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Inductance extraction for packages with adaptive non-orthogonal ground plane meshing.

Gunther Lippens and Daniël De Zutter UGent (2002) IEEE TRANSACTIONS ON ADVANCED PACKAGING. 25(2). p.223-229
Please use this url to cite or link to this publication:
author
organization
year
type
journalArticle (original)
publication status
published
subject
journal title
IEEE TRANSACTIONS ON ADVANCED PACKAGING
IEEE Trans. Adv. Packag.
volume
25
issue
2
pages
223-229 pages
Web of Science type
Article
Web of Science id
000179446200013
JCR category
ENGINEERING, MANUFACTURING
JCR impact factor
0.947 (2002)
JCR rank
3/35 (2002)
JCR quartile
1 (2002)
ISSN
1521-3323
language
English
UGent publication?
yes
classification
A1
id
166613
handle
http://hdl.handle.net/1854/LU-166613
date created
2004-01-14 13:40:00
date last changed
2016-12-19 15:38:57
@article{166613,
  author       = {Lippens, Gunther and De Zutter, Dani{\"e}l},
  issn         = {1521-3323},
  journal      = {IEEE TRANSACTIONS ON ADVANCED PACKAGING},
  language     = {eng},
  number       = {2},
  pages        = {223--229},
  title        = {Inductance extraction for packages with adaptive non-orthogonal ground plane meshing.},
  volume       = {25},
  year         = {2002},
}

Chicago
Lippens, Gunther, and Daniël De Zutter. 2002. “Inductance Extraction for Packages with Adaptive Non-orthogonal Ground Plane Meshing.” Ieee Transactions on Advanced Packaging 25 (2): 223–229.
APA
Lippens, Gunther, & De Zutter, D. (2002). Inductance extraction for packages with adaptive non-orthogonal ground plane meshing. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 25(2), 223–229.
Vancouver
1.
Lippens G, De Zutter D. Inductance extraction for packages with adaptive non-orthogonal ground plane meshing. IEEE TRANSACTIONS ON ADVANCED PACKAGING. 2002;25(2):223–9.
MLA
Lippens, Gunther, and Daniël De Zutter. “Inductance Extraction for Packages with Adaptive Non-orthogonal Ground Plane Meshing.” IEEE TRANSACTIONS ON ADVANCED PACKAGING 25.2 (2002): 223–229. Print.