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Electro-conductive adhesives for high density package and flip-chip interconnections.

(2000) MICROELECTRONICS RELIABILITY. 40(7). p.1215-1226
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Chicago
WOJCIECHOWSKI, D, Jan Vanfleteren, E REESE, and HW HAGEDORN. 2000. “Electro-conductive Adhesives for High Density Package and Flip-chip Interconnections.” Microelectronics Reliability 40 (7): 1215–1226.
APA
WOJCIECHOWSKI, D., Vanfleteren, J., REESE, E., & HAGEDORN, H. (2000). Electro-conductive adhesives for high density package and flip-chip interconnections. MICROELECTRONICS RELIABILITY, 40(7), 1215–1226.
Vancouver
1.
WOJCIECHOWSKI D, Vanfleteren J, REESE E, HAGEDORN H. Electro-conductive adhesives for high density package and flip-chip interconnections. MICROELECTRONICS RELIABILITY. 2000;40(7):1215–26.
MLA
WOJCIECHOWSKI, D, Jan Vanfleteren, E REESE, et al. “Electro-conductive Adhesives for High Density Package and Flip-chip Interconnections.” MICROELECTRONICS RELIABILITY 40.7 (2000): 1215–1226. Print.
@article{172378,
  author       = {WOJCIECHOWSKI, D and Vanfleteren, Jan and REESE, E and HAGEDORN, HW},
  issn         = {0026-2714},
  journal      = {MICROELECTRONICS RELIABILITY},
  language     = {eng},
  number       = {7},
  pages        = {1215--1226},
  title        = {Electro-conductive adhesives for high density package and flip-chip interconnections.},
  volume       = {40},
  year         = {2000},
}

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