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Modeling complex via hole structures.

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MLA
Laermans, Eric, Jan De Geest, Daniël De Zutter, et al. “Modeling Complex via Hole Structures.” IEEE TRANSACTIONS ON ADVANCED PACKAGING 25.2 (2002): 206–214. Print.
APA
Laermans, E., De Geest, J., De Zutter, D., Olyslager, F., Sercu, S., & MORLION, D. (2002). Modeling complex via hole structures. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 25(2), 206–214.
Chicago author-date
Laermans, Eric, Jan De Geest, Daniël De Zutter, Femke Olyslager, Stefaan Sercu, and D MORLION. 2002. “Modeling Complex via Hole Structures.” Ieee Transactions on Advanced Packaging 25 (2): 206–214.
Chicago author-date (all authors)
Laermans, Eric, Jan De Geest, Daniël De Zutter, Femke Olyslager, Stefaan Sercu, and D MORLION. 2002. “Modeling Complex via Hole Structures.” Ieee Transactions on Advanced Packaging 25 (2): 206–214.
Vancouver
1.
Laermans E, De Geest J, De Zutter D, Olyslager F, Sercu S, MORLION D. Modeling complex via hole structures. IEEE TRANSACTIONS ON ADVANCED PACKAGING. 2002;25(2):206–14.
IEEE
[1]
E. Laermans, J. De Geest, D. De Zutter, F. Olyslager, S. Sercu, and D. MORLION, “Modeling complex via hole structures.,” IEEE TRANSACTIONS ON ADVANCED PACKAGING, vol. 25, no. 2, pp. 206–214, 2002.
@article{166609,
  author       = {Laermans, Eric and De Geest, Jan and De Zutter, Daniël and Olyslager, Femke and Sercu, Stefaan and MORLION, D},
  issn         = {1521-3323},
  journal      = {IEEE TRANSACTIONS ON ADVANCED PACKAGING},
  language     = {eng},
  number       = {2},
  pages        = {206--214},
  title        = {Modeling complex via hole structures.},
  volume       = {25},
  year         = {2002},
}

Web of Science
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