Advanced search

Inductance extraction for packages with adaptive non-orthogonal ground plane meshing.

Author
Organization

Citation

Please use this url to cite or link to this publication:

Chicago
Lippens, Gunther, and Daniël De Zutter. 2002. “Inductance Extraction for Packages with Adaptive Non-orthogonal Ground Plane Meshing.” Ieee Transactions on Advanced Packaging 25 (2): 223–229.
APA
Lippens, Gunther, & De Zutter, D. (2002). Inductance extraction for packages with adaptive non-orthogonal ground plane meshing. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 25(2), 223–229.
Vancouver
1.
Lippens G, De Zutter D. Inductance extraction for packages with adaptive non-orthogonal ground plane meshing. IEEE TRANSACTIONS ON ADVANCED PACKAGING. 2002;25(2):223–9.
MLA
Lippens, Gunther, and Daniël De Zutter. “Inductance Extraction for Packages with Adaptive Non-orthogonal Ground Plane Meshing.” IEEE TRANSACTIONS ON ADVANCED PACKAGING 25.2 (2002): 223–229. Print.
@article{166613,
  author       = {Lippens, Gunther and De Zutter, Dani{\"e}l},
  issn         = {1521-3323},
  journal      = {IEEE TRANSACTIONS ON ADVANCED PACKAGING},
  language     = {eng},
  number       = {2},
  pages        = {223--229},
  title        = {Inductance extraction for packages with adaptive non-orthogonal ground plane meshing.},
  volume       = {25},
  year         = {2002},
}

Web of Science
Times cited: