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Chicago
HARRIS, S, G PATRA, G SCHOLS, D MATHELIN, Dorina Corlatan, E RAEDSCHELDER, P DE LANGHE, and Johan De Baets. 2001. “Standard SMT Process for Flip-chip Assembly on FR4 Substrate.” In Proceedings of the Technical Conference (IPC SMEMA Council APEX), 2001, IP1-1 1 IP1-1 13.
APA
HARRIS, S., PATRA, G., SCHOLS, G., MATHELIN, D., Corlatan, D., RAEDSCHELDER, E., DE LANGHE, P., et al. (2001). Standard SMT process for flip-chip assembly on FR4 substrate. Proceedings of the technical conference (IPC SMEMA Council APEX), 2001, IP1-1 1 IP1-1 13.
Vancouver
1.
HARRIS S, PATRA G, SCHOLS G, MATHELIN D, Corlatan D, RAEDSCHELDER E, et al. Standard SMT process for flip-chip assembly on FR4 substrate. Proceedings of the technical conference (IPC SMEMA Council APEX), 2001, IP1-1 1 IP1-1 13. 2001.
MLA
HARRIS, S, G PATRA, G SCHOLS, et al. “Standard SMT Process for Flip-chip Assembly on FR4 Substrate.” Proceedings of the Technical Conference (IPC SMEMA Council APEX), 2001, IP1-1 1 IP1-1 13. 2001. Print.
@inproceedings{144205,
  author       = {HARRIS, S and PATRA, G and SCHOLS, G and MATHELIN, D and Corlatan, Dorina and RAEDSCHELDER, E and DE LANGHE, P and De Baets, Johan},
  booktitle    = {Proceedings of the technical conference (IPC SMEMA Council APEX), 2001, IP1-1 1 IP1-1 13},
  language     = {eng},
  title        = {Standard SMT process for flip-chip assembly on FR4 substrate},
  year         = {2001},
}