10475–10483. Print.