Advanced search
Author
Organization

Citation

Please use this url to cite or link to this publication:

Chicago
Vanfleteren, Jan, B VANDECASTEELE, Tomas Podprocky, and P JACOBS. 2001. “Low Temperatue Flip-chip Assembly for Biomedical Applications.” In Proceedings of the 13th European Microelectronics and Packaging Conference & Exhibition, Strasbourg (France), 2001, 213–216.
APA
Vanfleteren, Jan, VANDECASTEELE, B., Podprocky, T., & JACOBS, P. (2001). Low temperatue flip-chip assembly for biomedical applications. Proceedings of the 13th European Microelectronics and Packaging Conference & Exhibition, Strasbourg (France), 2001 (pp. 213–216).
Vancouver
1.
Vanfleteren J, VANDECASTEELE B, Podprocky T, JACOBS P. Low temperatue flip-chip assembly for biomedical applications. Proceedings of the 13th European Microelectronics and Packaging Conference & Exhibition, Strasbourg (France), 2001. 2001. p. 213–6.
MLA
Vanfleteren, Jan, B VANDECASTEELE, Tomas Podprocky, et al. “Low Temperatue Flip-chip Assembly for Biomedical Applications.” Proceedings of the 13th European Microelectronics and Packaging Conference & Exhibition, Strasbourg (France), 2001. 2001. 213–216. Print.
@inproceedings{144351,
  author       = {Vanfleteren, Jan and VANDECASTEELE, B and Podprocky, Tomas and JACOBS, P},
  booktitle    = {Proceedings of the 13th European Microelectronics and Packaging Conference & Exhibition, Strasbourg (France), 2001},
  language     = {eng},
  pages        = {213--216},
  title        = {Low temperatue flip-chip assembly for biomedical applications.},
  year         = {2001},
}