Stabilizer concentration and local environment: Their effects on electroless nickel plating of PCB micropads.
- Author
- Suixin Zhang, Johan De Baets (UGent) , Maria Vereeken, Alfons Vervaet (UGent) and André Van Calster (UGent)
- Organization
Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-175570
- MLA
- Zhang, Suixin, et al. “Stabilizer Concentration and Local Environment: Their Effects on Electroless Nickel Plating of PCB Micropads.” JOURNAL OF THE ELECTROCHEMICAL SOCIETY, vol. 146, no. 8, 1999, pp. 2870–75.
- APA
- Zhang, S., De Baets, J., Vereeken, M., Vervaet, A., & Van Calster, A. (1999). Stabilizer concentration and local environment: Their effects on electroless nickel plating of PCB micropads. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 146(8), 2870–2875.
- Chicago author-date
- Zhang, Suixin, Johan De Baets, Maria Vereeken, Alfons Vervaet, and André Van Calster. 1999. “Stabilizer Concentration and Local Environment: Their Effects on Electroless Nickel Plating of PCB Micropads.” JOURNAL OF THE ELECTROCHEMICAL SOCIETY 146 (8): 2870–75.
- Chicago author-date (all authors)
- Zhang, Suixin, Johan De Baets, Maria Vereeken, Alfons Vervaet, and André Van Calster. 1999. “Stabilizer Concentration and Local Environment: Their Effects on Electroless Nickel Plating of PCB Micropads.” JOURNAL OF THE ELECTROCHEMICAL SOCIETY 146 (8): 2870–2875.
- Vancouver
- 1.Zhang S, De Baets J, Vereeken M, Vervaet A, Van Calster A. Stabilizer concentration and local environment: Their effects on electroless nickel plating of PCB micropads. JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 1999;146(8):2870–5.
- IEEE
- [1]S. Zhang, J. De Baets, M. Vereeken, A. Vervaet, and A. Van Calster, “Stabilizer concentration and local environment: Their effects on electroless nickel plating of PCB micropads.,” JOURNAL OF THE ELECTROCHEMICAL SOCIETY, vol. 146, no. 8, pp. 2870–2875, 1999.
@article{175570,
author = {{Zhang, Suixin and De Baets, Johan and Vereeken, Maria and Vervaet, Alfons and Van Calster, André}},
issn = {{0013-4651}},
journal = {{JOURNAL OF THE ELECTROCHEMICAL SOCIETY}},
language = {{eng}},
number = {{8}},
pages = {{2870--2875}},
title = {{Stabilizer concentration and local environment: Their effects on electroless nickel plating of PCB micropads.}},
volume = {{146}},
year = {{1999}},
}