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Stabilizer concentration and local environment: Their effects on electroless nickel plating of PCB micropads.

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Chicago
Zhang, Suixin, Johan De Baets, Maria Vereeken, Alfons Vervaet, and André Van Calster. 1999. “Stabilizer Concentration and Local Environment: Their Effects on Electroless Nickel Plating of PCB Micropads.” Journal of the Electrochemical Society 146 (8): 2870–2875.
APA
Zhang, Suixin, De Baets, J., Vereeken, M., Vervaet, A., & Van Calster, A. (1999). Stabilizer concentration and local environment: Their effects on electroless nickel plating of PCB micropads. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 146(8), 2870–2875.
Vancouver
1.
Zhang S, De Baets J, Vereeken M, Vervaet A, Van Calster A. Stabilizer concentration and local environment: Their effects on electroless nickel plating of PCB micropads. JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 1999;146(8):2870–5.
MLA
Zhang, Suixin, Johan De Baets, Maria Vereeken, et al. “Stabilizer Concentration and Local Environment: Their Effects on Electroless Nickel Plating of PCB Micropads.” JOURNAL OF THE ELECTROCHEMICAL SOCIETY 146.8 (1999): 2870–2875. Print.
@article{175570,
  author       = {Zhang, Suixin and De Baets, Johan and Vereeken, Maria and Vervaet, Alfons and Van Calster, Andr{\'e}},
  issn         = {0013-4651},
  journal      = {JOURNAL OF THE ELECTROCHEMICAL SOCIETY},
  language     = {eng},
  number       = {8},
  pages        = {2870--2875},
  title        = {Stabilizer concentration and local environment: Their effects on electroless nickel plating of PCB micropads.},
  volume       = {146},
  year         = {1999},
}

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