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Electro-conductive adhesives for high density package and flip-chip interconnections.

D WOJCIECHOWSKI, Jan Vanfleteren UGent, E REESE and HW HAGEDORN (2000) MICROELECTRONICS RELIABILITY. 40(7). p.1215-1226
Please use this url to cite or link to this publication:
author
organization
year
type
journalArticle (original)
publication status
published
subject
journal title
MICROELECTRONICS RELIABILITY
Microelectron. Reliab.
volume
40
issue
7
pages
1215-1226 pages
Web of Science type
Article
Web of Science id
000089044400017
ISSN
0026-2714
language
English
UGent publication?
yes
classification
A1
id
172378
handle
http://hdl.handle.net/1854/LU-172378
date created
2004-01-14 13:40:00
date last changed
2016-12-19 15:38:09
@article{172378,
  author       = {WOJCIECHOWSKI, D and Vanfleteren, Jan and REESE, E and HAGEDORN, HW},
  issn         = {0026-2714},
  journal      = {MICROELECTRONICS RELIABILITY},
  language     = {eng},
  number       = {7},
  pages        = {1215--1226},
  title        = {Electro-conductive adhesives for high density package and flip-chip interconnections.},
  volume       = {40},
  year         = {2000},
}

Chicago
WOJCIECHOWSKI, D, Jan Vanfleteren, E REESE, and HW HAGEDORN. 2000. “Electro-conductive Adhesives for High Density Package and Flip-chip Interconnections.” Microelectronics Reliability 40 (7): 1215–1226.
APA
WOJCIECHOWSKI, D., Vanfleteren, J., REESE, E., & HAGEDORN, H. (2000). Electro-conductive adhesives for high density package and flip-chip interconnections. MICROELECTRONICS RELIABILITY, 40(7), 1215–1226.
Vancouver
1.
WOJCIECHOWSKI D, Vanfleteren J, REESE E, HAGEDORN H. Electro-conductive adhesives for high density package and flip-chip interconnections. MICROELECTRONICS RELIABILITY. 2000;40(7):1215–26.
MLA
WOJCIECHOWSKI, D, Jan Vanfleteren, E REESE, et al. “Electro-conductive Adhesives for High Density Package and Flip-chip Interconnections.” MICROELECTRONICS RELIABILITY 40.7 (2000): 1215–1226. Print.