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Calculation of thermoelastic stresses in microelectronics.

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MLA
MATTHYS, L, Erwin De Baetselier, W DOBBELAERE, et al. “Calculation of Thermoelastic Stresses in Microelectronics.” MICROELECTRONICS AND RELIABILITY 38.3 (1998): 443–448. Print.
APA
MATTHYS, L., De Baetselier, E., DOBBELAERE, W., GOEDERTIER, W., & De Mey, G. (1998). Calculation of thermoelastic stresses in microelectronics. MICROELECTRONICS AND RELIABILITY, 38(3), 443–448.
Chicago author-date
MATTHYS, L, Erwin De Baetselier, W DOBBELAERE, W GOEDERTIER, and Gilbert De Mey. 1998. “Calculation of Thermoelastic Stresses in Microelectronics.” Microelectronics and Reliability 38 (3): 443–448.
Chicago author-date (all authors)
MATTHYS, L, Erwin De Baetselier, W DOBBELAERE, W GOEDERTIER, and Gilbert De Mey. 1998. “Calculation of Thermoelastic Stresses in Microelectronics.” Microelectronics and Reliability 38 (3): 443–448.
Vancouver
1.
MATTHYS L, De Baetselier E, DOBBELAERE W, GOEDERTIER W, De Mey G. Calculation of thermoelastic stresses in microelectronics. MICROELECTRONICS AND RELIABILITY. 1998;38(3):443–8.
IEEE
[1]
L. MATTHYS, E. De Baetselier, W. DOBBELAERE, W. GOEDERTIER, and G. De Mey, “Calculation of thermoelastic stresses in microelectronics.,” MICROELECTRONICS AND RELIABILITY, vol. 38, no. 3, pp. 443–448, 1998.
@article{177694,
  author       = {MATTHYS, L and De Baetselier, Erwin and DOBBELAERE, W and GOEDERTIER, W and De Mey, Gilbert},
  issn         = {0026-2714},
  journal      = {MICROELECTRONICS AND RELIABILITY},
  language     = {eng},
  number       = {3},
  pages        = {443--448},
  title        = {Calculation of thermoelastic stresses in microelectronics.},
  volume       = {38},
  year         = {1998},
}

Web of Science
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